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SPA16N50C3XK

Infineon Technologies

SPA16N50C3XK by Infineon Technologies

SPA16N50C3XK by Infineon Technologies is a power FET with a min DS breakdown voltage of 500V. It is an N-channel transistor used for switching applications, with a max pulsed drain current of 48A and a max operating temperature of 150°C.

Median Price

$2.517

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 72 parts In-Stock

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$2.517

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72

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Vyrian

USA . 1,089 parts In-Stock

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1,089

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Digiode

USA . 679 parts In-Stock

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679

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 5,451 parts In-Stock

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$0.962

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Corohmni

South Africa . 509 parts In-Stock

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$1.142

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509

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Modulus Dynamics

Lithuania . 21,544 parts In-Stock

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$1.215

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$1.166

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$1.118

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21,544

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Continental Prestige Electronics

USA . 6,029 parts In-Stock

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$2.517

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$2.466

6,029

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$2.466

Netroflash

USA . 2,000 parts In-Stock

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$2.517

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2,000

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Argo Parts USA

USA . 826 parts In-Stock

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$2.517

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826

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Ampacity Inc.

Singapore . 1,226 parts In-Stock

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$13.050

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AZTECH Wire

Italy . 614 parts In-Stock

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$15.799

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Corphita

USA . 587 parts In-Stock

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Overview

Looking for a reliable and high-quality power field effect transistor? Look no further than the SPA16N50C3XK by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies is renowned for their commitment to excellence and innovation. The SPA16N50C3XK offers a range of benefits and advantages, making it the perfect choice for your switching applications. With its impressive minimum DS breakdown voltage of 500V and maximum pulsed drain current of 48A, this transistor delivers exceptional performance and reliability. Its single configuration with a built-in diode ensures seamless operation, while the metal-oxide semiconductor technology guarantees efficient power management. Trust Infineon Technologies to provide you with the best-in-class power transistors that will take your applications to new heights.

Feature Benefit Bullets

Package Body Material:

PLASTIC/EPOXY - This material provides durability and protection for the power FET, making it a reliable choice for various applications.

Polarity or Channel Type:

N-CHANNEL - The N-channel configuration allows for efficient and reliable switching, making this power FET suitable for use in various electronic circuits.

Configuration:

SINGLE WITH BUILT-IN DIODE - The built-in diode simplifies circuit designs and improves overall performance, making this power FET an excellent choice for switching applications.

Transistor Application:

SWITCHING - Specifically designed for switching applications, this power FET ensures fast and precise control of current flows, making it ideal for a wide range of electronic devices.

Minimum DS Breakdown Voltage:

500 V - With a high breakdown voltage, this power FET can handle higher voltage levels, making it suitable for power supply and industrial applications where voltage spikes may occur.

Package Shape:

RECTANGULAR - The rectangular shape of the package allows for easy mounting and integration into various circuit boards, ensuring convenience and compatibility.

Terminal Form:

THROUGH-HOLE - The through-hole terminals provide secure and reliable connections, allowing for efficient power transfer and reducing the risk of loose connections or signal loss.

Operating Mode:

ENHANCEMENT MODE - The enhancement mode operation ensures low power consumption and high efficiency, making this power FET an energy-efficient choice for a wide range of applications.

No. of Elements:

1 - With a single element, this power FET offers simplicity and ease of use, making it suitable for both professional and DIY electronic projects.

Maximum Pulsed Drain Current (IDM):

48 A - The high pulsed drain current rating allows this power FET to handle surge currents effectively, ensuring reliability and stability in demanding applications.

Avalanche Energy Rating (EAS):

460 mJ - The high avalanche energy rating ensures robustness and protection against voltage spikes or transients, making this power FET a durable and reliable choice in challenging environments.

No. of Terminals:

3 - With three terminals, this power FET offers flexibility in circuit design, allowing for convenient connections and versatile usage in various applications.

Package Style (Meter):

FLANGE MOUNT - The flange mount package style provides secure mounting and efficient heat dissipation, ensuring optimal performance and reliability in high-power applications.

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR - Utilizing metal-oxide semiconductor technology, this power FET offers enhanced switching speed, lower power consumption, and improved overall performance, making it an excellent choice for demanding applications.

Maximum Operating Temperature:

150 °C - With a high maximum operating temperature, this power FET can withstand high-temperature environments, making it suitable for automotive, industrial, and other demanding applications.

Transistor Element Material:

SILICON - The silicon material used in the transistor element ensures excellent thermal conductivity and high breakdown voltage, contributing to the overall reliability and performance of this power FET.

Maximum Drain Current (ID):

16 A - The high maximum drain current rating allows this power FET to handle significant loads efficiently, making it suitable for power management and motor control applications.

Maximum Drain-Source On Resistance:

0.28 ohm - With a low drain-source on resistance, this power FET minimizes power losses and improves efficiency, making it an optimal choice for high-performance switching applications.

Terminal Position:

SINGLE - With a single terminal position, this power FET offers simplicity and ease of installation, ensuring convenient integration into various circuit designs.

Case Connection:

ISOLATED - The isolated case connection provides electrical isolation between the power FET and the mounting surface, ensuring enhanced safety and reducing the risk of electrical interference.

Technical Specifications

Power Field Effect Transistors (FET) SPA16N50C3XK attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

460 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (ID):

16 A

Maximum Drain-Source On Resistance:

.28 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

48 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPA16N50C3XK Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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