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IPP045N10N3GHKSA1

Infineon Technologies

IPP045N10N3GHKSA1 by Infineon Technologies

IPP045N10N3GHKSA1 by Infineon Technologies is a N-CHANNEL FET with 100V DS Breakdown Voltage, 0.0045 ohm RDS(on), and 400A IDM. Ideal for SWITCHING applications due to its ENHANCEMENT MODE operation and 340mJ EAS rating. The PLASTIC/EPOXY package with THROUGH-HOLE terminals makes it easy to integrate in various systems.

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3

In-Stock Inventory

1k+

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Vyrian

USA . 2,969 parts In-Stock

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Digiode

USA . 90 parts In-Stock

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Nova Conductors

Japan . 84 parts In-Stock

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Modulus Dynamics

Lithuania . 23,673 parts In-Stock

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$0.980

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$0.941

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$0.902

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Corohmni

South Africa . 686 parts In-Stock

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Aztec Data Supply Inc.

USA . 3,022 parts In-Stock

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$1.510

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AZTECH Wire

Italy . 883 parts In-Stock

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Semicontronic

India . 678 parts In-Stock

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$31.050

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$30.274

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$30.118

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Ampacity Inc.

Singapore . 282 parts In-Stock

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$59.050

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Continental Prestige Electronics

USA . 4,014 parts In-Stock

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Argo Parts USA

USA . 2,651 parts In-Stock

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Microchip USA

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Bastille Electronics

Australia . 300 parts In-Stock

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Corphita

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Overview

Elevate your power management solutions with the IPP045N10N3GHKSA1 by Infineon Technologies, a top-tier manufacturer known for its high-quality Power Field Effect Transistors (FET). This N-CHANNEL transistor boasts a single configuration with a built-in diode, making it ideal for switching applications. With a minimum DS breakdown voltage of 100V and a maximum pulsed drain current of 400A, this transistor offers unparalleled performance and reliability. Whether you're optimizing energy efficiency or enhancing circuit designs, the IPP045N10N3GHKSA1 delivers superior value and benefits to meet all your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ensuring longevity and ease of handling.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher current-carrying capacity compared to P-channel FETs, making them suitable for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against voltage spikes and reverse current flow, enhancing overall system reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient operation in power control circuits.

Minimum DS Breakdown Voltage: 100 V

A high breakdown voltage allows for safe operation at higher voltages, making this FET suitable for a wide range of applications.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy mounting and efficient use of board space in circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections and ease of soldering, ensuring reliable electrical connections in a circuit.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs can be easily controlled by applying a positive voltage to the gate terminal, enabling precise switching operations in various applications.

Maximum Pulsed Drain Current (IDM): 400 A

With a high pulsed drain current rating, this FET can handle short bursts of high current, making it suitable for applications requiring transient current handling capabilities.

Avalanche Energy Rating (EAS): 340 mJ

The high avalanche energy rating indicates the FET's ability to withstand voltage spikes and transient events, ensuring reliability in harsh operating conditions.

No. of Terminals: 3

Having 3 terminals allows for easy connection in a circuit, providing flexibility in circuit design and integration.

Package Style (Meter): FLANGE MOUNT

The flange mount package style offers easy and secure mounting options, ensuring stability and heat dissipation in high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology provides high switching speeds and efficiency, making this FET suitable for power control and conversion applications.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability, making this FET a dependable choice for demanding applications.

Maximum Drain Current (ID): 100 A

With a maximum drain current rating of 100 A, this FET can handle high currents, making it ideal for power control applications.

Maximum Drain-Source On Resistance: 0.0045 ohm

Having a low on-resistance value minimizes power losses and heat generation, improving efficiency and performance in power switching applications.

Terminal Position: SINGLE

The single terminal position simplifies circuit design and layout, enabling easy integration into a variety of electronic systems.

Technical Specifications

Power Field Effect Transistors (FET) IPP045N10N3GHKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

340 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (ID):

100 A

Maximum Drain-Source On Resistance:

.0045 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

400 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP045N10N3GHKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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