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IHW20N120R2

Infineon Technologies

IHW20N120R2 by Infineon Technologies

IHW20N120R2 by Infineon Technologies is an N-CHANNEL IGBT with a max collector-emitter voltage of 1200V and a max collector current of 40A. With a nominal turn-off time of 526ns, it is ideal for applications requiring high power dissipation up to 330W in industrial settings. The package style is flange mount with through-hole terminals, making it suitable for various power electronics applications.

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3

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1k+

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Vyrian

USA . 3,270 parts In-Stock

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Digiode

USA . 753 parts In-Stock

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Nova Conductors

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Modulus Dynamics

Lithuania . 22,173 parts In-Stock

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$0.758

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$0.728

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$0.697

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$0.758

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AZTECH Wire

Italy . 735 parts In-Stock

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$18.829

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Andel Nordic

Denmark . 339 parts In-Stock

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$52.400

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$36.681

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Ampacity Inc.

Singapore . 1,264 parts In-Stock

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$63.050

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 26,311 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,542 parts In-Stock

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Argo Parts USA

USA . 3,095 parts In-Stock

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Authorized Procurement Solutions

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Aranea Global

USA . 2,000 parts In-Stock

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Lixinc

USA . 1,982 parts In-Stock

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Glotronic Ltd.

UK . 1,920 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,128 parts In-Stock

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Continental Prestige Electronics

USA . 397 parts In-Stock

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Microchip USA

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Corphita

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Overview

Elevate your electronics with the IHW20N120R2 by Infineon Technologies. Crafted with precision and expertise, this Insulated Gate Bipolar Transistor offers unparalleled performance and reliability. Whether you're in the automotive, industrial or renewable energy sector, this N-CHANNEL transistor with a built-in diode is the perfect solution for your power management needs. Experience the value of efficiency and durability with the IHW20N120R2 and take your projects to new heights. Choose quality, choose reliability, choose Infineon Technologies.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components, ensuring reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drops and faster switching speeds compared to P-channel IGBTs, making them suitable for high power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for easy handling of back-emf and inductive loads, simplifying circuit design.

Package Shape: RECTANGULAR

Rectangular shape makes it easy to mount and integrate IGBT into electronic systems.

Nominal Turn Off Time (toff): 526 ns

Fast turn-off time helps in reducing switching losses and improving overall efficiency of the system.

Maximum Power Dissipation (Abs): 330 W

High power dissipation capability allows for handling high current and voltage levels without overheating.

Maximum Operating Temperature: 175 °C

Wide operating temperature range ensures stable performance in various environmental conditions.

Maximum Collector-Emitter Voltage: 1200 V

High breakdown voltage allows for safe operation in high voltage applications.

Maximum Gate-Emitter Voltage: 20 V

Gate-emitter voltage rating ensures protection of the gate terminal from overvoltage conditions.

Maximum Collector Current (IC): 40 A

High collector current rating enables handling of high power loads without damage.

Maximum Gate-Emitter Threshold Voltage: 6.4 V

Threshold voltage helps in controlling the on/off state of the IGBT accurately.

Case Connection: COLLECTOR

Collector connection simplifies the circuit layout and ensures efficient current flow.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IHW20N120R2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.4 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AD

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

526 ns

Trade Compliance

IHW20N120R2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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