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IS62WV1288BLL-55HLI-TR

Integrated Silicon Solution

IS62WV1288BLL-55HLI-TR by Integrated Silicon Solution

IS62WV1288BLL-55HLI-TR by Integrated Silicon Solution is a 128Kx8 SRAM with 55ns access time. Operating at 3V, it's ideal for industrial applications requiring fast and reliable memory storage. With a compact size of 11.8mm x 8mm and low power consumption, it's suitable for various embedded systems.

Median Price

$1.133

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 2 parts In-Stock

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$1.133

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2

$1.133

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Nova Conductors

Japan . 41 parts In-Stock

1+ parts

$1.503

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41

$1.503

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Chip Stock

USA . 17,400 parts In-Stock

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Vyrian

USA . 3,593 parts In-Stock

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Continental Prestige Electronics

USA . 6,969 parts In-Stock

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$1.503

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$1.472

6,969

$1.503

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$1.472

Argo Parts USA

USA . 3,731 parts In-Stock

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$1.503

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$1.503

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Netroflash

USA . 100 parts In-Stock

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$1.503

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$1.427

10k+ parts

$1.397

100

$1.503

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$1.427

$1.397

Aztec Data Supply Inc.

USA . 4,141 parts In-Stock

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$2.220

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$2.220

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Corohmni

South Africa . 151 parts In-Stock

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$3.303

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AZTECH Wire

Italy . 391 parts In-Stock

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$8.474

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QUARKTWIN TECHNOLOGY LTD

USA . 11,300 parts In-Stock

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Eastek

USA . 2,000 parts In-Stock

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$2.020

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GreenTree Electronics

Israel . 2,000 parts In-Stock

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Perfect Parts

USA . 524 parts In-Stock

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Metaverse IC Inc.

Canada . 180 parts In-Stock

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Overview

Unlock unparalleled performance and reliability with the IS62WV1288BLL-55HLI-TR by Integrated Silicon Solution. As a leading manufacturer of SRAM technology, ISS delivers cutting-edge solutions for a wide range of applications. Experience seamless operation in industrial settings with a nominal supply voltage of 3V and a maximum operating temperature of 85°C. With a memory density of 1048576 bits and a lightning-fast access time of 55ns, this small outline, thin profile package offers unmatched value and efficiency. Trust ISS to elevate your projects to new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material makes the package lightweight and durable, ensuring the product can withstand various environmental conditions.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, reducing overall costs and simplifying the manufacturing process.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexible and independent read and write operations, increasing overall performance and efficiency.

Nominal Supply Voltage / Vsup (V): 3

Operating at a nominal supply voltage of 3V ensures compatibility with a wide range of systems and devices.

No. of Terminals: 32

Having 32 terminals provides a sufficient number of connection points for interfacing with other components, making integration easier.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85°C, this product can function reliably in high-temperature environments without degradation in performance.

Organization: 128KX8

Organized as 128Kx8, this product offers a good balance between memory capacity and data width, making it suitable for a variety of applications.

Minimum Operating Temperature: -40 °C

The ability to operate at temperatures as low as -40°C ensures reliable performance even in extremely cold conditions.

Terminal Finish: MATTE TIN

Matte Tin terminal finish provides excellent solderability and corrosion resistance, ensuring reliable electrical connections.

Maximum Supply Voltage (Vsup): 3.6 V

With a maximum supply voltage of 3.6V, this product offers a level of voltage protection, preventing damage from overvoltage conditions.

Memory IC Type: STANDARD SRAM

Being a standard SRAM memory IC, this product offers fast access times and low power consumption, making it suitable for a wide range of applications.

Maximum Access Time: 55 ns

With a maximum access time of 55ns, this product provides quick read and write operations, enhancing overall system performance.

Technical Specifications

SRAM IS62WV1288BLL-55HLI-TR attributes and parameters. Explore more SRAM devices from Integrated Silicon Solution

Specs

Maximum Access Time:

55 ns

JESD-30 Code:

R-PDSO-G32

JESD-609 Code:

e3

Length:

11.8 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

128KX8

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

1.25 mm

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

2.5 V

Nominal Supply Voltage / Vsup (V):

3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width:

8 mm

Trade Compliance

IS62WV1288BLL-55HLI-TR Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.41

SB

8542.32.00.40

Manufacturer Highlights

Integrated Silicon Solution

ISSI is a technology leader that designs, develops, and markets high performance integrated circuits for the following key markets: (i) automotive, (ii) industrial and medical, (iii) communications/enterprise, and (iv) digital consumer. Our primary products are high speed and low power SRAM and low and medium density DRAM, NOR/NAND Flash, and eMMC products. We target these key markets with our cost-effective, high-quality semiconductor products and seek to build long-term relationships with our customers. We have been a committed long-term supplier of memory products, including lower density and smaller volume products, even during periods of tight manufacturing capacity. Our outsourced manufacturing model is based upon a history of joint technology development relationships with key foundries. We also make strategic equity purchases in selected foundries. We have expanded our presence in important markets by adding to design groups in US, China, Korea and Taiwan, and investing in applications engineering and technical support in closer proximity to end customers. These groups complement our core engineering and product management teams located in our Silicon Valley Headquarters in California. In recent years, the need for sophisticated semiconductor memory has expanded beyond the personal computer market and into the automotive, communications, digital consumer, industrial and medical markets. Increased memory content is required in these products in order to help process large amounts of data.

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