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SPA11N65C3XK

Infineon Technologies

SPA11N65C3XK by Infineon Technologies

Infineon's SPA11N65C3XK is a N-CHANNEL FET with 650V DS breakdown voltage, ideal for switching applications. It features 11A max drain current and 0.38 ohm max on resistance. With a package style of flange mount, it operates in enhancement mode at up to 150°C.

Median Price

$1.920

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 170 parts In-Stock

1+ parts

$1.920

100+ parts

$1.810

1k+ parts

$1.640

10k+ parts

-

170

$1.920

$1.810

$1.640

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$1.820

100+ parts

-

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50

$1.820

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Digiode

USA . 207 parts In-Stock

1+ parts

$1.824

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207

$1.824

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Vyrian

USA . 101 parts In-Stock

1+ parts

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101

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 10,399 parts In-Stock

1+ parts

$0.882

100+ parts

$0.847

1k+ parts

$0.811

10k+ parts

-

10,399

$0.882

$0.847

$0.811

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Corphita

USA . 22 parts In-Stock

1+ parts

$1.728

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-

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22

$1.728

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Continental Prestige Electronics

USA . 2,036 parts In-Stock

1+ parts

$1.820

100+ parts

-

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10k+ parts

$1.784

2,036

$1.820

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-

$1.784

Argo Parts USA

USA . 1,902 parts In-Stock

1+ parts

$1.820

100+ parts

-

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1,902

$1.820

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Ampacity Inc.

Singapore . 164 parts In-Stock

1+ parts

$3.550

100+ parts

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164

$3.550

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AZTECH Wire

Italy . 315 parts In-Stock

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$17.335

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315

$17.335

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Microchip USA

USA . 6,349 parts In-Stock

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6,349

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Overview

Discover the power and reliability of the SPA11N65C3XK by Infineon Technologies, a top-tier manufacturer in the industry. This N-CHANNEL Power Field Effect Transistor (FET) offers unparalleled performance for switching applications, with a high DS Breakdown Voltage of 650V and a maximum Drain Current of 11A. Its robust design ensures long-lasting durability, making it ideal for a wide range of industrial and automotive uses. Trust in the quality and innovation of Infineon Technologies to take your projects to the next level with the SPA11N65C3XK.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, making it ideal for switching applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors are known for their high efficiency and fast switching speeds, making this transistor perfect for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and enhances overall performance in switching applications.

Transistor Application: SWITCHING

Specifically designed for switching applications, this transistor offers reliable and efficient performance.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this transistor can handle high voltage levels without breakdown, ensuring long-term reliability in the circuit.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and installation in various electronic devices and circuit boards.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and make soldering easier, ensuring a reliable electrical connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control of the switching operation, enhancing performance and efficiency.

Maximum Pulsed Drain Current (IDM): 33 A

The high pulsed drain current allows for reliable handling of sudden spikes in current, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 340 mJ

With a high avalanche energy rating, this transistor can withstand high-energy spikes, ensuring long-term reliability in harsh environments.

No. of Terminals: 3

The three terminals provide easy connections and flexibility in circuit design, making it a versatile choice for various applications.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for easy mounting and heat dissipation, ideal for applications requiring efficient thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

This technology offers high efficiency and low power consumption, making it a cost-effective choice for power applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this transistor can perform reliably in high-temperature environments.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability, making them a popular choice for various electronic applications.

Maximum Drain Current (ID): 11 A

With a high maximum drain current, this transistor can handle significant power loads, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.38 ohm

The low drain-source resistance minimizes power loss and heat generation, ensuring efficient operation in switching applications.

Terminal Position: SINGLE

The single terminal position simplifies circuit layout and connections, making installation easier and more convenient.

Case Connection: ISOLATED

The isolated case connection prevents electrical interference and enhances safety, making it a reliable choice for sensitive electronic systems.

Technical Specifications

Power Field Effect Transistors (FET) SPA11N65C3XK attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

340 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.38 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

33 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPA11N65C3XK Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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