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IPP045N10N3G

Infineon Technologies

IPP045N10N3G by Infineon Technologies

IPP045N10N3G by Infineon Technologies is a power FET with N-channel configuration and a min DS breakdown voltage of 100V. It is used for switching applications, offering a max pulsed drain current of 400A and an avalanche energy rating of 340mJ.

Median Price

$3.137

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 965 parts In-Stock

1+ parts

$2.990

100+ parts

$1.340

1k+ parts

$1.002

10k+ parts

$0.912

965

$2.990

$1.340

$1.002

$0.912

Mouser Electronics

USA . 1,705 parts In-Stock

1+ parts

$3.260

100+ parts

$1.630

1k+ parts

$1.180

10k+ parts

-

1,705

$3.260

$1.630

$1.180

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Verical

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$3.137

1k+ parts

$2.959

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500

-

$3.137

$2.959

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Distributors (In-Stock)

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Digiode

USA . 913 parts In-Stock

1+ parts

$2.822

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913

$2.822

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Maritex

Poland . 206 parts In-Stock

1+ parts

$3.439

100+ parts

$2.014

1k+ parts

$1.670

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206

$3.439

$2.014

$1.670

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Cyclops Electronics Ltd

UK . 4,200 parts In-Stock

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Vyrian

USA . 2,445 parts In-Stock

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2,445

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Nova Conductors

Japan . 900 parts In-Stock

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900

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Rutronik

Germany . 650 parts In-Stock

1+ parts

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$1.520

1k+ parts

$1.170

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650

-

$1.520

$1.170

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Sunrise Surplus Inc.

USA . 50 parts In-Stock

1+ parts

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50

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Bristol Electronics

USA . 34 parts In-Stock

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$2.240

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34

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$2.240

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Semtec, LLC

USA . 1 parts In-Stock

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1

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Distributors (Availability)

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Corohmni

South Africa . 312 parts In-Stock

1+ parts

$0.693

100+ parts

-

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312

$0.693

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Modulus Dynamics

Lithuania . 13,656 parts In-Stock

1+ parts

$1.148

100+ parts

$1.102

1k+ parts

$1.056

10k+ parts

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13,656

$1.148

$1.102

$1.056

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Ampacity Inc.

Singapore . 2,445 parts In-Stock

1+ parts

$1.810

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2,445

$1.810

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Semicontronic

India . 73 parts In-Stock

1+ parts

$1.810

100+ parts

$1.765

1k+ parts

$1.756

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73

$1.810

$1.765

$1.756

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Corphita

USA . 674 parts In-Stock

1+ parts

$2.673

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674

$2.673

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CoreStaff

Japan . 500 parts In-Stock

1+ parts

$5.017

100+ parts

$1.915

1k+ parts

$1.875

10k+ parts

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500

$5.017

$1.915

$1.875

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Andel Nordic

Denmark . 417 parts In-Stock

1+ parts

$29.630

100+ parts

-

1k+ parts

$20.738

10k+ parts

$20.738

417

$29.630

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$20.738

$20.738

A-Z Elektronik GmbH

Germany . 10,580 parts In-Stock

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10,580

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Lixinc

USA . 9,442 parts In-Stock

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9,442

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Futuretech Components

Singapore . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,450 parts In-Stock

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Argo Parts USA

USA . 2,046 parts In-Stock

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Continental Prestige Electronics

USA . 1,638 parts In-Stock

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Kepictronics

USA . 250 parts In-Stock

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250

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Bastille Electronics

Australia . 50 parts In-Stock

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50

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Overview

Experience the power and reliability of the IPP045N10N3G by Infineon Technologies. As a leader in the industry, Infineon Technologies is known for delivering high-quality components that meet the demands of various applications. The IPP045N10N3G is a N-CHANNEL Power Field Effect Transistor with built-in diode, ideal for switching purposes. Its impressive features include a minimum DS breakdown voltage of 100V and a maximum pulsing drain current of 400A. With its robust design and metal-oxide semiconductor technology, this transistor offers exceptional performance and durability. Whether you're working on industrial automation, power supplies, or motor control, the IPP045N10N3G is your go-to solution for efficient and reliable switching. Experience the value and benefits it brings to your projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and reliable performance, making this product suitable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower resistance and higher switching speeds compared to P-channel FETs, making them suitable for high-performance applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET allows for efficient and reliable control of electrical currents, making it ideal for use in various electronic devices.

Minimum DS Breakdown Voltage: 100 V

With a minimum breakdown voltage of 100 V, this FET can handle higher voltages without breakdown, ensuring safety and reliable operation in high-voltage circuits.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a gate voltage to turn on, providing better control over the switching process and reducing power consumption in the off state.

Maximum Pulsed Drain Current (IDM): 400 A

The high pulsed drain current rating of 400 A allows for handling momentary surge currents, making this FET suitable for applications that require high power handling capabilities.

Avalanche Energy Rating (EAS): 340 mJ

The high avalanche energy rating of 340 mJ indicates the FET's ability to withstand sudden voltage spikes and transients, ensuring reliability in demanding operating conditions.

Maximum Power Dissipation (Abs): 214 W

With a high power dissipation rating of 214 W, this FET can handle significant power loads while maintaining stable performance, making it suitable for high-power applications.

Maximum Drain-Source On Resistance: 0.0045 ohm

The low drain-source on resistance of 0.0045 ohm reduces power losses and improves efficiency in the conducting state, making this FET ideal for high-current applications.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175 °C ensures reliable operation in elevated temperature environments, making this FET suitable for use in a wide range of temperature conditions.

Technical Specifications

Power Field Effect Transistors (FET) IPP045N10N3G attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

340 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

100 A

Maximum Drain Current (ID):

100 A

Maximum Drain-Source On Resistance:

.0045 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

400 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP045N10N3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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