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IHW20T120

Infineon Technologies

IHW20T120 by Infineon Technologies

IHW20T120 by Infineon Technologies is an N-CHANNEL IGBT transistor with a max collector-emitter voltage of 1200V and a max collector current of 40A. It has a nominal turn-off time of 790ns and is designed for power control applications. The transistor comes in a rectangular package style with through-hole terminals, making it suitable for high-power applications requiring efficient switching capabilities.

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3

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1k+

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Vyrian

USA . 1,505 parts In-Stock

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Digiode

USA . 500 parts In-Stock

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Nova Conductors

Japan . 100 parts In-Stock

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Modulus Dynamics

Lithuania . 11,541 parts In-Stock

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$1.524

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$1.463

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$1.402

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AZTECH Wire

Italy . 343 parts In-Stock

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$10.651

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Ampacity Inc.

Singapore . 747 parts In-Stock

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Andel Nordic

Denmark . 207 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,752 parts In-Stock

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Argo Parts USA

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Continental Prestige Electronics

USA . 2,872 parts In-Stock

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Aranea Global

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Alle Elektronik GmbH

Germany . 1,268 parts In-Stock

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Corphita

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Overview

Unleash the power of the IHW20T120 by Infineon Technologies, a top-notch Insulated Gate Bipolar Transistor designed for superior performance in power control applications. With its N-CHANNEL configuration, built-in diode, and high-quality SILICON transistor element material, this product offers unparalleled reliability and efficiency. Whether you're looking to optimize your power systems or enhance your industrial equipment, the IHW20T120 delivers maximum power dissipation of 178W and a collector-emitter voltage of 1200V. Trust in Infineon Technologies to provide cutting-edge solutions that drive your success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the internal components of the IGBT, ensuring its reliability and longevity.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher switching speeds compared to P-channel IGBTs, making them more efficient for power control applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode simplifies the circuit design and can provide better efficiency in certain applications where freewheeling diodes are required.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, this IGBT is optimized for high-power switching and efficient energy conversion.

Maximum Power Dissipation (Abs): 178 W

With a high maximum power dissipation rating, this IGBT can handle heavy load currents without overheating, allowing for reliable operation in demanding conditions.

Maximum Collector-Emitter Voltage: 1200 V

The high maximum collector-emitter voltage rating makes this IGBT suitable for high-voltage applications, providing a wide range of potential uses.

Maximum Gate-Emitter Voltage: 20 V

The maximum gate-emitter voltage ensures proper gate control over the IGBT, helping to prevent damage from overvoltage conditions.

Maximum Collector Current (IC): 40 A

With a high maximum collector current rating, this IGBT can handle large current loads, making it suitable for high-power applications.

Nominal Turn On Time (ton): 82 ns

The fast turn-on time of this IGBT allows for quick switching speeds, reducing switching losses and improving efficiency in power control applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) IHW20T120 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Maximum Gate-Emitter Threshold Voltage:

6.5 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AC

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

790 ns

Nominal Turn On Time (ton):

82 ns

Trade Compliance

IHW20T120 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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