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IPP051N15N5AKSA1

Infineon Technologies

IPP051N15N5AKSA1 by Infineon Technologies

IPP051N15N5AKSA1 by Infineon is a N-CHANNEL FET with 150V DS breakdown voltage, 120A max drain current, and 0.0051 ohm max on resistance. Ideal for switching applications due to its 480A pulsed drain current capability. Package style is flange mount with through-hole terminals.

Median Price

$5.876

Lifecycle Status

Suppliers In-Stock

9

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1k+

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Chip1Stop

Japan . 39 parts In-Stock

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$5.280

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$5.280

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Arrow

USA . 18,523 parts In-Stock

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$5.343

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$4.059

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$3.215

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$5.343

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Mouser Electronics

USA . 3 parts In-Stock

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$6.410

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$4.220

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$3.100

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$3.090

3

$6.410

$4.220

$3.100

$3.090

RS (Exports)

UK . 260 parts In-Stock

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$45.615

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Verical

USA . 39 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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$4.572

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100

$4.572

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Digiode

USA . 784 parts In-Stock

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$5.016

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Vyrian

USA . 7,273 parts In-Stock

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Chip Stock

USA . 880 parts In-Stock

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Aztec Data Supply Inc.

USA . 533 parts In-Stock

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$1.335

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533

$1.335

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Argo Parts USA

USA . 234 parts In-Stock

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$4.125

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234

$4.125

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Aranea Global

USA . 1,000 parts In-Stock

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$4.480

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$4.301

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$4.480

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Semicontronic

India . 3,658 parts In-Stock

1+ parts

$4.490

100+ parts

$4.378

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$4.355

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3,658

$4.490

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Ampacity Inc.

Singapore . 3,303 parts In-Stock

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$4.490

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3,303

$4.490

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Advanced Electronics

New Zealand . 900 parts In-Stock

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$4.661

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$4.661

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$4.661

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900

$4.661

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Corphita

USA . 577 parts In-Stock

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$4.752

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577

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Continental Prestige Electronics

USA . 2,951 parts In-Stock

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$5.130

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$3.310

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$2.630

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$2.630

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Modulus Dynamics

Lithuania . 22,929 parts In-Stock

1+ parts

$5.160

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$4.954

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$4.747

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Corohmni

South Africa . 246 parts In-Stock

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$5.160

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Microchip USA

USA . 5,279 parts In-Stock

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$18.284

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RC Electronics

USA . 7,161 parts In-Stock

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$4.660

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$4.260

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$4.130

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Lixinc

USA . 6,989 parts In-Stock

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Robosynatics

Brazil . 4,814 parts In-Stock

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$5.057

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$4.954

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Lucentia Tech

USA . 4,814 parts In-Stock

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$5.057

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Perfect Parts

USA . 2,240 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,192 parts In-Stock

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S.R.D Solutions

India . 895 parts In-Stock

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iodParts Technologies Inc.

India . 500 parts In-Stock

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Overview

Elevate your power management solutions with the IPP051N15N5AKSA1 by Infineon Technologies. As a leader in the industry, Infineon Technologies delivers unparalleled quality and reliability in their Power Field Effect Transistors (FET). This N-CHANNEL transistor in a RECTANGULAR package offers enhanced performance for switching applications. With a maximum pulsed drain current of 480 A and a minimum DS breakdown voltage of 150 V, this transistor provides superior efficiency and durability. Trust in Infineon Technologies to provide cutting-edge technology that meets your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for various applications.

Polarity or Channel Type: N-CHANNEL

Allows for efficient switching and control of current flow, enhancing performance.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space, making installation easier.

Transistor Application: SWITCHING

Ideal for applications requiring fast switching speeds and high efficiency.

Minimum DS Breakdown Voltage: 150 V

Ensures reliable operation and protection against electrical breakdown.

Package Shape: RECTANGULAR

Facilitates easy integration into different electronic devices and systems.

Terminal Form: THROUGH-HOLE

Provides secure connections and stability in various circuit configurations.

Operating Mode: ENHANCEMENT MODE

Enables precise control over current flow and power consumption.

Maximum Pulsed Drain Current (IDM): 480 A

Capable of handling high peak currents, suitable for demanding applications.

Avalanche Energy Rating (EAS): 230 mJ

Offers protection against voltage spikes and ensures longevity of the transistor.

No. of Terminals: 3

Provides necessary connections for power supply and control signals.

Package Style (Meter): FLANGE MOUNT

Allows for easy mounting on surfaces, enhancing versatility in installation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Delivers high performance and efficiency in electronic circuits.

Transistor Element Material: SILICON

Known for its reliability and stability, ensuring consistent operation.

Terminal Finish: TIN

Provides corrosion resistance and low contact resistance for improved performance.

Maximum Drain Current (ID): 120 A

Handles high continuous currents without overheating, suitable for heavy-duty applications.

Maximum Drain-Source On Resistance: 0.0051 ohm

Low resistance minimizes power loss and improves overall efficiency.

Terminal Position: SINGLE

Simplifies circuit design and connections, making installation straightforward.

Case Connection: DRAIN

Easy to integrate into circuits and compatible with standard connection methods.

Technical Specifications

Power Field Effect Transistors (FET) IPP051N15N5AKSA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Avalanche Energy Rating (EAS):

230 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

150 V

Maximum Drain Current (ID):

120 A

Maximum Drain-Source On Resistance:

.0051 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

480 A

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

IPP051N15N5AKSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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