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IPP075N15N3GHKSA1

Infineon Technologies

IPP075N15N3GHKSA1 by Infineon Technologies

IPP075N15N3GHKSA1 by Infineon is a N-CHANNEL FET with 150V DS Breakdown Voltage and 0.0075 ohm Drain-Source On Resistance. Ideal for SWITCHING applications, it has 100A Max Drain Current and 400A Pulsed Drain Current (IDM).

Median Price

$3.453

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 450 parts In-Stock

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$3.453

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450

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Vyrian

USA . 6,616 parts In-Stock

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Digiode

USA . 296 parts In-Stock

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296

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,438 parts In-Stock

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$1.810

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1,438

$1.810

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Modulus Dynamics

Lithuania . 10,188 parts In-Stock

1+ parts

$3.453

100+ parts

$3.315

1k+ parts

$3.177

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10,188

$3.453

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$3.177

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Corohmni

South Africa . 670 parts In-Stock

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$3.453

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670

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Continental Prestige Electronics

USA . 5,653 parts In-Stock

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$3.453

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$3.384

5,653

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$3.384

Argo Parts USA

USA . 3,268 parts In-Stock

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$3.453

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3,268

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Netroflash

USA . 1,000 parts In-Stock

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$3.453

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1,000

$3.453

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$3.523

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$3.523

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$3.523

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200

$3.523

$3.523

$3.523

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Ampacity Inc.

Singapore . 1,308 parts In-Stock

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$5.050

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Semicontronic

India . 1,171 parts In-Stock

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$18.050

100+ parts

$17.599

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$17.508

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1,171

$18.050

$17.599

$17.508

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AZTECH Wire

Italy . 697 parts In-Stock

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$19.692

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697

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QUARKTWIN TECHNOLOGY LTD

USA . 13,296 parts In-Stock

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Microchip USA

USA . 5,572 parts In-Stock

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Corphita

USA . 676 parts In-Stock

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676

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Overview

Unlock the power of efficiency and reliability with the IPP075N15N3GHKSA1 by Infineon Technologies. Crafted with precision and expertise, this N-CHANNEL Power Field Effect Transistor offers unparalleled performance in switching applications. Its robust design and high DS Breakdown Voltage of 150V ensure optimal functionality, while the built-in diode enhances convenience. Experience seamless operation and increased productivity with this high-quality FET, designed to meet your power needs with ease. Elevate your projects with the trusted excellence of Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This durable material ensures the transistor can withstand tough conditions, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel design allows for efficient switching and power management, making this transistor ideal for use in electronics.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps prevent damage from reverse currents, increasing the lifespan of the transistor and making it a convenient choice for circuit design.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast response times and efficient power control, making it a versatile option for many electronic devices.

Minimum DS Breakdown Voltage: 150 V

With a high breakdown voltage, this transistor can handle high voltage levels without risking damage, making it a safe and reliable choice for demanding circuits.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy mounting and secure placement on circuit boards, making this transistor simple to integrate into a variety of designs.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide a strong connection to the circuit board, preventing loose connections and ensuring stable performance in the long run.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation offers precise control over the transistor's switching behavior, allowing for optimal performance in a wide range of applications.

Maximum Pulsed Drain Current (IDM): 400 A

With a high pulsed drain current rating, this transistor can handle sudden surges of power without overheating, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 780 mJ

The high avalanche energy rating ensures the transistor can withstand voltage spikes and transient events, making it a stable and reliable choice for demanding environments.

No. of Terminals: 3

The three terminals provide a simple and straightforward connection setup, making it easy to integrate this transistor into existing circuit designs.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure attachment to heat sinks for efficient heat dissipation, making this transistor a great choice for high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology offers low power consumption and high efficiency, making this transistor an energy-efficient choice for electronics.

Transistor Element Material: SILICON

The silicon construction of the transistor element ensures reliable performance and high durability, making it a stable choice for long-term use.

Maximum Drain Current (ID): 100 A

With a high maximum drain current rating, this transistor can handle heavy loads with ease, making it suitable for power-hungry applications.

Maximum Drain-Source On Resistance: 0.0075 ohm

The low drain-source on resistance minimizes power loss and heat generation, ensuring efficient operation and low overall energy consumption.

Terminal Position: SINGLE

The single terminal position simplifies the installation and wiring process, making this transistor easy to work with for both experienced and novice users.

Technical Specifications

Power Field Effect Transistors (FET) IPP075N15N3GHKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

780 mJ

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (ID):

100 A

Maximum Drain-Source On Resistance:

.0075 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP075N15N3GHKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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