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ESD203B102ELE6327XTMA1

Infineon Technologies

ESD203B102ELE6327XTMA1 by Infineon Technologies

Infineon's ESD203B102ELE6327XTMA1 is a single bidirectional transient voltage suppressor diode with 12V max repetitive peak reverse voltage and 115W max non-repetitive peak reverse power dissipation. It operates in temperatures ranging from -55 to 125 °C, making it suitable for protecting electronic circuits from voltage spikes in various applications.

Median Price

$0.086

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 235 parts In-Stock

1+ parts

$0.152

100+ parts

$0.072

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235

$0.152

$0.072

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Rochester

USA . 68,266 parts In-Stock

1+ parts

-

100+ parts

$0.090

1k+ parts

$0.074

10k+ parts

$0.066

68,266

-

$0.090

$0.074

$0.066

Verical

USA . 30,000 parts In-Stock

1+ parts

-

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$0.083

30,000

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$0.083

EBV Elektronik

Germany . 15,000 parts In-Stock

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15,000

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Chip1Stop

Japan . 9,800 parts In-Stock

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$0.072

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9,800

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$0.072

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Distributors (In-Stock)

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Nova Conductors

Japan . 88 parts In-Stock

1+ parts

$0.110

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88

$0.110

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Digiode

USA . 361 parts In-Stock

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$0.191

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361

$0.191

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IBS Electronics

USA . 30,000 parts In-Stock

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Vyrian

USA . 19,984 parts In-Stock

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NAC Semi

USA . 15,000 parts In-Stock

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TME

Poland . 15,000 parts In-Stock

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Sensible Micro Corp

USA . 9,186 parts In-Stock

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Prism Electronics

USA . 38 parts In-Stock

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38

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 4,663 parts In-Stock

1+ parts

$0.050

100+ parts

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4,663

$0.050

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Semicontronic

India . 18,870 parts In-Stock

1+ parts

$0.062

100+ parts

$0.060

1k+ parts

$0.060

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18,870

$0.062

$0.060

$0.060

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Ampacity Inc.

Singapore . 20,091 parts In-Stock

1+ parts

$0.075

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20,091

$0.075

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Modulus Dynamics

Lithuania . 7,277 parts In-Stock

1+ parts

$0.104

100+ parts

$0.100

1k+ parts

$0.096

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7,277

$0.104

$0.100

$0.096

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Continental Prestige Electronics

USA . 2,681 parts In-Stock

1+ parts

$0.110

100+ parts

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$0.108

2,681

$0.110

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-

$0.108

Argo Parts USA

USA . 2,422 parts In-Stock

1+ parts

$0.110

100+ parts

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1k+ parts

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10k+ parts

$0.107

2,422

$0.110

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-

$0.107

Advanced Electronics

New Zealand . 100 parts In-Stock

1+ parts

$0.112

100+ parts

$0.112

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$0.112

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100

$0.112

$0.112

$0.112

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Corohmni

South Africa . 540 parts In-Stock

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$0.121

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540

$0.121

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Corphita

USA . 421 parts In-Stock

1+ parts

$0.181

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421

$0.181

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Component Stockers USA

USA . 227,733 parts In-Stock

1+ parts

$0.400

100+ parts

$0.130

1k+ parts

$0.080

10k+ parts

$0.060

227,733

$0.400

$0.130

$0.080

$0.060

Eastek

USA . 30,000 parts In-Stock

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Perfect Parts

USA . 2,595 parts In-Stock

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2,595

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Authorized Procurement Solutions

USA . 2,000 parts In-Stock

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2,000

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Netroflash

USA . 50 parts In-Stock

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$0.108

1k+ parts

$0.105

10k+ parts

$0.102

50

-

$0.108

$0.105

$0.102

Overview

Experience the unparalleled quality and reliability of Infineon Technologies with the ESD203B102ELE6327XTMA1 Transient Suppression Device. Designed for robust protection against voltage transients, this single-config chip carrier offers peace of mind for a wide range of applications. With a maximum operating temperature of 125°C and a minimum breakdown voltage of 13.5V, this device ensures optimal performance in extreme conditions. Trust in the gold terminal finish and avalanche technology to safeguard your electronics from harmful surges. Upgrade to the ESD203B102ELE6327XTMA1 today and enjoy the benefits of superior protection and longevity for your valuable equipment.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this product lightweight and durable, ideal for various applications.

Config: SINGLE

Single configuration simplifies installation and reduces complexity in circuit design, making this product user-friendly.

Surface Mount: YES

With surface mount capability, this product can be easily integrated onto circuit boards for space-saving and efficient design.

Max Non Repetitive Peak Reverse Power Dissipation: 115 W

The high power dissipation capacity of 115W ensures reliable protection against surge currents, making this product a reliable choice for transient suppression.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for easy placement and secure mounting within electronic devices.

No. of Terminals: 2

With 2 terminals, this product offers simple connectivity and easy integration into existing circuit configurations.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides a compact and efficient design, suitable for applications with limited space.

Max Operating Temperature: 125 °C

With a maximum operating temperature of 125°C, this product can withstand high temperatures, ensuring reliable performance in various environments.

Min Operating Temperature: -55 °C

The low operating temperature of -55°C allows this product to function effectively even in cold environments.

Terminal Finish: GOLD

The gold terminal finish enhances conductivity and ensures long-term durability, making this product a reliable choice for transient suppression.

Terminal Position: BOTTOM

The bottom terminal position allows for secure placement and efficient wiring, ensuring a reliable connection within electronic systems.

Min Breakdown Voltage: 13.5 V

The minimum breakdown voltage of 13.5V provides effective protection against voltage spikes, making this product suitable for transient suppression applications.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

The use of Trans Voltage Suppressor Diode ensures efficient transient voltage suppression, making this product an effective solution for surge protection.

Technology: AVALANCHE

Utilizing avalanche technology enhances the performance and reliability of this product in transient suppression applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies installation and reduces soldering requirements, making this product easy to use and reliable.

Max Repetitive Peak Reverse Voltage: 12 V

With a maximum repetitive peak reverse voltage of 12V, this product offers effective protection against reverse voltage spikes.

Polarity: BIDIRECTIONAL

The bidirectional polarity allows for protection against voltage surges in both directions, making this product versatile and efficient for transient suppression.

Diode Element Material: SILICON

The use of silicon diode element material ensures high-performance transient suppression capabilities, making this product a reliable choice for surge protection.

Technical Specifications

Transient Suppression Devices ESD203B102ELE6327XTMA1 attributes and parameters. Explore more Transient Suppression Devices devices from Infineon Technologies

Specs

Additional Features:

LOW CAPACITANCE

Minimum Breakdown Voltage:

13.5 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PBCC-N2

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

115 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Polarity:

BIDIRECTIONAL

Maximum Repetitive Peak Reverse Voltage:

12 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

GOLD

Terminal Form:

Terminal Position:

Trade Compliance

ESD203B102ELE6327XTMA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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