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5CEFA7U19I7N

Intel

5CEFA7U19I7N by Intel

The Intel 5CEFA7U19I7N is a FPGA with 149500 logic cells, 230 inputs/outputs, and operates at a max supply voltage of 1.13V. It is used in applications requiring high-speed data processing and complex algorithm implementations due to its advanced CMOS technology and programmable nature.

Median Price

$434.775

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Mouser Electronics

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DigiKey

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Verical

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Digiode

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Nova Conductors

Japan . 48 parts In-Stock

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Vyrian

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Chip Stock

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VNN

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Cyclops Electronics Ltd

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Martec Srl

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Touchstone Systems

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AZTECH Wire

Italy . 380 parts In-Stock

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MARBEL Systems

Belgium . 400 parts In-Stock

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Texas Native Microelectronics

USA . 869 parts In-Stock

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Kenton Components

USA . 1,527 parts In-Stock

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Aztec Data Supply Inc.

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Qasali Group International

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Modulus Dynamics

Lithuania . 918 parts In-Stock

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iBuyXS LLC

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Vigor

Singapore . 196 parts In-Stock

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Ampacity Inc.

Singapore . 95 parts In-Stock

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Semicontronic

India . 73 parts In-Stock

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Corphita

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Corohmni

South Africa . 48 parts In-Stock

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Continental Prestige Electronics

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Argo Parts USA

USA . 2,844 parts In-Stock

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Advanced Electronics

New Zealand . 36 parts In-Stock

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CPlus Electronics

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QUARKTWIN TECHNOLOGY LTD

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Microchip USA

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Lixinc

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Perfect Parts

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A-Z Elektronik GmbH

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Supply Digital

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Futuretech Components

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Kepictronics

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GreenTree Electronics

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Glotronic Ltd.

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Netroflash

USA . 100 parts In-Stock

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Overview

Experience top-tier performance and unparalleled flexibility with the 5CEFA7U19I7N by Intel. As a leading manufacturer in the industry, Intel's Field Programmable Gate Arrays (FPGA) are engineered for optimal efficiency and reliability. With 149,500 logic cells and 230 inputs/outputs, this FPGA offers limitless possibilities for customization and innovation. Whether you're designing cutting-edge electronics or enhancing existing systems, the 5CEFA7U19I7N delivers unmatched value and benefits to meet your unique needs. Elevate your projects to new heights with Intel's exceptional technology - the possibilities are endless.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy package body material offers good electrical insulation and thermal properties, making it a reliable choice for long-term use in various applications.

No. of Logic Cells: 149500

Large number of logic cells provide ample flexibility for complex designs and high-performance applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying the assembly process.

Maximum Supply Voltage: 1.13 V

Operating at a low maximum supply voltage helps in reducing power consumption and heat dissipation, leading to efficient performance.

Technology Used: CMOS

CMOS technology ensures low power consumption and high noise immunity, enhancing the overall reliability and efficiency of the FPGA.

No. of Inputs: 230

Having a large number of inputs allows for more connectivity options and enables the FPGA to interface with a wide range of external devices.

Package Shape: SQUARE

Square package shape provides a compact footprint, optimizing space utilization on the PCB.

Form Of Terminal: BALL

Ball terminals offer reliable electrical connections and facilitate easy soldering during PCB assembly.

Nominal Supply Voltage (V): 1.1

Operating at a stable nominal supply voltage ensures consistent performance and reliability of the FPGA.

Power Supplies (V): 1.1,1.2/3.3,2.5

Support for multiple power supply voltages provides flexibility in system design and compatibility with a variety of power sources.

No. of Terminals: 484

Having a high number of terminals offers ample connectivity options and facilitates a wide range of interfacing possibilities with other components.

Programmable IC Type: FIELD PROGRAMMABLE GATE ARRAY

Being a field programmable gate array allows for customization and reconfiguration of logic functions, making it versatile for different applications.

Package Style (Meter): GRID ARRAY, FINE PITCH

Grid array and fine pitch package style offers high density and fine pin spacing, enabling efficient routing and compact layout on the PCB.

Minimum Supply Voltage: 1.07 V

Operating at a low minimum supply voltage ensures compatibility with a wide range of power sources and enhances energy efficiency of the FPGA.

Pitch Of Terminal: 0.8 mm

Having a small pitch of terminals allows for high-density mounting and efficient use of PCB real estate.

Position Of Terminal: BOTTOM

Bottom-positioned terminals simplify PCB layout and routing, making it easier for integration into the overall system design.

Maximum Seated Height: 1.9 mm

Low maximum seated height allows for compact integration into tight spaces or slim profile applications.

Width: 19 mm

Compact width dimension enables efficient space utilization on the PCB and allows for versatile placement options in various designs.

No. of Outputs: 230

High number of outputs enables the FPGA to drive multiple external devices and execute complex logic functions effectively.

Length: 19 mm

Having a compact length dimension offers flexibility in PCB layout and allows for efficient use of available space in system design.

Technical Specifications

Field Programmable Gate Arrays (FPGA) 5CEFA7U19I7N attributes and parameters. Explore more Field Programmable Gate Arrays (FPGA) devices from Intel

IC Features

Programmable IC Type:

No. of Logic Cells:

149500

No. of Inputs:

230

No. of Outputs:

230

Technology:

CMOS

Sub-Category:

Field Programmable Gate Arrays

Power Characteristics

Nominal Supply Voltage:

1.1

Minimum Supply Voltage:

1.07 V

Maximum Supply Voltage:

1.13 V

Power Supplies:

1.1,1.2/3.3,2.5 V

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Surface Mountable:

Yes

Package Style:

Grid Array, Fine Pitch

Package Code:

Package Shape:

Length:

19 mm

Width:

19 mm

Maximum Seated Height:

1.9 mm

Package Equivalence Code:

BGA484,22X22,32

Terminal Characteristcs

Terminal Position:

Bottom

Terminal Style:

Terminal Pitch:

.8 mm

No. of Terminals:

484

Standards

JESD-30 Code:

S-PBGA-B484

Qualified:

No

Trade Compliance

5CEFA7U19I7N Programmable ICs trade compliance attributes, and parameters.

ECCN

3A991

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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