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ESD231B1W0201E6327XTSA1

Infineon Technologies

ESD231B1W0201E6327XTSA1 by Infineon Technologies

Infineon's ESD231B1W0201E6327XTSA1 is a single transient suppression device with 132W peak power dissipation and 0.02uA reverse current. Ideal for protecting sensitive electronics from voltage spikes, it operates b/w -55°C to 125°C. Compliant with IEC standards, this bidirectional diode has a max clamping voltage of 10V and uses avalanche technology.

Median Price

$0.092

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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DigiKey

USA . 174,176 parts In-Stock

1+ parts

$0.180

100+ parts

$0.066

1k+ parts

$0.041

10k+ parts

$0.035

174,176

$0.180

$0.066

$0.041

$0.035

Mouser Electronics

USA . 66,051 parts In-Stock

1+ parts

$0.180

100+ parts

$0.066

1k+ parts

$0.041

10k+ parts

$0.030

66,051

$0.180

$0.066

$0.041

$0.030

Newark

USA . 15,020 parts In-Stock

1+ parts

$0.185

100+ parts

$0.068

1k+ parts

$0.044

10k+ parts

-

15,020

$0.185

$0.068

$0.044

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Arrow

USA . 2,160,000 parts In-Stock

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2,160,000

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Verical

USA . 2,160,000 parts In-Stock

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Rochester

USA . 114,315 parts In-Stock

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-

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$0.029

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$0.024

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$0.022

114,315

-

$0.029

$0.024

$0.022

RS (Exports)

UK . 15,000 parts In-Stock

1+ parts

-

100+ parts

$0.127

1k+ parts

$0.076

10k+ parts

$0.057

15,000

-

$0.127

$0.076

$0.057

Distrelec

Netherlands . 15,000 parts In-Stock

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-

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15,000

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Farnell

UK . 7,309 parts In-Stock

1+ parts

-

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-

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$0.028

10k+ parts

$0.027

7,309

-

-

$0.028

$0.027

Element14

Singapore . 7,309 parts In-Stock

1+ parts

-

100+ parts

$0.057

1k+ parts

$0.051

10k+ parts

$0.040

7,309

-

$0.057

$0.051

$0.040

Chip1Stop

Japan . 2,646 parts In-Stock

1+ parts

-

100+ parts

$0.033

1k+ parts

$0.028

10k+ parts

$0.025

2,646

-

$0.033

$0.028

$0.025

Distributors (In-Stock)

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Digiode

USA . 162 parts In-Stock

1+ parts

$0.023

100+ parts

-

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-

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162

$0.023

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Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$0.040

100+ parts

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100

$0.040

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IBS Electronics

USA . 175,476 parts In-Stock

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175,476

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Vyrian

USA . 69,131 parts In-Stock

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TME

Poland . 15,000 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 69,043 parts In-Stock

1+ parts

$0.020

100+ parts

$0.020

1k+ parts

$0.019

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-

69,043

$0.020

$0.020

$0.019

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Aztec Data Supply Inc.

USA . 5,303 parts In-Stock

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$0.020

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5,303

$0.020

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Corphita

USA . 37 parts In-Stock

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$0.022

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37

$0.022

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Argo Parts USA

USA . 4,985 parts In-Stock

1+ parts

$0.040

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$0.039

4,985

$0.040

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$0.039

Modulus Dynamics

Lithuania . 4,892 parts In-Stock

1+ parts

$0.040

100+ parts

$0.038

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$0.037

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4,892

$0.040

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$0.037

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Corohmni

South Africa . 183 parts In-Stock

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Bastille Electronics

Australia . 26 parts In-Stock

1+ parts

$0.040

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$0.038

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$0.036

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$0.036

26

$0.040

$0.038

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$0.036

Ampacity Inc.

Singapore . 68,960 parts In-Stock

1+ parts

$0.044

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68,960

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Epart123

USA . 210,000 parts In-Stock

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Perfect Parts

USA . 50,319 parts In-Stock

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GreenTree Electronics

Israel . 15,000 parts In-Stock

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Continental Prestige Electronics

USA . 9,760 parts In-Stock

1+ parts

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$0.037

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$0.023

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$0.017

9,760

-

$0.037

$0.023

$0.017

Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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Overview

Discover the superior protection and reliability of the ESD231B1W0201E6327XTSA1 from Infineon Technologies. As a leader in transient suppression devices, Infineon ensures top-notch quality and performance in all their products. This single-configured chip carrier is ideal for a wide range of applications, offering maximum non-repetitive peak reverse power dissipation of 132W and a low maximum reverse current of 0.02uA. With a bidirectional polarity and high clamping voltage of 10V, this Trans Voltage Suppressor Diode provides customers with peace of mind and unbeatable value. Choose Infineon for unparalleled protection against electrical surges and enjoy the benefits of cutting-edge technology.

Feature Benefit Bullets

Config: SINGLE

Single configuration makes it easy to install and use without any complex wiring or connections.

Surface Mount: YES

Surface mount capability allows for easy integration onto circuit boards, saving space and reducing assembly time.

Maximum Non Repetitive Peak Reverse Power Dissipation: 132 W

High power dissipation capacity ensures protection against sudden surges or spikes in voltage.

Maximum Reverse Current: 0.02 uA

Low reverse current ensures minimal power loss and efficient operation of the device.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and organization within a circuit design.

Reverse Test Voltage: 5.5 V

High reverse test voltage rating provides reliable protection against reverse voltage incidents.

Maximum Operating Temperature: 125 °C

Wide operating temperature range ensures stability and performance in varying environmental conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows for use in cold climates without compromising performance.

Reference Standard: IEC-61000-4-2, 4-4, 4-5

Conforms to industry standards for transient suppression devices, ensuring reliability and compatibility.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

Trans voltage suppressor diode type provides effective protection against transient voltage spikes.

Technology: AVALANCHE

Avalanche technology ensures fast response to voltage surges and spikes, protecting connected devices.

Maximum Clamping Voltage: 10 V

Low maximum clamping voltage ensures that connected devices are not exposed to excessive voltage levels.

Technical Specifications

Transient Suppression Devices ESD231B1W0201E6327XTSA1 attributes and parameters. Explore more Transient Suppression Devices devices from Infineon Technologies

Specs

Maximum Clamping Voltage:

10 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-XBCC-N2

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

132 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

CHIP CARRIER

Polarity:

BIDIRECTIONAL

Reference Standard:

IEC-61000-4-2, 4-4, 4-5

Maximum Repetitive Peak Reverse Voltage:

5.5 V

Maximum Reverse Current:

.02 uA

Reverse Test Voltage:

5.5 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Form:

Terminal Position:

Trade Compliance

ESD231B1W0201E6327XTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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