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TLE9251SJXUMA1

Infineon Technologies

TLE9251SJXUMA1 by Infineon Technologies

TLE9251SJXUMA1 by Infineon Technologies is a CAN FD transceiver with 1 function and a data rate of 5 Mbps. It operates at temperatures ranging from -40 to 150°C and has a small outline package style, making it suitable for automotive applications.

Median Price

$0.939

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Verical

USA . 10,000 parts In-Stock

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-

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$0.939

10,000

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$0.939

Distributors (In-Stock)

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Vyrian

USA . 2,932 parts In-Stock

1+ parts

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2,932

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Nova Conductors

Japan . 200 parts In-Stock

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200

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Digiode

USA . 123 parts In-Stock

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123

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Distributors (Availability)

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Ampacity Inc.

Singapore . 9,898 parts In-Stock

1+ parts

$0.800

100+ parts

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9,898

$0.800

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Microchip USA

USA . 1,698 parts In-Stock

1+ parts

$4.792

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1,698

$4.792

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Component Stockers USA

USA . 13,694 parts In-Stock

1+ parts

$9.060

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13,694

$9.060

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AZTECH Wire

Italy . 521 parts In-Stock

1+ parts

$9.110

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521

$9.110

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Modulus Dynamics

Lithuania . 3,395 parts In-Stock

1+ parts

$10.990

100+ parts

$10.550

1k+ parts

$10.111

10k+ parts

-

3,395

$10.990

$10.550

$10.111

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Aranea Global

USA . 100 parts In-Stock

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100

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Corphita

USA . 98 parts In-Stock

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98

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Overview

Discover the TLE9251SJXUMA1 from Infineon Technologies, a high-quality CAN FD transceiver that revolutionizes network interfaces. As a leading manufacturer, Infineon delivers unmatched reliability and innovation in every product. Designed with advanced technology, this small outline package offers exceptional performance and versatility. With a wide range of applications, the TLE9251SJXUMA1 is perfect for automotive, industrial, and telecommunications industries. Experience seamless connectivity, enhanced efficiency, and unparalleled value with this impressive transceiver. Upgrade your systems today and unlock a world of possibilities with Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body ensures durability and reliability, making it suitable for various environmental conditions.

Surface Mount: YES

The surface mount capability enables easy and convenient installation, saving valuable space on the circuit board.

No. of Functions: 1

This product offers a single function, simplifying circuit design and reducing overall complexity.

Screening Level: AEC-Q100

The AEC-Q100 screening level ensures high-quality and reliable performance, making it ideal for automotive applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient PCB layout and compatibility with standard production processes.

No. of Terminals: 8

With 8 terminals, this network interface provides sufficient connectivity options for seamless integration into various systems.

Package Style (Meter): SMALL OUTLINE

The small outline package style facilitates easy handling, placement, and replacement of the network interface.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures the product's reliability and enables its use in demanding environments.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the network interface to function effectively even in extremely cold conditions.

Terminal Finish: NICKEL GOLD PALLADIUM

The use of nickel, gold, and palladium terminal finish enhances conductivity and provides excellent corrosion resistance for long-term performance.

Terminal Position: DUAL

The terminal position being dual allows for flexible circuit board layout options, enabling efficient integration into various system designs.

Maximum Seated Height: 1.73 mm

With a low maximum seated height, this network interface contributes to compact and space-efficient device designs.

Width: 3.94 mm

The narrow width of this network interface allows for efficient space utilization on the circuit board.

Length: 4.93 mm

The compact length of this network interface contributes to the overall space-saving and compactness of the device.

Terminal Form: GULL WING

The gull wing terminal form ensures easy and reliable soldering, enhancing the product's overall performance and durability.

No. of Transceivers: 1

With a single transceiver, this network interface provides a cost-effective solution while maintaining reliable communication capabilities.

Maximum Supply Current: 48 mA

The low maximum supply current ensures efficient power utilization and helps in reducing overall power consumption.

Telecom IC Type: CAN FD TRANSCEIVER

The telecom IC type being CAN FD transceiver offers high-speed communication and compatibility with the CAN FD protocol, making it suitable for automotive and industrial applications.

Nominal Supply Voltage: 5 V

The nominal supply voltage of 5V provides compatibility with common power supply configurations, simplifying integration into various systems.

Terminal Pitch: 1.27 mm

The terminal pitch of 1.27 mm allows for easy and precise connection to the circuit board, ensuring reliable signal transmission.

Data Rate: 5 Mbps

With a data rate of 5 Mbps, this network interface supports high-speed data communication, enabling efficient transfer of large volumes of data.

Moisture Sensitivity Level (MSL): 2A

The moisture sensitivity level of 2A ensures that the product is adequately protected against moisture during handling and storage, contributing to its overall reliability.

Technical Specifications

Network Interfaces TLE9251SJXUMA1 attributes and parameters. Explore more Network Interfaces devices from Infineon Technologies

Specs

Data Rate:

5 Mbps

JESD-30 Code:

R-PDSO-G8

Length:

4.93 mm

Moisture Sensitivity Level (MSL):

2A

No. of Functions:

1

No. of Terminals:

8

No. of Transceivers:

1

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP8,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Screening Level:

AEC-Q100

Maximum Seated Height:

1.73 mm

Maximum Supply Current:

48 mA

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Telecom IC Type:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.94 mm

Trade Compliance

TLE9251SJXUMA1 Telecommunications trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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