Loading...

FP35R12KT4PBPSA1

Infineon Technologies

FP35R12KT4PBPSA1 by Infineon Technologies

FP35R12KT4PBPSA1 by Infineon Technologies is an N-CHANNEL IGBT with 7 elements, max. collector-emitter voltage of 1200V, and nominal turn-off time of 620ns. It is used in applications requiring high power switching such as industrial motor drives and renewable energy systems due to its complex configuration and silicon transistor element material.

Median Price

$80.025

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 9 parts In-Stock

1+ parts

$82.880

100+ parts

$61.680

1k+ parts

-

10k+ parts

-

9

$82.880

$61.680

-

-

Rochester

USA . 11 parts In-Stock

1+ parts

-

100+ parts

$53.960

1k+ parts

$48.280

10k+ parts

$45.440

11

-

$53.960

$48.280

$45.440

DigiKey

USA . 11 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

11

-

-

-

-

Verical

USA . 7 parts In-Stock

1+ parts

-

100+ parts

$80.025

1k+ parts

$72.362

10k+ parts

-

7

-

$80.025

$72.362

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 62 parts In-Stock

1+ parts

$64.704

100+ parts

-

1k+ parts

-

10k+ parts

-

62

$64.704

-

-

-

Vyrian

USA . 4,980 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,980

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 200 parts In-Stock

1+ parts

$0.052

100+ parts

-

1k+ parts

-

10k+ parts

$0.050

200

$0.052

-

-

$0.050

Modulus Dynamics

Lithuania . 3,480 parts In-Stock

1+ parts

$1.033

100+ parts

$0.992

1k+ parts

$0.950

10k+ parts

-

3,480

$1.033

$0.992

$0.950

-

Corphita

USA . 424 parts In-Stock

1+ parts

$61.299

100+ parts

-

1k+ parts

-

10k+ parts

-

424

$61.299

-

-

-

Microchip USA

USA . 8,250 parts In-Stock

1+ parts

$219.995

100+ parts

-

1k+ parts

-

10k+ parts

-

8,250

$219.995

-

-

-

Northwest PG Solutions

USA . 1,643 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,643

-

-

-

-

Overview

Unleash the power of cutting-edge technology with the FP35R12KT4PBPSA1 by Infineon Technologies. Crafted with precision and expertise, this insulated gate bipolar transistor (IGBT) offers unparalleled performance and reliability. With a maximum collector-emitter voltage of 1200V and nominal turn on/off times of 210ns/620ns, this N-channel transistor is ideal for a wide range of applications. Whether you're looking to optimize power management in industrial equipment or enhance efficiency in renewable energy systems, this versatile component is sure to exceed your expectations. Upgrade to the FP35R12KT4PBPSA1 today and experience the difference firsthand.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for their high efficiency and fast switching speeds, making them suitable for a wide range of applications.

Configuration: COMPLEX

The complex configuration allows for versatility in operation and can handle a variety of tasks efficiently.

Package Shape: RECTANGULAR

The rectangular package shape helps in easy mounting and installation, saving time and effort during assembly.

No. of Elements: 7

Having 7 elements provides more flexibility and capability in handling complex tasks and higher power requirements.

Nominal Turn Off Time (toff): 620 ns

The low turn off time ensures rapid switching and efficient performance of the IGBT.

No. of Terminals: 23

With 23 terminals, this IGBT offers versatile connectivity options and can be integrated into various circuit configurations.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides secure and reliable mounting in industrial applications, ensuring durability and stability.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this IGBT can withstand high temperature environments without compromising performance.

Maximum Collector-Emitter Voltage: 1200 V

The high collector-emitter voltage rating of 1200V makes this IGBT suitable for high power applications where voltage spikes are common.

Transistor Element Material: SILICON

Silicon is a reliable and widely used material in semiconductor devices, ensuring the durability and long-term performance of this IGBT.

Terminal Position: UPPER

The upper terminal position simplifies the connection process and allows for easy access during installation and maintenance.

Case Connection: ISOLATED

Isolated case connection provides safety and protection against electrical hazards, making this IGBT suitable for critical applications.

Nominal Turn On Time (ton): 210 ns

The low turn on time of 210 ns ensures quick response and efficient operation of the IGBT, improving overall system performance.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP35R12KT4PBPSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector-Emitter Voltage:

1200 V

Configuration:

JESD-30 Code:

R-XUFM-X23

No. of Elements:

7

No. of Terminals:

23

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

620 ns

Nominal Turn On Time (ton):

210 ns

Trade Compliance

FP35R12KT4PBPSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20