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FP40R12KT3

Infineon Technologies

FP40R12KT3 by Infineon Technologies

Infineon Technologies' FP40R12KT3 is an N-CHANNEL IGBT with 1200V VCE, 55A IC, and 2.3V VCEsat. Ideal for high-power applications like motor drives due to its 210W power dissipation and fast switching times of 140ns turn-on and 610ns turn-off.

Median Price

$136.990

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Vyrian

USA . 1,630 parts In-Stock

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Digiode

USA . 343 parts In-Stock

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Chip Stock

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Nova Conductors

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Rutronik

Germany . 45 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 3 parts In-Stock

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Modulus Dynamics

Lithuania . 23,944 parts In-Stock

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$0.303

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$0.291

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$0.279

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AZTECH Wire

Italy . 351 parts In-Stock

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$12.027

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Lixinc

USA . 12,306 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,224 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,816 parts In-Stock

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Continental Prestige Electronics

USA . 4,626 parts In-Stock

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Argo Parts USA

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Assy Fe

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Corphita

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Kepictronics

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Authorized Procurement Solutions

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Overview

Unleash the power of cutting-edge technology with the FP40R12KT3 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like no other. This N-CHANNEL transistor boasts a complex configuration and a maximum VCEsat of 2.3V, making it perfect for a wide range of applications. With a maximum operating temperature of 150°C and a collector-emitter voltage of 1200V, this product offers unmatched reliability and performance. Upgrade your projects today with the FP40R12KT3 and experience the value and benefits that only Infineon can provide.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their low conduction losses and higher efficiency, making this product suitable for high power applications.

Maximum VCEsat: 2.3 V

Low VCEsat ensures minimal voltage drop across the collector-emitter junction, resulting in efficient operation and less power dissipation.

Nominal Turn Off Time (toff): 610 ns

Fast turn off time allows for precise control of switching operations and improves overall system performance.

Maximum Power Dissipation (Abs): 210 W

High power dissipation capability allows the IGBT to handle large amounts of power without overheating, making it reliable for demanding applications.

Maximum Collector-Emitter Voltage: 1200 V

High voltage rating ensures the IGBT can withstand high voltage spikes and fluctuations, making it suitable for industrial and automotive applications.

Maximum Collector Current (IC): 55 A

High collector current rating allows the IGBT to handle large current flows, making it ideal for high-power applications such as motor control and power electronics.

Nominal Turn On Time (ton): 140 ns

Fast turn on time enables quick switching operations and improves system efficiency, making this IGBT suitable for high-speed applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP40R12KT3 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X24

No. of Elements:

7

No. of Terminals:

24

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

610 ns

Nominal Turn On Time (ton):

140 ns

Maximum VCEsat:

2.3 V

Trade Compliance

FP40R12KT3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

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