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BSC080N03LSGATMA1

Infineon Technologies

BSC080N03LSGATMA1 by Infineon Technologies

BSC080N03LSGATMA1 by Infineon is a N-CHANNEL FET with 30V DS breakdown voltage, ideal for switching applications. Features include 212A max pulsed drain current, 0.012 ohm max drain-source resistance, and 15mJ avalanche energy rating. Suitable for enhancement mode operation in high-power electronics due to its small outline package and high operating temperature of 150°C.

Median Price

$0.802

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 16 parts In-Stock

1+ parts

$0.718

100+ parts

-

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-

10k+ parts

$0.266

16

$0.718

-

-

$0.266

Element14

Singapore . 10 parts In-Stock

1+ parts

$0.885

100+ parts

$0.532

1k+ parts

$0.344

10k+ parts

$0.335

10

$0.885

$0.532

$0.344

$0.335

DigiKey

USA . 4 parts In-Stock

1+ parts

$1.260

100+ parts

-

1k+ parts

-

10k+ parts

$0.281

4

$1.260

-

-

$0.281

Chip1Stop

Japan . 3,366 parts In-Stock

1+ parts

$1.600

100+ parts

$0.614

1k+ parts

$0.445

10k+ parts

-

3,366

$1.600

$0.614

$0.445

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Verical

USA . 3,016 parts In-Stock

1+ parts

-

100+ parts

$0.458

1k+ parts

$0.331

10k+ parts

$0.256

3,016

-

$0.458

$0.331

$0.256

Farnell

UK . 10 parts In-Stock

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10

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Rochester

USA . 4 parts In-Stock

1+ parts

-

100+ parts

$0.376

1k+ parts

$0.312

10k+ parts

$0.279

4

-

$0.376

$0.312

$0.279

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EXC GmbH

Germany . 500 parts In-Stock

1+ parts

$0.229

100+ parts

-

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500

$0.229

-

-

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Digiode

USA . 924 parts In-Stock

1+ parts

$0.294

100+ parts

-

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-

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924

$0.294

-

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TME

Poland . 2,515 parts In-Stock

1+ parts

$0.772

100+ parts

$0.268

1k+ parts

$0.240

10k+ parts

-

2,515

$0.772

$0.268

$0.240

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Vyrian

USA . 3,741 parts In-Stock

1+ parts

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3,741

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LIBRA Elektronik GmbH

Germany . 378 parts In-Stock

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378

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Prism Electronics

USA . 289 parts In-Stock

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289

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Corphita

USA . 546 parts In-Stock

1+ parts

$0.278

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546

$0.278

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Modulus Dynamics

Lithuania . 3,574 parts In-Stock

1+ parts

$0.695

100+ parts

$0.667

1k+ parts

$0.639

10k+ parts

-

3,574

$0.695

$0.667

$0.639

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Continental Prestige Electronics

USA . 1,038 parts In-Stock

1+ parts

$0.784

100+ parts

$0.466

1k+ parts

$0.268

10k+ parts

-

1,038

$0.784

$0.466

$0.268

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RC Electronics

USA . 95,437 parts In-Stock

1+ parts

-

100+ parts

$0.400

1k+ parts

$0.360

10k+ parts

$0.350

95,437

-

$0.400

$0.360

$0.350

Perfect Parts

USA . 62,805 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 10,192 parts In-Stock

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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iodParts Technologies Inc.

India . 4,293 parts In-Stock

1+ parts

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$0.463

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4,293

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$0.463

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GreenTree Electronics

Israel . 3,366 parts In-Stock

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3,366

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Northwest PG Solutions

USA . 824 parts In-Stock

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824

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Native Components

USA . 553 parts In-Stock

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553

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Overview

Unleash the power of innovation with the BSC080N03LSGATMA1 by Infineon Technologies. As a leader in the industry, Infineon guarantees top-notch quality and reliability in their products. This N-CHANNEL Power Field Effect Transistor is designed for switching applications, offering enhanced performance and efficiency. With a maximum drain current of 14 A and low on-resistance, this transistor delivers exceptional value and benefits to customers looking for superior performance in their electronics. Upgrade your devices with the BSC080N03LSGATMA1 and experience excellence like never before.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for long-term use.

Polarity or Channel Type: N-CHANNEL

Allows for efficient switching operations in electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space with integrated diode.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance.

Surface Mount: YES

Facilitates easy and efficient PCB mounting.

Minimum DS Breakdown Voltage: 30 V

Ensures reliable operation within specified voltage limits.

Package Shape: RECTANGULAR

Space-efficient design for compact circuit layouts.

Terminal Form: FLAT

Provides easy soldering and connection to PCB.

Operating Mode: ENHANCEMENT MODE

Allows for enhanced control and performance in various applications.

Maximum Pulsed Drain Current (IDM): 212 A

Handles high current loads for robust operation.

Avalanche Energy Rating (EAS): 15 mJ

Provides protection against energy spikes and surges.

No. of Terminals: 8

Offers versatile connectivity options for different circuit configurations.

Package Style (Meter): SMALL OUTLINE

Ideal for space-constrained applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Ensures efficient and reliable performance in various operating conditions.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures for extended periods of time.

Transistor Element Material: SILICON

Provides high-performance characteristics for enhanced reliability.

Terminal Finish: TIN

Ensures good electrical conductivity and corrosion resistance.

Maximum Drain Current (ID): 14 A

Sufficient current handling capacity for many applications.

Maximum Drain-Source On Resistance: 0.012 ohm

Low resistance ensures minimal power loss and efficient operation.

Terminal Position: DUAL

Provides flexibility in circuit design and layout.

Case Connection: DRAIN

Facilitates efficient heat dissipation for improved performance.

Technical Specifications

Power Field Effect Transistors (FET) BSC080N03LSGATMA1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

AVALANCHE RATED, LOGIC LEVEL COMPATIBLE

Avalanche Energy Rating (EAS):

15 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.012 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

212 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSC080N03LSGATMA1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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