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FP35R12W2T4_B11

Infineon Technologies

FP35R12W2T4_B11 by Infineon Technologies

Infineon's FP35R12W2T4_B11 IGBT features 1200V VCE, 54A IC, and 215W power dissipation. Ideal for high-power applications like motor drives and renewable energy systems due to its N-CHANNEL polarity and fast switching times of 43ns turn-on and 510ns turn-off.

Median Price

$56.430

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

< 1k

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 50 parts In-Stock

1+ parts

$61.440

100+ parts

-

1k+ parts

$46.690

10k+ parts

-

50

$61.440

-

$46.690

-

RS (Exports)

UK . 22 parts In-Stock

1+ parts

-

100+ parts

$51.419

1k+ parts

-

10k+ parts

-

22

-

$51.419

-

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 688 parts In-Stock

1+ parts

$23.800

100+ parts

-

1k+ parts

-

10k+ parts

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688

$23.800

-

-

-

Digiode

USA . 214 parts In-Stock

1+ parts

$61.636

100+ parts

-

1k+ parts

-

10k+ parts

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214

$61.636

-

-

-

Forefront Electronics and Design

USA . 1 parts In-Stock

1+ parts

$110.250

100+ parts

-

1k+ parts

-

10k+ parts

-

1

$110.250

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Modulus Dynamics

Lithuania . 941 parts In-Stock

1+ parts

$1.496

100+ parts

$1.436

1k+ parts

$1.376

10k+ parts

-

941

$1.496

$1.436

$1.376

-

Native Components

USA . 891 parts In-Stock

1+ parts

$32.250

100+ parts

-

1k+ parts

-

10k+ parts

$30.960

891

$32.250

-

-

$30.960

Northwest PG Solutions

USA . 1,529 parts In-Stock

1+ parts

$35.475

100+ parts

-

1k+ parts

-

10k+ parts

-

1,529

$35.475

-

-

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Corphita

USA . 634 parts In-Stock

1+ parts

$58.392

100+ parts

-

1k+ parts

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10k+ parts

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634

$58.392

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Perfect Parts

USA . 454 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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454

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Authorized Procurement Solutions

USA . 20 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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20

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Overview

Enhance your electronic designs with the FP35R12W2T4_B11 by Infineon Technologies. As a leading manufacturer in the industry, Infineon Technologies guarantees top-notch quality and reliability. This Insulated Gate Bipolar Transistor (IGBT) offers unparalleled performance, making it ideal for a wide range of applications. From power supplies to motor control, this product provides value, efficiency, and superior functionality. Trust Infineon Technologies to deliver innovative solutions that exceed expectations. Elevate your projects with the FP35R12W2T4_B11 today!

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

Allows for effective control of current flow, enhancing performance and efficiency.

Maximum VCEsat: 2.25 V

Low saturation voltage results in reduced power loss and higher efficiency.

Nominal Turn Off Time (toff): 510 ns

Fast turn-off time helps in efficient switching and reducing switching losses.

Maximum Power Dissipation (Abs): 215 W

High power dissipation capability allows for handling high power applications effectively.

Maximum Collector-Emitter Voltage: 1200 V

Ability to handle high voltages makes it suitable for various industrial applications.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP35R12W2T4_B11 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X35

No. of Elements:

7

No. of Terminals:

35

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

510 ns

Nominal Turn On Time (ton):

43 ns

Maximum VCEsat:

2.25 V

Trade Compliance

FP35R12W2T4_B11 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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