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IS62WV1288BLL-55HLI

Integrated Silicon Solution

IS62WV1288BLL-55HLI by Integrated Silicon Solution

IS62WV1288BLL-55HLI by Integrated Silicon Solution is a 128Kx8 SRAM with 3.6V max supply voltage, 55ns access time, and operates in industrial temperature range. It features common I/O type, 3-state output characteristics, and parallel technology. Ideal for applications requiring fast and reliable memory storage in harsh environments.

Median Price

$2.310

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 468 parts In-Stock

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$2.300

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$1.980

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468

$2.300

$1.980

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DigiKey

USA . 724 parts In-Stock

1+ parts

$2.310

100+ parts

$2.054

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$1.875

10k+ parts

$1.743

724

$2.310

$2.054

$1.875

$1.743

Mouser Electronics

USA . 486 parts In-Stock

1+ parts

$2.310

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$2.000

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$2.310

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Master Electronics

USA . 107 parts In-Stock

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$6.520

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EBV Elektronik

Germany . 234 parts In-Stock

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Arrow

USA . 52 parts In-Stock

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$1.739

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$1.612

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$1.519

52

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$1.612

$1.519

Verical

USA . 52 parts In-Stock

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DF Sales Co.

USA . 48 parts In-Stock

1+ parts

$1.190

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48

$1.190

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DF Sales Co.

USA . 48 parts In-Stock

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$1.190

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48

$1.190

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Nova Conductors

Japan . 50 parts In-Stock

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$1.676

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50

$1.676

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TME

Poland . 176 parts In-Stock

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$1.790

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Chip Stock

USA . 17,410 parts In-Stock

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Infinite Electronics LLP

India . 743 parts In-Stock

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Vyrian

USA . 437 parts In-Stock

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Dan-Mar Components

USA . 234 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 96 parts In-Stock

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Pegasus Components GmbH

Germany . 94 parts In-Stock

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R&J Components

USA . 47 parts In-Stock

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Cyclops Electronics Ltd

UK . 31 parts In-Stock

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Bristol Electronics

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Semi Source

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 63 parts In-Stock

1+ parts

$5.660

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63

$5.660

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$6.045

100+ parts

$5.501

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$4.957

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$6.045

$5.501

$4.957

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RC Electronics

USA . 46,000 parts In-Stock

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Perfect Parts

USA . 10,713 parts In-Stock

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S.R.D Solutions

India . 2,500 parts In-Stock

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Lixinc

USA . 1,007 parts In-Stock

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Kepictronics

USA . 380 parts In-Stock

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Eastek

USA . 234 parts In-Stock

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$2.020

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Cyclops Electronics Ltd (Excess)

UK . 184 parts In-Stock

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ChipstoGo Electronic ltd

UK . 69 parts In-Stock

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Netroflash

USA . 50 parts In-Stock

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$1.642

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$1.592

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$1.558

50

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$1.642

$1.592

$1.558

Overview

Unlock the power of high-quality SRAM technology with the IS62WV1288BLL-55HLI by Integrated Silicon Solution. Designed for industrial applications, this versatile memory chip offers lightning-fast access times of 55 ns, ensuring seamless performance even in the most demanding environments. With a compact design and low power consumption, this chip is a cost-effective solution that delivers reliable results every time. Trust in the reputation of Integrated Silicon Solution, a leading manufacturer known for their cutting-edge technology and innovative solutions. Upgrade your systems with the IS62WV1288BLL-55HLI and experience the difference in performance and efficiency.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the components inside.

Surface Mount: YES

Allows for easy installation on circuit boards.

Operating Mode: ASYNCHRONOUS

Offers flexibility in data transmission.

Nominal Supply Voltage / Vsup (V): 3

Compatible with common power supply systems.

Output Characteristics: 3-STATE

Allows for high-speed data transfer.

Minimum Operating Temperature: -40 °C

Can handle a wide range of operating environments.

Peak Reflow Temperature °C: 260

Can withstand high-temperature soldering processes.

No. of Words: 131072 words

Provides ample memory storage capacity.

Memory Width: 8

Suitable for storing and retrieving data efficiently.

Maximum Access Time: 55 ns

Ensures fast data access for efficient performance.

Technical Specifications

SRAM IS62WV1288BLL-55HLI attributes and parameters. Explore more SRAM devices from Integrated Silicon Solution

Specs

Maximum Access Time:

55 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

11.8 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP32,.56,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3/3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.25 mm

Maximum Standby Current:

.000005 Amp

Minimum Standby Voltage:

1.2 V

Sub-Category:

SRAMs

Maximum Supply Current:

15 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

8 mm

Trade Compliance

IS62WV1288BLL-55HLI Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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