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SPA15N60C3XK

Infineon Technologies

SPA15N60C3XK by Infineon Technologies

Infineon's SPA15N60C3XK is a N-CHANNEL FET with 600V DS breakdown voltage, ideal for SWITCHING applications. Featuring 45A IDM and 0.28 ohm RDS(on), it operates in ENHANCEMENT MODE at up to 150°C. The PLASTIC/EPOXY package with BUILT-IN DIODE makes it suitable for various power electronics designs.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 951 parts In-Stock

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Digiode

USA . 555 parts In-Stock

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Nova Conductors

Japan . 500 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,528 parts In-Stock

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$1.410

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$1.410

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Modulus Dynamics

Lithuania . 930 parts In-Stock

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$1.773

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$1.702

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$1.631

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930

$1.773

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$1.631

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Corohmni

South Africa . 162 parts In-Stock

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$1.872

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AZTECH Wire

Italy . 879 parts In-Stock

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$8.147

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Ampacity Inc.

Singapore . 789 parts In-Stock

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$55.050

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Argo Parts USA

USA . 3,274 parts In-Stock

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Corphita

USA . 834 parts In-Stock

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Continental Prestige Electronics

USA . 564 parts In-Stock

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Aranea Global

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Overview

Experience unparalleled performance and reliability with the SPA15N60C3XK by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch power field effect transistors that are perfect for a wide range of switching applications. With a 600V minimum DS breakdown voltage and a maximum pulsed drain current of 45A, this N-channel transistor offers exceptional efficiency and durability. Whether you're looking to enhance your electronic devices or improve energy management systems, the SPA15N60C3XK provides unmatched value and benefits to meet all your needs. Choose excellence with Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the FET lightweight and durable, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher mobility, providing better efficiency in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against reverse voltage, making the FET more reliable in demanding environments.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures efficient and reliable performance in controlling power flow.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET can handle high voltage applications without risk of damage.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and compact arrangement in circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and ease of soldering during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive voltage signal to turn on, offering better control in switching applications.

Maximum Pulsed Drain Current (IDM): 45 A

The high pulsed drain current rating allows for handling short bursts of high current, making the FET suitable for peak power demands.

Avalanche Energy Rating (EAS): 460 mJ

The high avalanche energy rating indicates the FET's ability to withstand high-energy spikes and transients without damage.

No. of Terminals: 3

The 3-terminal configuration simplifies circuit connections and allows for efficient control of power flow.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides secure mechanical attachment, ideal for applications where stability is crucial.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low on-resistance, ensuring efficient power control in various applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows the FET to operate reliably in demanding environments without overheating.

Transistor Element Material: SILICON

Silicon-based transistor elements offer high performance and reliability, making this FET a good choice for critical applications.

Maximum Drain Current (ID): 15 A

The high drain current rating ensures the FET can handle continuous high current flow without overheating or failure.

Maximum Drain-Source On Resistance: 0.28 ohm

The low on-resistance minimizes power loss and heat generation, improving the efficiency of the FET in power switching applications.

Terminal Position: SINGLE

Single terminal position simplifies circuit design and layout, reducing complexity and enhancing overall reliability.

Case Connection: ISOLATED

The isolated case connection provides enhanced safety by preventing electrical contact with other components, reducing the risk of short circuits.

Technical Specifications

Power Field Effect Transistors (FET) SPA15N60C3XK attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

460 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.28 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

45 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

SPA15N60C3XK Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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