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SPA11N65C3

Infineon Technologies

SPA11N65C3 by Infineon Technologies

SPA11N65C3 by Infineon is a N-CHANNEL FET with 650V DS breakdown voltage and 33A IDM. Ideal for switching applications, it has a built-in diode, 0.38 ohm RDS(on), and operates in enhancement mode. With 340mJ EAS rating, it can handle up to 33W power dissipation at max temp of 150°C.

Median Price

$5.880

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 355 parts In-Stock

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$5.880

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$3.210

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$5.880

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Digiode

USA . 448 parts In-Stock

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$5.586

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$5.586

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Fibra_Brandt Electronic GMBH

Germany . 1,000 parts In-Stock

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Nova Conductors

Japan . 800 parts In-Stock

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Odintec Ltd.

Israel . 500 parts In-Stock

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Electronics Depot

USA . 147 parts In-Stock

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Vyrian

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LIBRA Elektronik GmbH

Germany . 35 parts In-Stock

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 25,175 parts In-Stock

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$0.465

100+ parts

$0.446

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$0.428

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$0.465

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$0.428

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Ampacity Inc.

Singapore . 271 parts In-Stock

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$5.000

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Corphita

USA . 882 parts In-Stock

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$5.292

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AZTECH Wire

Italy . 214 parts In-Stock

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$13.589

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Kepictronics

USA . 10,026 parts In-Stock

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Perfect Parts

USA . 5,753 parts In-Stock

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Argo Parts USA

USA . 4,746 parts In-Stock

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Continental Prestige Electronics

USA . 3,568 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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GreenTree Electronics

Israel . 355 parts In-Stock

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Bastille Electronics

Australia . 75 parts In-Stock

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Overview

Experience the power of Infineon Technologies with the SPA11N65C3 Power Field Effect Transistor. This N-CHANNEL transistor offers unparalleled performance in switching applications, providing a breakthrough in efficiency and reliability. With its high DS breakdown voltage of 650V and maximum drain current of 11A, this transistor is ideal for demanding tasks. Whether you're powering up industrial machinery or enhancing automotive systems, the SPA11N65C3 delivers unmatched quality and value that will exceed your expectations. Trust in Infineon's expertise and elevate your projects to new heights with this cutting-edge component.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency compared to P-channel FETs, making them ideal for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient current flow and protection against reverse voltage spikes in switching applications.

Transistor Application: SWITCHING

Designed for high-speed switching applications, making it suitable for power control and conversion circuits.

Minimum DS Breakdown Voltage: 650 V

Can handle high voltage applications, providing a wide margin of safety for the circuit.

Maximum Pulsed Drain Current (IDM): 33 A

Capable of handling high current pulses, making it suitable for applications requiring high power output.

Maximum Drain Current (ID): 11 A

Can handle continuous high current, ensuring reliable performance in power circuitry.

Maximum Power Dissipation (Abs): 33 W

Can dissipate a significant amount of power without overheating, allowing for continuous operation under heavy loads.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures, suitable for applications where heat dissipation is a concern.

Maximum Drain-Source On Resistance: 0.38 ohm

Low on-resistance reduces power loss and improves efficiency in power switching applications.

Technical Specifications

Power Field Effect Transistors (FET) SPA11N65C3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

340 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

11 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.38 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

33 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPA11N65C3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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