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FP50R12KT3BOSA1

Infineon Technologies

FP50R12KT3BOSA1 by Infineon Technologies

Infineon's FP50R12KT3BOSA1 is an N-CHANNEL IGBT with 1200V max collector-emitter voltage, 75A max collector current, and 610ns nominal turn off time. Ideal for applications requiring high power switching such as industrial motor drives and renewable energy systems.

Median Price

$99.560

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 9 parts In-Stock

1+ parts

$49.560

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-

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9

$49.560

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Farnell

UK . 10 parts In-Stock

1+ parts

$83.200

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-

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10

$83.200

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-

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Rochester

USA . 3 parts In-Stock

1+ parts

$86.870

100+ parts

$85.140

1k+ parts

$83.400

10k+ parts

-

3

$86.870

$85.140

$83.400

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DigiKey

USA . 9 parts In-Stock

1+ parts

$91.760

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-

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9

$91.760

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Newark

USA . 10 parts In-Stock

1+ parts

$99.560

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10

$99.560

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Verical

USA . 10 parts In-Stock

1+ parts

$102.580

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10

$102.580

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Chip1Stop

Japan . 10 parts In-Stock

1+ parts

$105.000

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10

$105.000

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Element14

Singapore . 9 parts In-Stock

1+ parts

$139.740

100+ parts

$128.540

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9

$139.740

$128.540

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-

RS (Exports)

UK . 10 parts In-Stock

1+ parts

$207.962

100+ parts

$173.228

1k+ parts

$159.921

10k+ parts

-

10

$207.962

$173.228

$159.921

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 944 parts In-Stock

1+ parts

$78.641

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944

$78.641

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Nova Conductors

Japan . 34 parts In-Stock

1+ parts

$181.120

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34

$181.120

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TodayComponents

USA . 100 parts In-Stock

1+ parts

$196.990

100+ parts

$178.060

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100

$196.990

$178.060

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Vyrian

USA . 7,395 parts In-Stock

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7,395

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Chip Stock

USA . 132 parts In-Stock

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132

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Rutronik

Germany . 20 parts In-Stock

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100+ parts

$110.920

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20

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$110.920

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 20,887 parts In-Stock

1+ parts

$1.150

100+ parts

$1.104

1k+ parts

$1.058

10k+ parts

-

20,887

$1.150

$1.104

$1.058

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AZTECH Wire

Italy . 445 parts In-Stock

1+ parts

$18.508

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445

$18.508

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Ampacity Inc.

Singapore . 10 parts In-Stock

1+ parts

$42.130

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10

$42.130

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Corphita

USA . 551 parts In-Stock

1+ parts

$74.502

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551

$74.502

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Continental Prestige Electronics

USA . 13 parts In-Stock

1+ parts

$150.680

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13

$150.680

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

$181.120

100+ parts

-

1k+ parts

$172.064

10k+ parts

$168.442

2,000

$181.120

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$172.064

$168.442

Microchip USA

USA . 2,332 parts In-Stock

1+ parts

$271.680

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2,332

$271.680

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Perfect Parts

USA . 46 parts In-Stock

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46

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Overview

Experience unparalleled performance and reliability with the FP50R12KT3BOSA1 from Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality and innovation in their Insulated Gate Bipolar Transistors (IGBT). This N-CHANNEL transistor offers versatility and efficiency in various applications, providing customers with superior value and benefits. Elevate your projects with the FP50R12KT3BOSA1 and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Polarity: N-CHANNEL

N-CHANNEL IGBTs offer better performance and efficiency compared to P-CHANNEL IGBTs.

Configuration: COMPLEX

Complex configuration allows for enhanced control and flexibility in various applications.

Package Shape: RECTANGULAR

Rectangular package shape ensures easy integration and mounting in circuit layouts.

Nominal Turn Off Time (toff): 610 ns

Fast turn off time results in reduced power loss and improved switching efficiency.

No. of Terminals: 35

Higher number of terminals allow for more connection options and flexibility in circuit design.

Maximum Operating Temperature: 150 °C

High operating temperature range makes it suitable for demanding industrial environments.

Maximum Collector-Emitter Voltage: 1200 V

High collector-emitter voltage rating allows for use in high voltage applications.

Transistor Element Material: SILICON

Silicon material offers high reliability and performance in power electronics applications.

Maximum Collector Current (IC): 75 A

High collector current rating allows for handling high power levels in various applications.

Terminal Position: UPPER

Upper terminal position makes it convenient for mounting and connections in circuit layouts.

Case Connection: ISOLATED

Isolated case connection ensures safety and prevents electrical interference in circuits.

Nominal Turn On Time (ton): 140 ns

Fast turn on time helps in rapid switching and improved efficiency in power electronics applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP50R12KT3BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

JESD-30 Code:

R-XUFM-X35

No. of Elements:

7

No. of Terminals:

35

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

610 ns

Nominal Turn On Time (ton):

140 ns

Trade Compliance

FP50R12KT3BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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