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IRF7509TRPBF

Infineon Technologies

IRF7509TRPBF by Infineon Technologies

Infineon's IRF7509TRPBF is a Small Signal FET with N- and P-channel types. It features 2 elements with built-in diode, ideal for switching applications. With a max drain current of 2.7A and low on-resistance of 0.11Ω, it operates in enhancement mode for efficient performance in various electronic circuits.

Median Price

$0.473

Lifecycle Status

Suppliers In-Stock

25

In-Stock Inventory

1k+

Distributors (Authorized)

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Distrelec

Netherlands . 4,000 parts In-Stock

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$0.576

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$0.522

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$0.413

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$0.576

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$0.413

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DigiKey

USA . 2,662 parts In-Stock

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$1.210

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$0.502

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$0.354

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$0.324

2,662

$1.210

$0.502

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$0.324

Future Electronics

Canada . 4,000 parts In-Stock

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$0.235

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Bürklin Elektronik

Germany . 675 parts In-Stock

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$0.310

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$0.270

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Element14

Singapore . 174 parts In-Stock

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Verical

USA . 87 parts In-Stock

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Chip1Stop

Japan . 4 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Digiode

USA . 259 parts In-Stock

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$0.547

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Freelance Electronics

USA . 5,331 parts In-Stock

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TEDSS.com

USA . 2,715 parts In-Stock

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$0.310

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Maritex

Poland . 4,750 parts In-Stock

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$2.286

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Ozdisan Elektronik

Türkiye . 512 parts In-Stock

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$56.010

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Chip Stock

USA . 9,500 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 2,164 parts In-Stock

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ComSIT Distribution GmbH

Germany . 1,349 parts In-Stock

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Inventory MP

USA . 931 parts In-Stock

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Semi Source

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Bristol Electronics

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Cyclops Electronics Ltd

UK . 831 parts In-Stock

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Netsource Technology, Inc.

USA . 659 parts In-Stock

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Vyrian

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Pegasus Components GmbH

Germany . 221 parts In-Stock

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Elcom Components

USA . 124 parts In-Stock

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Semtec, LLC

USA . 92 parts In-Stock

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Semicontronic

India . 996 parts In-Stock

1+ parts

$0.264

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$0.257

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$0.256

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996

$0.264

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Ampacity Inc.

Singapore . 938 parts In-Stock

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$0.264

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Modulus Dynamics

Lithuania . 15,557 parts In-Stock

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$0.396

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$0.380

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Corohmni

South Africa . 140 parts In-Stock

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Argo Parts USA

USA . 718 parts In-Stock

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$0.408

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Netroflash

USA . 100 parts In-Stock

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$0.413

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Corphita

USA . 953 parts In-Stock

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$0.518

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Continental Prestige Electronics

USA . 40,000 parts In-Stock

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$0.814

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$0.486

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$0.308

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$0.245

40,000

$0.814

$0.486

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$0.245

Aztec Data Supply Inc.

USA . 1,241 parts In-Stock

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$1.928

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Perfect Parts

USA . 147,657 parts In-Stock

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Lixinc

USA . 18,393 parts In-Stock

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Infinite Electronics LLP (Excess)

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GreenTree Electronics

Israel . 10,934 parts In-Stock

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Assy Fe

Spain . 4,000 parts In-Stock

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Glotronic Ltd.

UK . 3,200 parts In-Stock

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iodParts Technologies Inc.

India . 2,937 parts In-Stock

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$0.493

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A-Z Elektronik GmbH

Germany . 2,592 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,728 parts In-Stock

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Futuretech Components

Singapore . 1,091 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Kepictronics

USA . 557 parts In-Stock

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Overview

Unlock the potential of your electronics with the powerful IRF7509TRPBF by Infineon Technologies. Known for their top-notch quality and innovation, Infineon Technologies delivers small signal field effect transistors that excel in switching applications. With a dual-channel configuration and built-in diode, this transistor offers enhanced performance and reliability. Whether you're designing consumer electronics or industrial equipment, the IRF7509TRPBF provides superior functionality and efficiency. Upgrade your projects today with this cutting-edge component from Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy construction provides durability and protection to the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL AND P-CHANNEL

Having both N-channel and P-channel types allows for versatility in circuit design, accommodating different requirements.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

The configuration with separate elements and built-in diode enhances functionality and performance in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable operation in such scenarios.

Surface Mount: YES

Surface mount capability makes installation and integration easier, especially in compact electronic devices.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this transistor can handle higher voltages effectively.

Package Shape: SQUARE

Square package shape allows for efficient use of space and easy mounting on circuit boards.

Terminal Form: GULL WING

Gull wing terminal form provides strong mechanical strength and easy soldering for reliable connections.

Operating Mode: ENHANCEMENT MODE

Operates in enhancement mode, allowing for better control over the transistor's conductivity and enhancing overall performance.

No. of Elements: 2

Having 2 elements increases the transistor's capabilities and allows for more complex circuit designs.

No. of Terminals: 8

With 8 terminals, this transistor offers flexibility in connection options for various circuit configurations.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space and facilitates efficient placement on PCBs, ideal for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance, low power consumption, and reliability in small signal applications.

Transistor Element Material: SILICON

Silicon material ensures stability, efficiency, and durability in operation, making it a popular choice for transistors.

Maximum Drain Current (ID): 2.7 A

With a maximum drain current of 2.7A, this transistor can handle higher current loads, increasing its versatility in various applications.

Maximum Drain-Source On Resistance: 0.11 ohm

Low on-resistance of 0.11 ohm minimizes power loss and heat generation, contributing to the efficiency and reliability of the transistor.

Terminal Position: DUAL

Dual terminal position provides flexibility in circuit connections and simplifies PCB layout, enhancing ease of use and versatility.

Technical Specifications

Small Signal Field Effect Transistors (FET) IRF7509TRPBF attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

ULTRA LOW RESISTANCE

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

2.7 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

S-PDSO-G8

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IRF7509TRPBF Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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