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IPP023N04NG

Infineon Technologies

IPP023N04NG by Infineon Technologies

IPP023N04NG by Infineon Technologies is a N-CHANNEL FET with 40V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 400A IDM, 150mJ EAS, and 0.0023 ohm RDS(on). Operating in ENHANCEMENT MODE, it has a max power dissipation of 167W at 175°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 370 parts In-Stock

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370

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Vyrian

USA . 270 parts In-Stock

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270

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 8,162 parts In-Stock

1+ parts

$0.693

100+ parts

$0.665

1k+ parts

$0.638

10k+ parts

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8,162

$0.693

$0.665

$0.638

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AZTECH Wire

Italy . 472 parts In-Stock

1+ parts

$5.056

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472

$5.056

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Andel Nordic

Denmark . 186 parts In-Stock

1+ parts

$54.460

100+ parts

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$38.120

10k+ parts

$38.120

186

$54.460

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$38.120

$38.120

Ampacity Inc.

Singapore . 1,624 parts In-Stock

1+ parts

$57.050

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1,624

$57.050

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Continental Prestige Electronics

USA . 5,948 parts In-Stock

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5,948

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A-Z Elektronik GmbH

Germany . 5,252 parts In-Stock

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5,252

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Perfect Parts

USA . 4,632 parts In-Stock

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4,632

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Alle Elektronik GmbH

Germany . 3,501 parts In-Stock

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3,501

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Argo Parts USA

USA . 3,005 parts In-Stock

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Corphita

USA . 834 parts In-Stock

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834

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Lixinc

USA . 225 parts In-Stock

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225

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Enhance your power management capabilities with the IPP023N04NG by Infineon Technologies. As a leading manufacturer in the industry, Infineon ensures top-notch quality and reliability in their Power Field Effect Transistors. Designed for switching applications, this N-CHANNEL transistor offers a single configuration with a built-in diode, making it ideal for various power control needs. With a low on-resistance and high pulsed drain current, this transistor delivers exceptional performance while maximizing efficiency. Upgrade your electronic projects with the IPP023N04NG and experience the superior value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used in the package body provides durability and protection for the internal components of the FET, making it reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher electron mobility, lower on-state resistance, and faster switching speeds compared to P-channel FETs, making them ideal for high-performance switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in the FET allows for efficient freewheeling and protection against reverse voltage spikes, enhancing the overall reliability of the product.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high efficiency and fast switching speeds, making it suitable for power management in various electronic devices.

Minimum DS Breakdown Voltage: 40 V

With a minimum breakdown voltage of 40V, this FET can handle higher voltages without breakdown, ensuring reliable operation in demanding conditions.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into electronic circuits, providing convenience during the assembly process.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide secure connections and easy soldering during assembly, ensuring stable electrical connections for optimal performance.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer easier control of the device's conductivity, providing efficient switching capabilities and improved overall performance.

Maximum Pulsed Drain Current (IDM): 400 A

With a high maximum pulsed drain current of 400A, this FET can handle large current spikes without damage, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 150 mJ

The high avalanche energy rating of 150mJ indicates the FET's ability to withstand energy spikes and voltage transients, ensuring reliable operation in harsh environments.

Maximum Drain Current (Abs) (ID): 90 A

The maximum drain current rating of 90A allows for high current operation, making this FET suitable for applications that require efficient power handling.

No. of Terminals: 3

The 3-terminal design simplifies circuit connections and allows for easy integration into electronic systems, enhancing the overall usability of the FET.

Maximum Power Dissipation (Abs): 167 W

With a maximum power dissipation of 167W, this FET can handle high power levels without overheating, ensuring stable operation under demanding conditions.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides mechanical stability and secure mounting options, making it suitable for applications that require robust mounting solutions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low on-state resistance, making this FET ideal for power management in energy-efficient electronic systems.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this FET can withstand high-temperature environments, ensuring reliable performance in industrial and automotive applications.

Transistor Element Material: SILICON

Silicon-based transistor elements offer high reliability and stability, providing consistent performance over a wide range of operating conditions.

Terminal Finish: TIN

The tin terminal finish provides corrosion resistance and solderability, ensuring long-term reliability and stable electrical connections for the FET.

Maximum Drain Current (ID): 90 A

The maximum drain current rating of 90A allows for high current operation, making this FET suitable for applications that require efficient power handling.

Maximum Drain-Source On Resistance: 0.0023 ohm

With a low drain-source on-resistance of 0.0023 ohm, this FET offers minimal power loss and high efficiency, making it ideal for power switching applications.

Terminal Position: SINGLE

The single terminal position simplifies circuit connections and allows for easy integration into electronic systems, enhancing the overall usability of the FET.

Technical Specifications

Power Field Effect Transistors (FET) IPP023N04NG attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

150 mJ

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

90 A

Maximum Drain Current (ID):

90 A

Maximum Drain-Source On Resistance:

.0023 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

400 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP023N04NG Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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