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FP30R06W1E3_B11

Infineon Technologies

FP30R06W1E3_B11 by Infineon Technologies

FP30R06W1E3_B11 by Infineon Technologies is an N-CHANNEL IGBT with 600V VCEsat, 37A IC, and 115W power dissipation. Ideal for POWER CONTROL applications due to its fast turn-off time of 245ns and high operating temperature of 175°C. The transistor's complex configuration and UL RECOGNIZED standard make it suitable for various industrial uses.

Median Price

$34.220

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

< 1k

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Mouser Electronics

USA . 59 parts In-Stock

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$34.220

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59

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Distributors (In-Stock)

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Digiode

USA . 782 parts In-Stock

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$31.787

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$31.787

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Vyrian

USA . 96 parts In-Stock

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$33.460

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Native Components

USA . 165 parts In-Stock

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$0.312

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$0.300

165

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$0.300

Northwest PG Solutions

USA . 1,967 parts In-Stock

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$0.343

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$0.303

1,967

$0.343

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Modulus Dynamics

Lithuania . 12,000 parts In-Stock

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$1.816

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$1.743

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$1.671

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12,000

$1.816

$1.743

$1.671

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Corphita

USA . 855 parts In-Stock

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$30.114

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855

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Lixinc

USA . 10,577 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Authorized Procurement Solutions

USA . 100 parts In-Stock

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Perfect Parts

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Overview

Enhance your power control systems with the FP30R06W1E3_B11 by Infineon Technologies! As a leader in Insulated Gate Bipolar Transistors, Infineon guarantees top-notch quality and reliability. This N-CHANNEL transistor boasts a complex configuration and is perfect for applications requiring efficient power control. With a low VCEsat of 2V and a maximum operating temperature of 175°C, this transistor offers exceptional performance. Upgrade your systems today and experience the superior benefits and value that Infineon's FP30R06W1E3_B11 brings to the table.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs are known for high efficiency and fast switching speeds, making this product suitable for power control applications.

Configuration: COMPLEX

Complex configuration allows for more precise control and customization of power output, making this IGBT ideal for power control purposes.

Maximum VCEsat: 2 V

Low VCEsat value indicates minimal power loss during operation, resulting in higher efficiency and reduced heat generation.

Package Shape: RECTANGULAR

Rectangular shape provides a compact and space-saving design, making it convenient for integration into various electronic systems.

Nominal Turn Off Time (toff): 245 ns

Fast turn-off time enables quick switching and response times, which is crucial for power control applications requiring precise timing.

Maximum Power Dissipation (Abs): 115 W

High power dissipation capacity allows the IGBT to handle large amounts of power without overheating, ensuring long-term reliability.

Maximum Operating Temperature: 175 °C

High maximum operating temperature tolerance ensures stable performance even in demanding environments with elevated temperatures.

Maximum Collector-Emitter Voltage: 600 V

High collector-emitter voltage rating enables the IGBT to handle high voltage levels safely, making it suitable for power control applications.

Maximum Gate-Emitter Voltage: 20 V

Moderate gate-emitter voltage rating provides sufficient control over the IGBT's operation, allowing for precise modulation of power output.

Maximum Collector Current (IC): 37 A

High collector current capacity allows the IGBT to handle significant current flows, making it suitable for power control applications with high power requirements.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP30R06W1E3_B11 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X23

No. of Elements:

7

No. of Terminals:

23

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Reference Standard:

UL RECOGNIZED

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

245 ns

Nominal Turn On Time (ton):

42 ns

Maximum VCEsat:

2 V

Trade Compliance

FP30R06W1E3_B11 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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