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BAR63-03WE6327

Infineon Technologies

BAR63-03WE6327 by Infineon Technologies

Infineon's BAR63-03WE6327 is a PIN diode with 0.3 pF capacitance, 2 ohm forward resistance, and 50 V breakdown voltage. Ideal for S band applications like switching due to its small outline package and high operating temperature of 150°C. Gull wing terminals and silicon element material make it suitable for high-frequency operations at 100 MHz.

Median Price

$0.345

Lifecycle Status

Suppliers In-Stock

23

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 5,176 parts In-Stock

1+ parts

$0.053

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$0.050

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$0.045

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5,176

$0.053

$0.050

$0.045

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Mouser Electronics

USA . 5,029 parts In-Stock

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$0.400

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$0.167

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$0.085

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$0.060

5,029

$0.400

$0.167

$0.085

$0.060

Verical

USA . 238 parts In-Stock

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$0.345

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238

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Digiode

USA . 450 parts In-Stock

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$0.050

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Vyrian

USA . 263 parts In-Stock

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263

$0.053

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Bristol Electronics

USA . 1,616 parts In-Stock

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$0.263

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$0.131

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$0.052

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R&J Components

USA . 50,352 parts In-Stock

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Pegasus Components GmbH

Germany . 21,722 parts In-Stock

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Voyager Components

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USA . 15,000 parts In-Stock

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ECAB

Sweden . 9,166 parts In-Stock

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Holdelec - ElecDif-Pro

France . 4,980 parts In-Stock

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LIBRA Elektronik GmbH

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HZD GmbH

Germany . 4,245 parts In-Stock

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ComSIT Distribution GmbH

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PC Components Company LLC

USA . 3,000 parts In-Stock

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Fibra_Brandt Electronic GMBH

Germany . 2,400 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 2,300 parts In-Stock

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Connector Distribution Corp

USA . 1,737 parts In-Stock

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Right Parts Inc.

USA . 1,737 parts In-Stock

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Dan-Mar Components

USA . 1,616 parts In-Stock

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Inventory MP

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ACDS - Activité Composants Distribution Service

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492

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Distributors (Availability)

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CoreStaff

Japan . 238 parts In-Stock

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$0.035

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$0.032

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$0.032

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238

$0.035

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$0.032

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Modulus Dynamics

Lithuania . 10,731 parts In-Stock

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$0.041

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$0.039

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10,731

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Corphita

USA . 734 parts In-Stock

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Native Components

USA . 744 parts In-Stock

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$1.464

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Northwest PG Solutions

USA . 253 parts In-Stock

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Andel Nordic

Denmark . 7,123 parts In-Stock

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Perfect Parts

USA . 277,324 parts In-Stock

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A-Z Elektronik GmbH

Germany . 25,328 parts In-Stock

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Microchip USA

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Assy Fe

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Lixinc

USA . 3,378 parts In-Stock

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Metaverse IC Inc.

Canada . 3,300 parts In-Stock

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S.R.D Solutions

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Cyclops Electronics Ltd (Excess)

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GreenTree Electronics

Israel . 685 parts In-Stock

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Authorized Procurement Solutions

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Overview

Unlock the power of cutting-edge technology with the BAR63-03WE6327 by Infineon Technologies. As a leading manufacturer in the industry, Infineon delivers top-quality PIN diodes that excel in switching applications within the S Band frequency range. With a focus on reliability and performance, this product offers customers unparalleled value with its low diode capacitance, high breakdown voltage, and superior power dissipation capabilities. Trust Infineon to provide innovative solutions that meet your needs and exceed your expectations. Elevate your projects with the BAR63-03WE6327 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and protection for the diode, making it suitable for various applications.

Frequency Band: S BAND

S band frequency compatibility allows for use in radar, communication, and electronic warfare systems operating within this range.

Surface Mount: YES

Surface mount capability enables easy and efficient installation on PCBs, saving space and facilitating mass production.

Maximum Diode Capacitance: 0.3 pF

Low diode capacitance ensures minimal signal distortion and high-speed switching performance in RF applications.

Reverse Test Voltage: 5 V

With a reverse test voltage of 5V, this diode can handle higher voltages in circuit protection and signal routing applications.

Maximum Operating Temperature: 150 °C

High maximum operating temperature of 150°C allows for reliable operation in elevated temperature environments without compromising performance.

Diode Element Material: SILICON

Silicon diode element material offers high reliability, stability, and consistent performance over time.

Technical Specifications

PIN Diodes BAR63-03WE6327 attributes and parameters. Explore more PIN Diodes devices from Infineon Technologies

Specs

Application:

SWITCHING

Minimum Breakdown Voltage:

50 V

Config:

SINGLE

Maximum Diode Capacitance:

.3 pF

Nominal Diode Capacitance:

.25 pF

Diode Element Material:

SILICON

Maximum Diode Forward Resistance:

2 ohm

Diode Resistive Test Current:

5 mA

Diode Resistive Test Frequency:

100 MHz

Diode Type:

Frequency Band:

S BAND

JESD-30 Code:

R-PDSO-G2

Nominal Minority Carrier Lifetime:

.075 us

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Maximum Power Dissipation:

.25 W

Qualification:

Not Qualified

Reverse Test Voltage:

5 V

Sub-Category:

PIN Diodes

Surface Mount:

YES

Technology:

POSITIVE-INTRINSIC-NEGATIVE

Terminal Form:

Terminal Position:

Trade Compliance

BAR63-03WE6327 Diodes trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.10.00.80

SB

8541.10.00.80

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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