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ESD200B1CSP0201XTSA1

Infineon Technologies

ESD200B1CSP0201XTSA1 by Infineon Technologies

ESD200B1CSP0201XTSA1 by Infineon is a single transient suppression device with bidirectional polarity. It operates b/w -40°C to 125°C, with breakdown voltage ranging from 6V to 10V. This chip carrier diode is ideal for protecting sensitive electronics from voltage spikes in various applications.

Median Price

$0.022

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 9,358 parts In-Stock

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$0.076

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$0.025

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$0.016

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$0.015

9,358

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$0.025

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$0.015

Mouser Electronics

USA . 52,353 parts In-Stock

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$0.120

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$0.032

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$0.020

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52,353

$0.120

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Rochester

USA . 6,205,000 parts In-Stock

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-

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$0.018

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$0.015

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6,205,000

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Verical

USA . 2,865,000 parts In-Stock

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Farnell

UK . 98,235 parts In-Stock

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$0.022

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$0.013

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$0.012

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$0.022

$0.013

$0.012

Chip1Stop

Japan . 49,670 parts In-Stock

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$0.020

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$0.015

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49,670

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$0.015

RS (Exports)

UK . 14,000 parts In-Stock

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Digiode

USA . 24 parts In-Stock

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$0.021

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24

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Vyrian

USA . 1,073,698 parts In-Stock

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Semtec, LLC

USA . 496,560 parts In-Stock

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Rutronik

Germany . 15,000 parts In-Stock

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Contempo Components LLC

USA . 3,535 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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SPM Sales

USA . 259 parts In-Stock

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Semicontronic

India . 1,200,410 parts In-Stock

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$0.014

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$0.014

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Ampacity Inc.

Singapore . 1,200,352 parts In-Stock

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Corphita

USA . 487 parts In-Stock

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Modulus Dynamics

Lithuania . 16,781 parts In-Stock

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$0.033

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$0.032

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$0.030

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Aztec Data Supply Inc.

USA . 2,593 parts In-Stock

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$0.150

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Advanced Electronics

New Zealand . 270 parts In-Stock

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$0.157

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$0.149

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Corohmni

South Africa . 204 parts In-Stock

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$0.178

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Continental Prestige Electronics

USA . 104,793 parts In-Stock

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$0.073

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$0.031

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GreenTree Electronics

Israel . 30,000 parts In-Stock

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Authorized Procurement Solutions

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Argo Parts USA

USA . 4,700 parts In-Stock

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Perfect Parts

USA . 2,464 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Overview

Enhance your electronics with the ESD200B1CSP0201XTSA1 by Infineon Technologies, a top-tier manufacturer known for its superior quality and reliability. This Transient Suppression Device offers unparalleled protection against voltage spikes, ensuring the longevity and performance of your devices. Ideal for a wide range of applications, this product provides peace of mind and confidence in your electronic systems. Upgrade to the ESD200B1CSP0201XTSA1 today and experience the difference Infineon Technologies can make in your electronics.

Feature Benefit Bullets

Config: SINGLE

Single configuration simplifies installation and reduces complexity in circuit design.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space and easier integration into existing systems.

No. of Terminals: 2

Having only 2 terminals simplifies the connection process and reduces chances of error.

Package Style (Meter): CHIP CARRIER

Chip carrier package style provides protection for the device and ensures durability.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures reliability and stability in varying environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows for operation in a wide range of environments, including cold temperatures.

Terminal Position: BOTTOM

Bottom terminal position allows for easy and secure mounting on circuit boards.

Minimum Breakdown Voltage: 6 V

High minimum breakdown voltage provides protection against surges and spikes in the circuit.

Maximum Breakdown Voltage: 10 V

Maximum breakdown voltage ensures that the device can handle high voltage levels without damage.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

Trans voltage suppressor diode type effectively suppresses voltage transients and protects the circuitry.

Technology: AVALANCHE

Avalanche technology allows for fast response times and high energy absorption capacity.

Terminal Form: NO LEAD

No lead terminal form reduces the risk of damage during handling and installation.

Maximum Repetitive Peak Reverse Voltage: 5.5 V

High maximum repetitive peak reverse voltage ensures continuous protection against reverse voltage.

Polarity: BIDIRECTIONAL

Bidirectional polarity allows for protection against voltage transients in both directions.

Diode Element Material: SILICON

Silicon diode element material offers high performance and reliability in transient suppression applications.

Technical Specifications

Transient Suppression Devices ESD200B1CSP0201XTSA1 attributes and parameters. Explore more Transient Suppression Devices devices from Infineon Technologies

Specs

Maximum Breakdown Voltage:

10 V

Minimum Breakdown Voltage:

6 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-XBCC-N2

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

CHIP CARRIER

Polarity:

BIDIRECTIONAL

Maximum Repetitive Peak Reverse Voltage:

5.5 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Form:

Terminal Position:

Trade Compliance

ESD200B1CSP0201XTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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