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ESD241B1W0201E6327XTSA1

Infineon Technologies

ESD241B1W0201E6327XTSA1 by Infineon Technologies

ESD241B1W0201E6327XTSA1 by Infineon is a single transient suppression device with 25W power dissipation. It operates b/w -55°C to 125°C, meeting IEC-61000-4 standards. This bidirectional diode is ideal for protecting electronic components from voltage spikes in various applications.

Median Price

$0.109

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 14,000 parts In-Stock

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$0.109

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14,000

$0.109

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Mouser Electronics

USA . 99,790 parts In-Stock

1+ parts

$0.110

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$0.032

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$0.030

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$0.023

99,790

$0.110

$0.032

$0.030

$0.023

DigiKey

USA . 60,307 parts In-Stock

1+ parts

$0.110

100+ parts

$0.032

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$0.030

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$0.029

60,307

$0.110

$0.032

$0.030

$0.029

Newark

USA . 3,373 parts In-Stock

1+ parts

$0.113

100+ parts

$0.033

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$0.030

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3,373

$0.113

$0.033

$0.030

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Rochester

USA . 12,981,928 parts In-Stock

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$0.021

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$0.018

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$0.016

12,981,928

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$0.021

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$0.016

Verical

USA . 9,325,000 parts In-Stock

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Future Electronics

Canada . 405,000 parts In-Stock

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405,000

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Element14

Singapore . 29,840 parts In-Stock

1+ parts

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100+ parts

$0.083

1k+ parts

$0.049

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$0.040

29,840

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$0.083

$0.049

$0.040

Arrow

USA . 15,000 parts In-Stock

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15,000

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RS (Exports)

UK . 14,780 parts In-Stock

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14,780

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Farnell

UK . 3,373 parts In-Stock

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$0.025

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$0.024

3,373

-

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$0.025

$0.024

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 176 parts In-Stock

1+ parts

$0.021

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176

$0.021

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$0.043

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300

$0.043

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Vyrian

USA . 1,915,382 parts In-Stock

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IBS Electronics

USA . 390,000 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 2,065,680 parts In-Stock

1+ parts

$0.019

100+ parts

$0.019

1k+ parts

$0.018

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2,065,680

$0.019

$0.019

$0.018

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Ampacity Inc.

Singapore . 1,915,072 parts In-Stock

1+ parts

$0.019

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1,915,072

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Corphita

USA . 916 parts In-Stock

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$0.020

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916

$0.020

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Modulus Dynamics

Lithuania . 15,404 parts In-Stock

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$0.028

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$0.027

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$0.026

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15,404

$0.028

$0.027

$0.026

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$0.043

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$0.042

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$0.043

$0.042

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Argo Parts USA

USA . 402 parts In-Stock

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$0.043

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$0.042

402

$0.043

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$0.042

Advanced Electronics

New Zealand . 20 parts In-Stock

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$0.044

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$0.044

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$0.044

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20

$0.044

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Aztec Data Supply Inc.

USA . 2,274 parts In-Stock

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$0.070

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Corohmni

South Africa . 749 parts In-Stock

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749

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Continental Prestige Electronics

USA . 31,150 parts In-Stock

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$0.048

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$0.027

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31,150

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Lixinc

USA . 18,426 parts In-Stock

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Authorized Procurement Solutions

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Robosynatics

Brazil . 950 parts In-Stock

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$2.267

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$2.267

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$2.267

950

-

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$2.267

$2.267

Lucentia Tech

USA . 950 parts In-Stock

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$2.267

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$2.267

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$2.267

950

-

$2.267

$2.267

$2.267

Overview

Looking for reliable protection against transient voltage spikes? Look no further than the ESD241B1W0201E6327XTSA1 by Infineon Technologies. With a reputation for top-notch quality, Infineon Technologies delivers cutting-edge Transient Suppression Devices designed to safeguard your electronics. This single-config, surface-mount device offers superior performance with a maximum non-repetitive peak reverse power dissipation of 25W. Whether you're in need of protection for industrial equipment or consumer electronics, this Trans Voltage Suppressor Diode is the perfect solution. Trust in Infineon Technologies to provide the protection your devices deserve.

Feature Benefit Bullets

Config: SINGLE

SINGLE configuration makes it easy to install and use in various applications without needing to worry about connecting multiple units together.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on PCBs, saving space and reducing assembly time.

Maximum Non Repetitive Peak Reverse Power Dissipation: 25 W

High power dissipation capability ensures that the device can handle sudden spikes in reverse voltage without getting damaged.

Package Shape: RECTANGULAR

Rectangular package shape allows for efficient and space-saving placement on the circuit board.

No. of Terminals: 2

Having only 2 terminals simplifies the installation process and reduces the risk of wiring errors.

Package Style (Meter): CHIP CARRIER

Chip carrier package style offers protection and easy handling during transportation and installation.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures the device can withstand harsh environmental conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature makes it suitable for use in a wide range of temperature environments.

Reference Standard: IEC-61000-4-2, 4-4, 4-5

Compliance with IEC standards ensures reliability and quality performance of the device in transient suppression applications.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

Trans voltage suppressor diode is specifically designed for transient voltage suppression, ensuring effective protection against voltage surges.

Technology: AVALANCHE

AVALANCHE technology offers high energy handling capabilities and fast response times, enhancing the device's effectiveness in transient suppression.

Terminal Form: NO LEAD

No lead terminals provide a reliable and secure connection, reducing the risk of connectivity issues.

Maximum Repetitive Peak Reverse Voltage: 3.3 V

High maximum repetitive peak reverse voltage makes the device suitable for a wide range of applications requiring transient voltage suppression.

Polarity: BIDIRECTIONAL

Bidirectional polarity allows the device to protect against voltage surges in both directions, improving overall protection effectiveness.

Diode Element Material: SILICON

Silicon diode element material ensures reliable and consistent performance over a long period, providing durable transient suppression.

Technical Specifications

Transient Suppression Devices ESD241B1W0201E6327XTSA1 attributes and parameters. Explore more Transient Suppression Devices devices from Infineon Technologies

Specs

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-XBCC-N2

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

25 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

CHIP CARRIER

Polarity:

BIDIRECTIONAL

Reference Standard:

IEC-61000-4-2, 4-4, 4-5

Maximum Repetitive Peak Reverse Voltage:

3.3 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Form:

Terminal Position:

Trade Compliance

ESD241B1W0201E6327XTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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