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FP75R12KT4PB11BPSA1

Infineon Technologies

FP75R12KT4PB11BPSA1 by Infineon Technologies

Infineon Technologies' FP75R12KT4PB11BPSA1 is an N-CHANNEL IGBT with 7 elements, max voltage of 1200V, and turn off time of 620ns. It's used in applications requiring high power switching like motor drives and renewable energy systems due to its complex configuration and silicon material.

Median Price

$100.375

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 3 parts In-Stock

1+ parts

$121.150

100+ parts

$100.770

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-

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3

$121.150

$100.770

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Rochester

USA . 39 parts In-Stock

1+ parts

-

100+ parts

$80.300

1k+ parts

$71.850

10k+ parts

$67.620

39

-

$80.300

$71.850

$67.620

DigiKey

USA . 39 parts In-Stock

1+ parts

-

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-

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39

-

-

-

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Verical

USA . 39 parts In-Stock

1+ parts

-

100+ parts

$100.375

1k+ parts

$89.813

10k+ parts

$84.525

39

-

$100.375

$89.813

$84.525

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 349 parts In-Stock

1+ parts

$96.282

100+ parts

-

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349

$96.282

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Vyrian

USA . 6,062 parts In-Stock

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6,062

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 667 parts In-Stock

1+ parts

$91.215

100+ parts

-

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-

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667

$91.215

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Modulus Dynamics

Lithuania . 7,911 parts In-Stock

1+ parts

$165.085

100+ parts

$158.482

1k+ parts

$151.878

10k+ parts

-

7,911

$165.085

$158.482

$151.878

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Component Stockers USA

USA . 36 parts In-Stock

1+ parts

$184.720

100+ parts

-

1k+ parts

-

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36

$184.720

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Microchip USA

USA . 5,718 parts In-Stock

1+ parts

$260.355

100+ parts

-

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5,718

$260.355

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Native Components

USA . 723 parts In-Stock

1+ parts

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$3.962

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723

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$3.962

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Northwest PG Solutions

USA . 247 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$4.003

10k+ parts

-

247

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-

$4.003

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Overview

Discover the FP75R12KT4PB11BPSA1 by Infineon Technologies, a high-quality Insulated Gate Bipolar Transistor designed for complex applications. With 7 elements and a maximum collector-emitter voltage of 1200V, this N-CHANNEL transistor offers unparalleled performance and reliability. From power supplies to motor control, this versatile component provides exceptional value and efficiency for your projects. Trust in Infineon's expertise and innovation to elevate your designs to the next level.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speed, making them suitable for a wide range of applications.

Configuration: COMPLEX

Complex configuration allows for better performance and control in demanding applications, making this IGBT a versatile choice.

Package Shape: RECTANGULAR

Rectangular package shape provides easy integration and mounting options in various systems, ensuring a convenient installation process.

No. of Elements: 7

Having 7 elements allows for improved power handling capabilities and efficiency, making it ideal for high power applications.

Nominal Turn Off Time (toff): 620 ns

With a fast turn off time of 620 ns, this IGBT offers efficient switching performance, reducing power losses and improving overall system reliability.

No. of Terminals: 35

Having 35 terminals provides ample connectivity options, allowing for greater flexibility in system design and integration.

Package Style (Meter): FLANGE MOUNT

Flange mount package style offers a robust and secure mounting solution, ensuring stable operation even in harsh environments.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature of 150°C, this IGBT can withstand high temperature conditions, enhancing its reliability and longevity.

Maximum Collector-Emitter Voltage: 1200 V

A high maximum collector-emitter voltage of 1200 V allows for operation in high voltage applications, making it suitable for various power electronics systems.

Transistor Element Material: SILICON

Silicon is a commonly used material for IGBTs due to its high thermal conductivity and low ON-state voltage drop, ensuring efficient performance and reliability.

Terminal Position: UPPER

Having terminals positioned at the upper end simplifies the installation process and ensures proper connectivity, making this IGBT user-friendly.

Case Connection: ISOLATED

Isolated case connection ensures electrical safety and prevents short circuits, enhancing the overall reliability and performance of the IGBT.

Nominal Turn On Time (ton): 210 ns

With a fast turn on time of 210 ns, this IGBT enables quick and efficient switching, minimizing power losses and improving system efficiency.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP75R12KT4PB11BPSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

JESD-30 Code:

R-XUFM-X35

No. of Elements:

7

No. of Terminals:

35

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

620 ns

Nominal Turn On Time (ton):

210 ns

Trade Compliance

FP75R12KT4PB11BPSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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