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IRF7807VTRPBF-1

Infineon Technologies

IRF7807VTRPBF-1 by Infineon Technologies

Infineon's IRF7807VTRPBF-1 is a N-CHANNEL FET with 8.3A max drain current and 2.5W power dissipation. Ideal for surface mount applications, it operates up to 150°C, making it suitable for various electronic devices requiring high power handling capabilities.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Digiode

USA . 696 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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600

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Vyrian

USA . 434 parts In-Stock

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Modulus Dynamics

Lithuania . 13,300 parts In-Stock

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$1.925

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$1.848

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$1.771

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$1.925

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AZTECH Wire

Italy . 604 parts In-Stock

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$10.925

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Ampacity Inc.

Singapore . 1,326 parts In-Stock

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$54.050

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Corphita

USA . 150 parts In-Stock

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150

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Bastille Electronics

Australia . 50 parts In-Stock

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Overview

Elevate your electronics projects with the IRF7807VTRPBF-1 from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality and reliability in all their products. This Small Signal Field Effect Transistor is perfect for a wide range of applications, providing efficient power management and performance optimization. Get your hands on the IRF7807VTRPBF-1 today and experience the value, benefits, and advantages it brings to your designs. Upgrade your projects with the best in the market and see the difference for yourself.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors offer better performance and efficiency compared to P-CHANNEL transistors, making this product a good choice for various applications.

Configuration: SINGLE

SINGLE configuration simplifies the circuit design and makes it easier to integrate this transistor into different electronic systems, enhancing overall usability.

Surface Mount: YES

Surface mount capability allows for easy installation on printed circuit boards, saving space and enabling efficient assembly in manufacturing processes.

Maximum Drain Current (Abs) (ID): 8.3 A

High maximum drain current capacity ensures that this transistor can handle demanding loads and provides reliable performance in high-power applications.

Maximum Power Dissipation (Abs): 2.5 W

With a maximum power dissipation of 2.5 W, this transistor can effectively dissipate heat generated during operation, contributing to its durability and longevity.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers low power consumption and high switching speeds, making this transistor suitable for applications requiring efficient energy usage.

Maximum Operating Temperature: 150 °C

High maximum operating temperature tolerance of 150°C ensures stable performance in elevated temperature environments, increasing the versatility of this transistor.

Technical Specifications

Small Signal Field Effect Transistors (FET) IRF7807VTRPBF-1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

8.3 A

Maximum Drain Current (ID):

8.3 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

IRF7807VTRPBF-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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