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FP30R06KE3BOSA1

Infineon Technologies

FP30R06KE3BOSA1 by Infineon Technologies

Infineon's FP30R06KE3BOSA1 is an N-CHANNEL IGBT with 600V max collector-emitter voltage, 37A max collector current, and 750ns nominal turn-off time. Its complex configuration makes it suitable for high-power applications like industrial motor drives and renewable energy systems.

Median Price

$59.326

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 7 parts In-Stock

1+ parts

-

100+ parts

$51.390

1k+ parts

$45.980

10k+ parts

$43.270

7

-

$51.390

$45.980

$43.270

DigiKey

USA . 7 parts In-Stock

1+ parts

-

100+ parts

-

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-

7

-

-

-

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Verical

USA . 7 parts In-Stock

1+ parts

-

100+ parts

$67.263

1k+ parts

$60.813

10k+ parts

-

7

-

$67.263

$60.813

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 992 parts In-Stock

1+ parts

$54.378

100+ parts

-

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-

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992

$54.378

-

-

-

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$78.683

100+ parts

-

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50

$78.683

-

-

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Vyrian

USA . 4,108 parts In-Stock

1+ parts

-

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4,108

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 141 parts In-Stock

1+ parts

$0.430

100+ parts

-

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-

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141

$0.430

-

-

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Modulus Dynamics

Lithuania . 11,531 parts In-Stock

1+ parts

$1.601

100+ parts

$1.537

1k+ parts

$1.473

10k+ parts

-

11,531

$1.601

$1.537

$1.473

-

Corohmni

South Africa . 115 parts In-Stock

1+ parts

$1.928

100+ parts

-

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-

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115

$1.928

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AZTECH Wire

Italy . 213 parts In-Stock

1+ parts

$8.824

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-

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213

$8.824

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Ampacity Inc.

Singapore . 7 parts In-Stock

1+ parts

$48.650

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7

$48.650

-

-

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Semicontronic

India . 7 parts In-Stock

1+ parts

$48.650

100+ parts

$47.434

1k+ parts

$47.190

10k+ parts

-

7

$48.650

$47.434

$47.190

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Corphita

USA . 242 parts In-Stock

1+ parts

$51.516

100+ parts

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242

$51.516

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Bastille Electronics

Australia . 76 parts In-Stock

1+ parts

$78.680

100+ parts

$74.746

1k+ parts

-

10k+ parts

$70.025

76

$78.680

$74.746

-

$70.025

Continental Prestige Electronics

USA . 4,981 parts In-Stock

1+ parts

$78.683

100+ parts

-

1k+ parts

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10k+ parts

$77.109

4,981

$78.683

-

-

$77.109

QUARKTWIN TECHNOLOGY LTD

USA . 8,831 parts In-Stock

1+ parts

-

100+ parts

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8,831

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

1+ parts

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7,000

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Microchip USA

USA . 6,881 parts In-Stock

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6,881

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Argo Parts USA

USA . 4,657 parts In-Stock

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4,657

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Overview

Experience exceptional performance and reliability with the FP30R06KE3BOSA1 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality Insulated Gate Bipolar Transistors (IGBT) like no other. This N-CHANNEL transistor offers a complex configuration with 7 elements, making it perfect for a wide range of applications. From industrial machinery to renewable energy systems, this product provides unmatched value, efficiency, and durability. Trust Infineon to power your projects with cutting-edge technology and superior engineering.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-Channel IGBTs are known for their high power efficiency and performance, making this product suitable for applications requiring high power handling.

Configuration: COMPLEX

Complex configuration allows for better control and optimization of the IGBT's performance, making it suitable for advanced and demanding applications.

Nominal Turn Off Time (toff): 750 ns

The low turn-off time of 750 ns ensures efficient and fast switching capabilities, making this product ideal for applications requiring quick response times.

Maximum Collector-Emitter Voltage: 600 V

With a high collector-emitter voltage rating of 600 V, this IGBT is suitable for high voltage applications, providing enhanced reliability and protection against voltage spikes.

Maximum Collector Current (IC): 37 A

The high collector current rating of 37 A allows for handling high current loads, making this IGBT suitable for power electronics applications that require high current capabilities.

Nominal Turn On Time (ton): 170 ns

The low turn-on time of 170 ns ensures fast switching speeds and efficient operation, making this IGBT suitable for applications requiring precise control and rapid response.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FP30R06KE3BOSA1 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Configuration:

JESD-30 Code:

R-XUFM-X24

No. of Elements:

7

No. of Terminals:

24

Maximum Operating Temperature:

175 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

750 ns

Nominal Turn On Time (ton):

170 ns

Trade Compliance

FP30R06KE3BOSA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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