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FP40R12KT3GBOSA1

Infineon Technologies

FP40R12KT3GBOSA1 by Infineon Technologies

FP40R12KT3GBOSA1 by Infineon Technologies is an N-CHANNEL IGBT with 7 elements, 35 terminals, and a max collector-emitter voltage of 1200V. It has a nominal turn off time of 610ns and a max collector current of 55A. This complex configuration transistor is commonly used in applications requiring high power switching capabilities at temperatures up to 150°C.

Median Price

$88.310

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 10 parts In-Stock

1+ parts

$81.570

100+ parts

-

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10

$81.570

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RS (Exports)

UK . 8 parts In-Stock

1+ parts

$88.260

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8

$88.260

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DigiKey

USA . 6 parts In-Stock

1+ parts

$88.360

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-

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6

$88.360

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Chip1Stop

Japan . 10 parts In-Stock

1+ parts

$125.950

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10

$125.950

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Rochester

USA . 213 parts In-Stock

1+ parts

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$70.760

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$63.310

10k+ parts

$59.580

213

-

$70.760

$63.310

$59.580

Verical

USA . 148 parts In-Stock

1+ parts

-

100+ parts

$88.450

1k+ parts

$79.138

10k+ parts

$74.475

148

-

$88.450

$79.138

$74.475

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 746 parts In-Stock

1+ parts

$83.762

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746

$83.762

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Nova Conductors

Japan . 700 parts In-Stock

1+ parts

$103.863

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700

$103.863

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TodayComponents

USA . 100 parts In-Stock

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$128.930

100+ parts

$116.540

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100

$128.930

$116.540

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TME

Poland . 2 parts In-Stock

1+ parts

$153.680

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2

$153.680

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Vyrian

USA . 5,220 parts In-Stock

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5,220

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Distributors (Availability)

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AZTECH Wire

Italy . 223 parts In-Stock

1+ parts

$14.049

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223

$14.049

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Ampacity Inc.

Singapore . 87 parts In-Stock

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$74.940

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87

$74.940

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Corphita

USA . 583 parts In-Stock

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$79.353

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583

$79.353

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Modulus Dynamics

Lithuania . 25,786 parts In-Stock

1+ parts

$103.863

100+ parts

$99.708

1k+ parts

$95.554

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25,786

$103.863

$99.708

$95.554

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Continental Prestige Electronics

USA . 7 parts In-Stock

1+ parts

$139.470

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7

$139.470

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Microchip USA

USA . 9,383 parts In-Stock

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$250.815

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9,383

$250.815

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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7,000

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Argo Parts USA

USA . 4,457 parts In-Stock

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4,457

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Perfect Parts

USA . 78 parts In-Stock

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78

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Overview

Unleash the power of cutting-edge technology with the FP40R12KT3GBOSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-notch quality and performance in the Insulated Gate Bipolar Transistor (IGBT) category. With its N-CHANNEL polarity, COMPLEX configuration, and 7 elements, this product offers unmatched reliability and efficiency. Whether you're looking to enhance your industrial processes or boost your electronic projects, the FP40R12KT3GBOSA1 provides the value, benefits, and advantages that customers crave. Upgrade to excellence with Infineon Technologies today!

Feature Benefit Bullets

Polarity: N-CHANNEL

This configuration allows for efficient switching and control of high power loads.

Configuration: COMPLEX

The complex configuration allows for versatile performance and functionality in various applications.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to mount and secure in place for stable operation.

No. of Elements: 7

With 7 elements, this IGBT can handle high current and voltage requirements with ease.

Nominal Turn Off Time (toff): 610 ns

The fast turn-off time ensures minimal power loss and efficient operation.

No. of Terminals: 35

The large number of terminals provide flexibility in connecting external components and circuits.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for convenient installation and heat dissipation.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures reliability and stability in extreme conditions.

Maximum Collector-Emitter Voltage: 1200 V

This high voltage rating makes it suitable for high power applications.

Transistor Element Material: SILICON

Silicon material offers high performance and durability for long-term use.

Maximum Collector Current (IC): 55 A

The high collector current rating ensures the IGBT can handle heavy loads.

Terminal Position: UPPER

The upper terminal position makes it easier to connect and integrate into existing systems.

Case Connection: ISOLATED

The isolated case connection provides safety and protection against electrical shocks.

Nominal Turn On Time (ton): 140 ns

The fast turn-on time enables quick response and efficient switching for improved performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP40R12KT3GBOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

JESD-30 Code:

R-XUFM-X35

No. of Elements:

7

No. of Terminals:

35

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

610 ns

Nominal Turn On Time (ton):

140 ns

Trade Compliance

FP40R12KT3GBOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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