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IKW25N120T2

Infineon Technologies

IKW25N120T2 by Infineon Technologies

IKW25N120T2 by Infineon is an N-CHANNEL IGBT with 1200V max collector-emitter voltage, 50A max collector current, and 349W max power dissipation. Ideal for power control applications due to its single configuration with built-in diode and fast turn-off time of 504ns. Package style is flange mount with through-hole terminals.

Median Price

$6.050

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 1,302 parts In-Stock

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$6.050

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$2.740

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1,302

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$2.740

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Vyrian

USA . 398 parts In-Stock

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$2.200

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398

$2.200

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Digiode

USA . 751 parts In-Stock

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$5.538

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751

$5.538

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Cyclops Electronics Ltd

UK . 25,919 parts In-Stock

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Rutronik

Germany . 540 parts In-Stock

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$3.830

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$3.550

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540

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$3.830

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Velocity Electronics

USA . 80 parts In-Stock

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80

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Holdelec - ElecDif-Pro

France . 4 parts In-Stock

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Modulus Dynamics

Lithuania . 3,873 parts In-Stock

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$1.300

100+ parts

$1.248

1k+ parts

$1.196

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3,873

$1.300

$1.248

$1.196

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Corphita

USA . 614 parts In-Stock

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$5.247

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614

$5.247

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Andel Nordic

Denmark . 164 parts In-Stock

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$52.410

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$36.689

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$36.689

164

$52.410

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$36.689

$36.689

A-Z Elektronik GmbH

Germany . 7,542 parts In-Stock

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Futuretech Components

Singapore . 4,800 parts In-Stock

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Technoshack Inc. (Excess)

Canada . 4,000 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Perfect Parts

USA . 2,523 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,128 parts In-Stock

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Kepictronics

USA . 383 parts In-Stock

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Overview

Infineon 1200V Gen8 IGBTs feature trench gate field stop technology delivered in industry standard TO-247 packages to provide best-in-class performance for industrial and energy-saving applications. The Gen8 technology offers softer turn-off characteristics ideal for motor drive applications, minimizing dv/dt to reduce EMI, and over-voltage, increasing reliability and ruggedness. Infineon 1200V Gen8 IGBTs have current ratings from 8A up to 60A with typical VCE(ON) of 1.7V, and a short-circuit rating of 10µs to reduce power dissipation, resulting in increased power density and robustness. Using thin wafer technology, 1200V Gen8 IGBTs deliver improved thermal resistance and maximum junction temperature up to +175°C.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design by having a built-in diode, reducing the need for additional components and enhancing overall efficiency.

Nominal Turn Off Time (toff): 504 ns

Fast turn-off time allows for precise control and switching of power, making it suitable for applications that require quick response times.

Maximum Power Dissipation (Abs): 349 W

High power dissipation capability ensures reliable performance under heavy loads, making it suitable for high-power applications.

Maximum Operating Temperature: 150 °C

With a high temperature tolerance, this IGBT can operate efficiently even in challenging thermal conditions.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IKW25N120T2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.4 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AD

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

504 ns

Nominal Turn On Time (ton):

49 ns

Trade Compliance

IKW25N120T2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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