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ESD203B102ELSE6327XTSA1

Infineon Technologies

ESD203B102ELSE6327XTSA1 by Infineon Technologies

ESD203B102ELSE6327XTSA1 by Infineon is a unidirectional avalanche diode with 115W peak power dissipation, 0.05uA reverse current, and 23V clamping voltage. It is used for transient suppression in applications requiring protection against ESD events according to IEC standards.

Median Price

$3.370

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 7,415 parts In-Stock

1+ parts

$0.200

100+ parts

-

1k+ parts

-

10k+ parts

$0.089

7,415

$0.200

-

-

$0.089

Arrow

USA . 14,907 parts In-Stock

1+ parts

$6.541

100+ parts

-

1k+ parts

-

10k+ parts

-

14,907

$6.541

-

-

-

Chip1Stop

Japan . 14,907 parts In-Stock

1+ parts

$7.220

100+ parts

-

1k+ parts

-

10k+ parts

-

14,907

$7.220

-

-

-

Verical

USA . 15,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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15,000

-

-

-

-

Rochester

USA . 13,112 parts In-Stock

1+ parts

-

100+ parts

$0.104

1k+ parts

$0.086

10k+ parts

$0.077

13,112

-

$0.104

$0.086

$0.077

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 321 parts In-Stock

1+ parts

$0.081

100+ parts

-

1k+ parts

-

10k+ parts

-

321

$0.081

-

-

-

Nova Conductors

Japan . 500 parts In-Stock

1+ parts

$0.114

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$0.114

-

-

-

Vyrian

USA . 13,157 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

13,157

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 495 parts In-Stock

1+ parts

$0.040

100+ parts

-

1k+ parts

-

10k+ parts

-

495

$0.040

-

-

-

Semicontronic

India . 12,897 parts In-Stock

1+ parts

$0.072

100+ parts

$0.070

1k+ parts

$0.070

10k+ parts

-

12,897

$0.072

$0.070

$0.070

-

Corphita

USA . 720 parts In-Stock

1+ parts

$0.076

100+ parts

-

1k+ parts

-

10k+ parts

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720

$0.076

-

-

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Aztec Data Supply Inc.

USA . 3,747 parts In-Stock

1+ parts

$0.080

100+ parts

-

1k+ parts

-

10k+ parts

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3,747

$0.080

-

-

-

Continental Prestige Electronics

USA . 3,040 parts In-Stock

1+ parts

$0.110

100+ parts

-

1k+ parts

-

10k+ parts

$0.108

3,040

$0.110

-

-

$0.108

Argo Parts USA

USA . 952 parts In-Stock

1+ parts

$0.110

100+ parts

-

1k+ parts

-

10k+ parts

$0.106

952

$0.110

-

-

$0.106

Netroflash

USA . 500 parts In-Stock

1+ parts

$0.114

100+ parts

-

1k+ parts

-

10k+ parts

-

500

$0.114

-

-

-

Advanced Electronics

New Zealand . 200 parts In-Stock

1+ parts

$0.116

100+ parts

$0.116

1k+ parts

$0.116

10k+ parts

-

200

$0.116

$0.116

$0.116

-

Modulus Dynamics

Lithuania . 28,614 parts In-Stock

1+ parts

$0.120

100+ parts

$0.115

1k+ parts

$0.110

10k+ parts

-

28,614

$0.120

$0.115

$0.110

-

Ampacity Inc.

Singapore . 13,038 parts In-Stock

1+ parts

$0.157

100+ parts

-

1k+ parts

-

10k+ parts

-

13,038

$0.157

-

-

-

Robosynatics

Brazil . 500 parts In-Stock

1+ parts

-

100+ parts

$5.253

1k+ parts

$5.253

10k+ parts

$5.253

500

-

$5.253

$5.253

$5.253

Lucentia Tech

USA . 500 parts In-Stock

1+ parts

-

100+ parts

$5.253

1k+ parts

$5.253

10k+ parts

$5.253

500

-

$5.253

$5.253

$5.253

Overview

Upgrade your electrical systems with the ESD203B102ELSE6327XTSA1 from Infineon Technologies. As a leading manufacturer in transient suppression devices, Infineon ensures top-notch quality and reliability. This single-configured, surface mount device offers maximum protection with a high reverse power dissipation of 115W and a low reverse current of 0.05uA. With applications in various industries, this product guarantees superior performance in safeguarding against voltage spikes and surges. Trust Infineon to deliver cutting-edge technology that provides peace of mind for your electronic devices.

