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SPA15N60CFDXKSA1

Infineon Technologies

SPA15N60CFDXKSA1 by Infineon Technologies

SPA15N60CFDXKSA1 by Infineon is a N-CHANNEL FET with 600V DS breakdown voltage, 33A IDM, and 0.33 ohm max RDS(on). Ideal for switching applications, it operates in enhancement mode with a max temperature of 150°C. The transistor features a built-in diode and offers an EAS rating of 460mJ.

Median Price

$2.630

Lifecycle Status

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1k+

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Chip1Stop

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$4.190

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$2.550

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$2.110

10k+ parts

$1.970

471

$4.190

$2.550

$2.110

$1.970

Verical

USA . 471 parts In-Stock

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-

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$2.630

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$2.460

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471

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$2.630

$2.460

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Rochester

USA . 27 parts In-Stock

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$1.420

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$1.270

10k+ parts

$1.190

27

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$1.420

$1.270

$1.190

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Digiode

USA . 586 parts In-Stock

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Vyrian

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Chip Stock

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Nova Conductors

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500

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Aztec Data Supply Inc.

USA . 1,417 parts In-Stock

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$0.640

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Ampacity Inc.

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$1.160

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323

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Semicontronic

India . 286 parts In-Stock

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$1.131

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$1.125

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286

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Corphita

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Modulus Dynamics

Lithuania . 4,156 parts In-Stock

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$3.351

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$3.217

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$3.083

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Overview

Elevate your power system with the SPA15N60CFDXKSA1 by Infineon Technologies. Crafted with precision and expertise, this Power Field Effect Transistor (FET) offers reliable performance in switching applications. With a high DS Breakdown Voltage of 600V and maximum Drain Current of 13.4A, this N-Channel transistor is built to handle the toughest tasks. Its single configuration with a built-in diode ensures seamless operation, while the Metal-Oxide Semiconductor technology guarantees efficiency. Trust in the quality of Infineon Technologies and experience the unmatched value and benefits that the SPA15N60CFDXKSA1 brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy provides durability and protection for the FET, making it suitable for various environments and applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher efficiency compared to P-channel FETs, making them a good choice for power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the FET from voltage spikes and reverse polarity, enhancing reliability and performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low power dissipation, making it suitable for various power control systems.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high voltage levels, making it suitable for high-power applications where voltage spikes may occur.

Package Shape: RECTANGULAR

The rectangular package shape provides easy mounting and installation, making it convenient for use in various electronic devices and systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer strong mechanical connections and ease of soldering, ensuring reliable performance in harsh environments or applications with vibration.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode allows for precise control of the FET's conductivity, making it ideal for applications that require accurate power management and switching.

Maximum Pulsed Drain Current (IDM): 33 A

With a high pulsed drain current rating, this FET can handle short-term high current demands, making it suitable for applications that require reliable power handling capabilities.

Avalanche Energy Rating (EAS): 460 mJ

The high avalanche energy rating indicates the FET's ability to withstand voltage spikes and breakdown conditions, ensuring long-term reliability in challenging operating environments.

No. of Terminals: 3

Having 3 terminals allows for easy connection and integration into electronic circuits, providing flexibility in design and application.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides secure mounting and heat dissipation capabilities, making it suitable for high-power applications that require efficient thermal management.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor FETs offer high efficiency and fast switching speeds, making them ideal for power control applications where performance and reliability are crucial.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can operate reliably in high-temperature environments without compromising performance or lifespan.

Transistor Element Material: SILICON

Silicon-based transistors offer high temperature tolerance and reliability, ensuring stable performance over a wide range of operating conditions.

Terminal Finish: TIN

The use of tin terminal finish provides corrosion resistance and ensures reliable electrical connections, extending the FET's lifespan and performance.

Maximum Drain Current (ID): 13.4 A

With a high maximum drain current rating, this FET can handle continuous high current loads, making it suitable for power switching applications that require reliable performance.

Maximum Drain-Source On Resistance: 0.33 ohm

The low on-resistance of 0.33 ohm ensures efficient power transfer and low heat dissipation, making the FET suitable for high-power applications that require minimal power loss.

Terminal Position: SINGLE

Having a single terminal position simplifies circuit design and ensures correct polarity, making it easy to integrate this FET into electronic systems and devices.

Case Connection: ISOLATED

The isolated case connection prevents electrical interference and improves safety in the circuit, making it suitable for applications that require reliable and secure power control.

Technical Specifications

Power Field Effect Transistors (FET) SPA15N60CFDXKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

460 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

13.4 A

Maximum Drain-Source On Resistance:

.33 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

33 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPA15N60CFDXKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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