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IRF7478TRPBF-1

Infineon Technologies

IRF7478TRPBF-1 by Infineon Technologies

IRF7478TRPBF-1 by Infineon: N-CHANNEL FET with 7A ID, 2.5W Pd, and 150°C Max Temp. Ideal for surface mount applications in electronics requiring high drain current capabilities.

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Lifecycle Status

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4

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1k+

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Component Sense

UK . 10,439 parts In-Stock

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Digiode

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Nova Conductors

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Vyrian

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Semicontronic

India . 1,534 parts In-Stock

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Aztec Data Supply Inc.

USA . 1,753 parts In-Stock

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Corohmni

South Africa . 225 parts In-Stock

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Modulus Dynamics

Lithuania . 130 parts In-Stock

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Decca Corp

Germany . 436 parts In-Stock

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$9.849

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AZTECH Wire

Italy . 848 parts In-Stock

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Ampacity Inc.

Singapore . 1,497 parts In-Stock

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Component Stockers USA

USA . 766 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

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Overview

Unlock the power of cutting-edge technology with Infineon Technologies' IRF7478TRPBF-1, a top-of-the-line N-CHANNEL Small Signal Field Effect Transistor. Designed for maximum efficiency and reliability, this single configuration FET offers a wide range of applications, from consumer electronics to automotive systems. Experience unparalleled performance and durability with Infineon's innovative METAL-OXIDE SEMICONDUCTOR technology, delivering a maximum drain current of 7A and a power dissipation of 2.5W. Trust Infineon to provide the quality and value you need for your next project.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL transistors are known for their high efficiency and low on-resistance, making them a good choice for various electronic applications.

Surface Mount: YES

Surface mount technology allows for compact and efficient placement of the transistor on a circuit board, saving space and enabling high-density designs.

Maximum Drain Current (Abs): 7 A

With a high maximum drain current, this transistor can handle substantial current loads, making it suitable for power applications.

Maximum Power Dissipation (Abs): 2.5 W

The high maximum power dissipation rating indicates that this transistor can operate reliably under heavy loads without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers good performance characteristics such as high input impedance and low power consumption, making this transistor energy-efficient.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures that the transistor can function reliably in a wide range of environments without performance degradation.

Technical Specifications

Small Signal Field Effect Transistors (FET) IRF7478TRPBF-1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Configuration:

Maximum Drain Current (Abs) (ID):

7 A

Maximum Drain Current (ID):

7 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

Maximum Operating Temperature:

150 Cel

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Trade Compliance

IRF7478TRPBF-1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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