Feature Benefit Bullets

Config: SINGLE

Single configuration makes it easy to install and maintain, perfect for simple applications.

Surface Mount: YES

Surface mount capability allows for easy PCB integration, saving space and reducing assembly time.

Maximum Non Repetitive Peak Reverse Power Dissipation: 115 W

High power dissipation capacity ensures reliable protection against transient surges.

Maximum Reverse Current: 0.05 uA

Low reverse current ensures minimal power loss and efficient operation.

Package Shape: RECTANGULAR

Rectangular package shape facilitates easy placement on the PCB and efficient use of space.

Reverse Test Voltage: 12 V

Designed to handle up to 12V reverse test voltage, providing robust protection for sensitive electronics.

No. of Terminals: 2

Simple 2-terminal design for easy integration and connection within circuit designs.

Package Style (Meter): CHIP CARRIER

Chip carrier package style is compact and suitable for surface mount applications, enhancing versatility.

Maximum Operating Temperature: 125 °C

High maximum operating temperature tolerance ensures reliable performance in various environmental conditions.

Minimum Operating Temperature: -55 °C

Wide temperature range allows for operation in extreme cold conditions, enhancing device reliability.

Terminal Finish: GOLD

Gold terminal finish provides excellent conductivity and corrosion resistance for long-term reliability.

Terminal Position: BOTTOM

Bottom terminal position facilitates easy soldering and connection within circuit layouts.

Reference Standard: IEC-61000-4-2, 4-4, 4-5

Compliance with international standards ensures product reliability and performance consistency.

Diode Type: TRANS VOLTAGE SUPPRESSOR DIODE

TransVoltage suppressor diode type offers fast response time and effective transient suppression capabilities.

Technology: AVALANCHE

Avalanche technology provides high energy handling capacity and fast response for robust transient protection.

Terminal Form: NO LEAD

No-lead terminal form reduces assembly complexity and ensures reliable electrical connections.

Maximum Repetitive Peak Reverse Voltage: 13.2 V

Capable of handling up to 13.2V repetitive peak reverse voltage, ensuring protection under repeated surge conditions.

Polarity: BIDIRECTIONAL

Bidirectional polarity allows for protection in both directions, offering comprehensive transient suppression capabilities.

Maximum Clamping Voltage: 23 V

High clamping voltage rating of 23V provides effective protection for sensitive components during transient events.

Diode Element Material: SILICON

Silicon diode element material offers high reliability and performance consistency for long-lasting transient suppression.

Technical Specifications

Transient Suppression Devices ESD203B102ELSE6327XTSA1 attributes and parameters. Explore more Transient Suppression Devices devices from Infineon Technologies

Specs

Additional Features:

LOW CAPACITANCE

Maximum Clamping Voltage:

23 V

Config:

SINGLE

Diode Element Material:

SILICON

JESD-30 Code:

R-XBCC-N2

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

Maximum Non Repetitive Peak Reverse Power Dissipation:

115 W

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

CHIP CARRIER

Polarity:

BIDIRECTIONAL

Reference Standard:

IEC-61000-4-2, 4-4, 4-5

Maximum Repetitive Peak Reverse Voltage:

13.2 V

Maximum Reverse Current:

.05 uA

Reverse Test Voltage:

12 V

Surface Mount:

YES

Technology:

AVALANCHE

Terminal Finish:

GOLD

Terminal Form:

Terminal Position:

Trade Compliance

ESD203B102ELSE6327XTSA1 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.50

SB

8541.10.00.50

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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