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FP35R12W2T4PBPSA1

Infineon Technologies

FP35R12W2T4PBPSA1 by Infineon Technologies

Infineon Technologies' FP35R12W2T4PBPSA1 is an N-CHANNEL IGBT with 7 elements, max. collector current of 54A, and max. collector-emitter voltage of 1200V. Ideal for power control applications, it features a nominal turn on time of 43ns and a nominal turn off time of 510ns at a max operating temperature of 175°C.

Median Price

$47.590

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 18 parts In-Stock

1+ parts

$37.380

100+ parts

$30.590

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18

$37.380

$30.590

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Newark

USA . 8 parts In-Stock

1+ parts

$47.590

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8

$47.590

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Element14

Singapore . 18 parts In-Stock

1+ parts

$79.340

100+ parts

$64.920

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18

$79.340

$64.920

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Verical

USA . 22 parts In-Stock

1+ parts

-

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$58.638

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$53.025

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22

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$58.638

$53.025

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Rochester

USA . 3 parts In-Stock

1+ parts

-

100+ parts

$39.530

1k+ parts

$35.370

10k+ parts

$33.290

3

-

$39.530

$35.370

$33.290

DigiKey

USA . 3 parts In-Stock

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Digiode

USA . 509 parts In-Stock

1+ parts

$47.405

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509

$47.405

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Vyrian

USA . 6,470 parts In-Stock

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6,470

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Rutronik

Germany . 36 parts In-Stock

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$56.870

1k+ parts

$53.500

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36

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$56.870

$53.500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 22,415 parts In-Stock

1+ parts

$1.920

100+ parts

$1.843

1k+ parts

$1.766

10k+ parts

-

22,415

$1.920

$1.843

$1.766

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Corphita

USA . 470 parts In-Stock

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$44.910

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470

$44.910

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Continental Prestige Electronics

USA . 15 parts In-Stock

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$47.580

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15

$47.580

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Component Stockers USA

USA . 107 parts In-Stock

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$54.080

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107

$54.080

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Microchip USA

USA . 6,333 parts In-Stock

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6,333

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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500

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Northwest PG Solutions

USA . 475 parts In-Stock

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475

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Native Components

USA . 310 parts In-Stock

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310

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GreenTree Electronics

Israel . 90 parts In-Stock

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90

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Perfect Parts

USA . 20 parts In-Stock

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20

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Overview

Discover the unparalleled power control capabilities of the FP35R12W2T4PBPSA1 by Infineon Technologies, a leader in semiconductor manufacturing. This insulated gate bipolar transistor (IGBT) offers superior performance and reliability, making it ideal for a wide range of applications. From industrial machinery to renewable energy systems, this complex N-channel transistor provides unmatched efficiency and durability. Trust in Infineon's reputation for excellence and experience the value and benefits that the FP35R12W2T4PBPSA1 brings to your projects.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs have lower on-state voltage drop and higher current carrying capability compared to P-CHANNEL IGBTs.

Configuration: COMPLEX

Complex configuration allows for more intricate circuit designs and greater control over power flow, making it suitable for advanced power control applications.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring efficient and reliable operation in controlling high power loads.

Package Shape: RECTANGULAR

Rectangular package shape makes it easy to mount and integrate into existing circuit designs, providing versatility in installation.

Nominal Turn Off Time (toff): 510 ns

Fast turn-off time helps in reducing switching losses and improving efficiency in power control applications.

No. of Terminals: 23

Higher number of terminals allow for more connection options and flexibility in circuit design, accommodating complex power control requirements.

Maximum Operating Temperature: 175 °C

High maximum operating temperature ensures stable performance under varying temperature conditions, making it suitable for demanding industrial applications.

Maximum Collector-Emitter Voltage: 1200 V

High maximum voltage rating allows for control of high voltage circuits, making it suitable for power control applications.

Transistor Element Material: SILICON

Silicon material offers high thermal conductivity and durability, ensuring reliable performance under high power conditions.

Maximum Collector Current (IC): 54 A

High maximum collector current rating allows for control of high current loads, making it suitable for power control applications.

Terminal Position: UPPER

Upper terminal position makes it easy to connect and integrate into circuit designs, providing convenient installation.

Case Connection: ISOLATED

Isolated case connection helps in reducing interference and ensuring safety in circuit designs, making it suitable for high power applications.

Nominal Turn On Time (ton): 43 ns

Fast turn-on time ensures quick response in power control applications, improving efficiency and accuracy in controlling power flow.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP35R12W2T4PBPSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

JESD-30 Code:

R-XUFM-X23

No. of Elements:

7

No. of Terminals:

23

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

510 ns

Nominal Turn On Time (ton):

43 ns

Trade Compliance

FP35R12W2T4PBPSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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