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IS62WV2568EBLL-45HLI

Integrated Silicon Solution

IS62WV2568EBLL-45HLI by Integrated Silicon Solution

IS62WV2568EBLL-45HLI by Integrated Silicon Solution is an 256Kx8 SRAM with a max access time of 45ns. Operating at 3V, it features a parallel interface and industrial temperature grade suitable for various memory applications. The package style is small outline, thin profile, making it ideal for space-constrained designs.

Median Price

$3.700

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 234 parts In-Stock

1+ parts

$3.700

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234

$3.700

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$2.464

100+ parts

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100

$2.464

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Vyrian

USA . 7,464 parts In-Stock

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7,464

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AZTECH Wire

Italy . 793 parts In-Stock

1+ parts

$5.663

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793

$5.663

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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Bastille Electronics

Australia . 300 parts In-Stock

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300

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Overview

Elevate your electronic devices with the IS62WV2568EBLL-45HLI from Integrated Silicon Solution, a leading manufacturer of high-quality SRAM memory chips. Designed for optimal performance and reliability, this product is perfect for a wide range of applications in industrial settings. With its small outline, thin profile package style and asynchronous operating mode, this memory chip offers seamless integration and fast access times, ensuring efficient data processing. Trust ISS to deliver cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and reliable material for the package body, ensuring long-term performance and protection for the internal components.

Surface Mount: YES

Ease of installation and space-saving design for efficient PCB layout.

Operating Mode: ASYNCHRONOUS

Faster and flexible data access compared to synchronous operation, allowing for quicker response times.

Nominal Supply Voltage: 3V

Efficient power consumption at a standard voltage level for compatibility with various systems.

Maximum Operating Temperature: 85°C

Suitable for industrial applications with the ability to withstand higher temperatures for extended periods.

Memory IC Type: STANDARD SRAM

Reliable and widely-used memory technology for fast access and data retention in various applications.

Technical Specifications

SRAM IS62WV2568EBLL-45HLI attributes and parameters. Explore more SRAM devices from Integrated Silicon Solution

Specs

Maximum Access Time:

45 ns

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Memory Density:

2097152 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

No. of Words:

262144 words

No. of Words Code:

256K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

256KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.2 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

10

Trade Compliance

IS62WV2568EBLL-45HLI Memory ICs trade compliance attributes, and parameters.

ECCN

3A991.B.2.A

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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