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FD800R17KE3_B2

Infineon Technologies

FD800R17KE3_B2 by Infineon Technologies

Infineon's FD800R17KE3_B2 IGBT features 1700V VCE, 1200A IC, and 5200W power dissipation. Ideal for high-power applications like industrial motor drives due to its N-CHANNEL polarity and fast switching times of 900ns turn-on and 1900ns turn-off.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 596 parts In-Stock

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596

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Vyrian

USA . 88 parts In-Stock

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88

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ACDS - Activité Composants Distribution Service

France . 60 parts In-Stock

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60

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Distributors (Availability)

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Modulus Dynamics

Lithuania . 5,559 parts In-Stock

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$1.124

100+ parts

$1.079

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$1.034

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5,559

$1.124

$1.079

$1.034

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Andel Nordic

Denmark . 4,336 parts In-Stock

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$54.460

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$38.122

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$38.122

4,336

$54.460

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$38.122

$38.122

Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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Corphita

USA . 648 parts In-Stock

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648

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Netroflash

USA . 100 parts In-Stock

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100

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Overview

Upgrade your power system with the FD800R17KE3_B2 from Infineon Technologies, a leading manufacturer of Insulated Gate Bipolar Transistors (IGBTs). With its N-CHANNEL polarity and single configuration with built-in diode, this IGBT offers exceptional performance and reliability. Ideal for applications requiring high power dissipation and efficiency, this rectangular package style with flange mount ensures easy installation. Experience the benefits of a maximum collector-emitter voltage of 1700V and maximum collector current of 1200A, providing unmatched value and advantages to customers in various industries. Trust in the quality and innovation of Infineon Technologies to elevate your power systems to new heights.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL IGBTs have lower conduction losses compared to P-CHANNEL IGBTs, making them more efficient for many applications.

Maximum VCEsat: 2.45 V

Low VCEsat means lower power dissipation and better efficiency in the switching operation of the IGBT.

Nominal Turn Off Time (toff): 1900 ns

Faster turn-off time results in reduced switching losses and allows for high-frequency operation in applications.

Maximum Collector Current (IC): 1200 A

High collector current rating allows for handling high power levels in industrial and energy applications.

Maximum Power Dissipation (Abs): 5200 W

High power dissipation capability ensures the IGBT can handle high power loads without overheating.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FD800R17KE3_B2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Infineon Technologies

Specs

Case Connection:

ISOLATED

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

1700 V

Maximum Gate-Emitter Voltage:

20 V

JESD-30 Code:

R-XUFM-X7

No. of Elements:

1

No. of Terminals:

7

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Insulated Gate BIP Transistors

Surface Mount:

NO

Terminal Form:

UNSPECIFIED

Terminal Position:

UPPER

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

1900 ns

Nominal Turn On Time (ton):

900 ns

Maximum VCEsat:

2.45 V

Trade Compliance

FD800R17KE3_B2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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