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ESD207B102ELSE6327XTSA1

Infineon Technologies

ESD207B102ELSE6327XTSA1 by Infineon Technologies

Infineon's ESD207B102ELSE6327XTSA1 is a single bidirectional transient voltage suppressor diode with 3.3V max repetitive peak reverse voltage and avalanche technology. It operates b/w -40°C to 125°C, ideal for protecting electronic components in various applications requiring robust ESD protection.

Median Price

$0.053

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 2,213,344 parts In-Stock

1+ parts

-

100+ parts

$0.053

1k+ parts

$0.044

10k+ parts

$0.039

2,213,344

-

$0.053

$0.044

$0.039

DigiKey

USA . 2,200,769 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.070

2,200,769

-

-

-

$0.070

Verical

USA . 2,200,769 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.049

2,200,769

-

-

-

$0.049

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$0.032

100+ parts

-

1k+ parts

-

10k+ parts

-

300

$0.032

-

-

-

Digiode

USA . 236 parts In-Stock

1+ parts

$0.041

100+ parts

-

1k+ parts

-

10k+ parts

-

236

$0.041

-

-

-

Chip Stock

USA . 190,320 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

190,320

-

-

-

-

Vyrian

USA . 3,252 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,252

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Continental Prestige Electronics

USA . 6,040 parts In-Stock

1+ parts

$0.032

100+ parts

-

1k+ parts

-

10k+ parts

$0.032

6,040

$0.032

-

-

$0.032

Argo Parts USA

USA . 2,085 parts In-Stock

1+ parts

$0.032

100+ parts

-

1k+ parts

-

10k+ parts

$0.031

2,085

$0.032

-

-

$0.031

Netroflash

USA . 2,000 parts In-Stock

1+ parts

$0.032

100+ parts

$0.032

1k+ parts

-

10k+ parts

-

2,000

$0.032

$0.032

-

-

Advanced Electronics

New Zealand . 500 parts In-Stock

1+ parts

$0.033

100+ parts

$0.033

1k+ parts

$0.033

10k+ parts

-

500

$0.033

$0.033

$0.033

-

Semicontronic

India . 2,213,044 parts In-Stock

1+ parts

$0.037

100+ parts

$0.036

1k+ parts

$0.036

10k+ parts

-

2,213,044

$0.037

$0.036

$0.036

-

Ampacity Inc.

Singapore . 2,213,004 parts In-Stock

1+ parts

$0.037

100+ parts

-

1k+ parts

-

10k+ parts

-

2,213,004

$0.037

-

-

-

Corphita

USA . 158 parts In-Stock

1+ parts

$0.039

100+ parts

-

1k+ parts

-

10k+ parts

-

158

$0.039

-

-

-

Component Stockers USA

USA . 2,650,103 parts In-Stock

1+ parts

$0.040

100+ parts

$0.040

1k+ parts

$0.040

10k+ parts

$0.040

2,650,103

$0.040

$0.040

$0.040

$0.040

Modulus Dynamics

Lithuania . 23,425 parts In-Stock

1+ parts

$0.069

100+ parts

$0.066

1k+ parts

$0.063

10k+ parts

-

23,425

$0.069

$0.066

$0.063

-

Corohmni

South Africa . 386 parts In-Stock

1+ parts

$0.069

100+ parts

-

1k+ parts

-

10k+ parts

-

386

$0.069

-

-

-

Aztec Data Supply Inc.

USA . 5,462 parts In-Stock

1+ parts

$0.166

100+ parts

-

1k+ parts

-

10k+ parts

-

5,462

$0.166

-

-

-

AZTECH Wire

Italy . 193 parts In-Stock

1+ parts

$19.710

100+ parts

-

1k+ parts

-

10k+ parts

-

193

$19.710

-

-

-

Perfect Parts

USA . 336 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

336

-

-

-

-

Overview

Protect your electronics with the ESD207B102ELSE6327XTSA1 by Infineon Technologies, a top-of-the-line Transient Suppression Device. Made from high-quality materials and utilizing advanced technology, this product offers exceptional protection against voltage spikes and surges. Whether you're looking to safeguard your sensitive equipment in industrial, automotive, or consumer electronics applications, this device's bidirectional polarity and avalanche technology ensure reliable performance. Trust Infineon Technologies to deliver peace of mind and superior quality with every use of the ESD207B102ELSE6327XTSA1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material for the package body ensures durability and reliability in various operating conditions.

Config: SINGLE

The single configuration simplifies installation and maintenance, making it easy to use for users.

Surface Mount: YES

The surface mount capability allows for easy and secure installation on PCBs, saving time and effort during assembly.

Package Shape: RECTANGULAR

The rectangular package shape enables space-saving design and efficient placement on circuit boards.

No. of Terminals: 2

The two terminals provide easy connectivity and integration into existing circuit layouts.

Package Style (Meter): CHIP CARRIER

The chip carrier package style offers compactness and efficient heat dissipation for optimal performance.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this product can withstand harsh environmental conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature ensures reliable functionality even in extremely cold environments.

Terminal Finish: GOLD

The gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

The bottom terminal position simplifies PCB layout and ensures secure electrical connections during operation.

Minimum Breakdown Voltage: 3.65 V

The minimum breakdown voltage of 3.65 V offers robust over-voltage protection to safeguard sensitive electronic components.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

The trans voltage suppressor diode type efficiently suppresses voltage spikes and transients to protect connected devices.

Technology: AVALANCHE

The avalanche technology ensures fast response times and high energy absorption capabilities for effective transient suppression.

Terminal Form: NO LEAD

The no-lead terminal form improves thermal management and eliminates potential solder joint failures for enhanced reliability.

Maximum Repetitive Peak Reverse Voltage: 3.3 V

With a maximum repetitive peak reverse voltage of 3.3 V, this product offers reliable reverse voltage protection for sensitive circuits.

Polarity: BIDIRECTIONAL

The bidirectional polarity provides protection against voltage transients from both directions, enhancing overall system robustness.

Diode Element Material: SILICON

The silicon diode element material ensures high efficiency and reliability in transient voltage suppression applications.

Technical Specifications

Transient Suppression Devices ESD207B102ELSE6327XTSA1 attributes and parameters. Explore more Transient Suppression Devices devices from Infineon Technologies

Specs

Minimum Breakdown Voltage:

3.65 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-PBCC-N2

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

CHIP CARRIER

Polarity:

BIDIRECTIONAL

Maximum Repetitive Peak Reverse Voltage:

3.3 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

GOLD

Terminal Form:

Terminal Position:

Trade Compliance

ESD207B102ELSE6327XTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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