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FZ750R65KE3NOSA1

Infineon Technologies

FZ750R65KE3NOSA1 by Infineon Technologies

FZ750R65KE3NOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 3 elements in parallel configuration. It has a max collector-emitter voltage of 6500V and nominal turn off time of 8100ns, making it ideal for power control applications. The transistor's package style is flange mount with 9 terminals, operating at a max temperature of 150°C.

Median Price

$2,326.940

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2 parts In-Stock

1+ parts

$2,024.350

100+ parts

-

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2

$2,024.350

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Rochester

USA . 4 parts In-Stock

1+ parts

$2,326.940

100+ parts

$2,187.320

1k+ parts

$2,047.710

10k+ parts

-

4

$2,326.940

$2,187.320

$2,047.710

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Verical

USA . 4 parts In-Stock

1+ parts

$3,377.288

100+ parts

-

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-

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4

$3,377.288

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Distributors (In-Stock)

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Digiode

USA . 17 parts In-Stock

1+ parts

$2,310.068

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-

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17

$2,310.068

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Nova Conductors

Japan . 450 parts In-Stock

1+ parts

$2,824.410

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450

$2,824.410

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Vyrian

USA . 8,704 parts In-Stock

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8,704

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 5,974 parts In-Stock

1+ parts

$0.574

100+ parts

$0.551

1k+ parts

$0.528

10k+ parts

-

5,974

$0.574

$0.551

$0.528

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Advanced Electronics

New Zealand . 10 parts In-Stock

1+ parts

$0.627

100+ parts

$0.571

1k+ parts

$0.514

10k+ parts

-

10

$0.627

$0.571

$0.514

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Corohmni

South Africa . 462 parts In-Stock

1+ parts

$1.294

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462

$1.294

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AZTECH Wire

Italy . 377 parts In-Stock

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$19.073

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377

$19.073

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Corphita

USA . 128 parts In-Stock

1+ parts

$2,188.485

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128

$2,188.485

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Microchip USA

USA . 1,932 parts In-Stock

1+ parts

$2,587.780

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$2,587.780

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Continental Prestige Electronics

USA . 6,908 parts In-Stock

1+ parts

$2,824.410

100+ parts

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10k+ parts

$2,767.922

6,908

$2,824.410

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-

$2,767.922

Argo Parts USA

USA . 1,423 parts In-Stock

1+ parts

$2,824.410

100+ parts

$2,796.166

1k+ parts

$2,767.922

10k+ parts

$2,739.678

1,423

$2,824.410

$2,796.166

$2,767.922

$2,739.678

Ampacity Inc.

Singapore . 3 parts In-Stock

1+ parts

$4,498.550

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3

$4,498.550

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

$2,767.922

1k+ parts

$2,683.190

10k+ parts

$2,626.701

2,000

-

$2,767.922

$2,683.190

$2,626.701

GreenTree Electronics

Israel . 50 parts In-Stock

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50

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Overview

Elevate your power control capabilities with the FZ750R65KE3NOSA1 by Infineon Technologies. As a leader in the industry, Infineon brings you a high-quality Insulated Gate Bipolar Transistor (IGBT) with N-CHANNEL polarity and 3 elements with built-in diode configuration. This versatile component is perfect for a wide range of applications, offering reliable performance and exceptional value. Trust Infineon to deliver cutting-edge technology that empowers you to take your projects to the next level.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs typically have higher efficiency and better thermal stability compared to P-CHANNEL IGBTs.

Configuration: PARALLEL, 3 ELEMENTS WITH BUILT-IN DIODE

The parallel configuration with built-in diode allows for improved current handling capacity and better protection against voltage spikes.

Transistor Application: POWER CONTROL

Designed specifically for power control applications, ensuring optimal performance and reliability in controlling high power loads.

Package Shape: RECTANGULAR

Rectangular package shape provides easy mounting and integration into various systems and applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this IGBT can withstand high temperature environments without compromising performance.

Maximum Collector-Emitter Voltage: 6500 V

High maximum collector-emitter voltage rating ensures the IGBT can handle high voltage applications with ease and reliability.

No. of Elements: 3

Having 3 elements allows for increased current handling capacity and improved efficiency in power control applications.

Nominal Turn On Time (ton): 1200 ns

Fast turn on time of 1200 ns ensures quick response and precise control in power switching applications.

Nominal Turn Off Time (toff): 8100 ns

The nominal turn off time of 8100 ns indicates efficient switching characteristics, reducing power losses and improving overall performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FZ750R65KE3NOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Maximum Collector-Emitter Voltage:

6500 V

JESD-30 Code:

R-XUFM-X9

No. of Elements:

3

No. of Terminals:

9

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

8100 ns

Nominal Turn On Time (ton):

1200 ns

Trade Compliance

FZ750R65KE3NOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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