Loading...

IPP05CN10NGHKSA1

Infineon Technologies

IPP05CN10NGHKSA1 by Infineon Technologies

IPP05CN10NGHKSA1 by Infineon Technologies is a N-CHANNEL Power FET with 100V DS Breakdown Voltage. Ideal for SWITCHING applications, it features a max IDM of 400A and 0.0054 ohm Drain-Source On Resistance. The transistor's METAL-OXIDE SEMICONDUCTOR technology ensures high performance in ENHANCEMENT MODE operation.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,349 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

2,349

-

-

-

-

Digiode

USA . 969 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

969

-

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 11,574 parts In-Stock

1+ parts

$0.411

100+ parts

$0.395

1k+ parts

$0.378

10k+ parts

-

11,574

$0.411

$0.395

$0.378

-

Corohmni

South Africa . 214 parts In-Stock

1+ parts

$1.163

100+ parts

-

1k+ parts

-

10k+ parts

-

214

$1.163

-

-

-

Aztec Data Supply Inc.

USA . 460 parts In-Stock

1+ parts

$1.584

100+ parts

-

1k+ parts

-

10k+ parts

-

460

$1.584

-

-

-

AZTECH Wire

Italy . 792 parts In-Stock

1+ parts

$8.240

100+ parts

-

1k+ parts

-

10k+ parts

-

792

$8.240

-

-

-

Ampacity Inc.

Singapore . 166 parts In-Stock

1+ parts

$9.050

100+ parts

-

1k+ parts

-

10k+ parts

-

166

$9.050

-

-

-

Continental Prestige Electronics

USA . 6,022 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

6,022

-

-

-

-

Microchip USA

USA . 3,544 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,544

-

-

-

-

Argo Parts USA

USA . 3,281 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,281

-

-

-

-

Aranea Global

USA . 500 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

500

-

-

-

-

Corphita

USA . 223 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

223

-

-

-

-

Overview

Unlock the power of innovation with the IPP05CN10NGHKSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Power Field Effect Transistors that are perfect for a wide range of switching applications. With its N-CHANNEL design and built-in diode configuration, this transistor offers unmatched performance and reliability. Experience seamless operation and enhanced efficiency with a maximum drain current of 100A and a low drain-source resistance of 0.0054 ohm. Elevate your projects to new heights with the IPP05CN10NGHKSA1 and discover the difference that superior technology can make.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides the FET with good thermal stability and mechanical strength, ensuring reliable performance in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer higher electron mobility and faster switching speeds, making them suitable for applications requiring high performance.

Minimum DS Breakdown Voltage: 100 V

With a high breakdown voltage, this FET can handle higher voltages, making it suitable for applications where robustness is required.

Maximum Pulsed Drain Current (IDM): 400 A

The high pulsed drain current capability of this FET allows it to handle spikes in current without getting damaged, making it suitable for demanding applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high input impedance, low power consumption, and fast switching speeds, making this FET efficient and suitable for various applications.

Maximum Drain-Source On Resistance: 0.0054 ohm

With low on-resistance, this FET can efficiently conduct high currents with minimal power loss, making it suitable for high-power applications.

Technical Specifications

Power Field Effect Transistors (FET) IPP05CN10NGHKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

826 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

100 A

Maximum Drain-Source On Resistance:

.0054 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP05CN10NGHKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20