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DMP3099LQ-13

Diodes Incorporated

DMP3099LQ-13 by Diodes Incorporated

DMP3099LQ-13 by Diodes Inc. is a P-CHANNEL FET for SWITCHING applications. Features include 30V DS Breakdown Voltage, 11A IDM, and 10.2mJ EAS rating. Operates in ENHANCEMENT MODE with -55 to 150°C temp range, suitable for automotive (AEC-Q101) and industrial uses.

Median Price

$0.063

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 9,255 parts In-Stock

1+ parts

$0.360

100+ parts

$0.137

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$0.081

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$0.360

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Verical

USA . 120,000 parts In-Stock

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$0.043

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Avnet

USA . 10,000 parts In-Stock

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DigiKey

USA . 134 parts In-Stock

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Vyrian

USA . 36,392 parts In-Stock

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NAC Semi

USA . 10,000 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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Distributors (Availability)

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Ampacity Inc.

Singapore . 36,491 parts In-Stock

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$0.080

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Semicontronic

India . 36,313 parts In-Stock

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$0.080

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$0.078

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$0.078

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36,313

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Corohmni

South Africa . 224 parts In-Stock

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$0.508

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Aztec Data Supply Inc.

USA . 42,756 parts In-Stock

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$1.040

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$1.407

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$1.337

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$1.337

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50

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$1.337

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Infinite Electronics LLP (Excess)

. 415,954 parts In-Stock

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Argo Parts USA

USA . 3,457 parts In-Stock

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Continental Prestige Electronics

USA . 1,940 parts In-Stock

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Bastille Electronics

Australia . 450 parts In-Stock

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Overview

Unlock the power of efficient switching with the DMP3099LQ-13 by Diodes Incorporated. Known for their high-quality power FETs, Diodes Incorporated brings you a P-channel transistor that excels in various applications. This enhancement mode transistor offers customers value and benefits such as reliable performance, low power dissipation, and a wide operating temperature range. Whether you need a robust solution for automotive electronics or industrial controls, the DMP3099LQ-13 delivers the reliability and efficiency you can trust.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are efficient for use in high-side switching applications.

Configuration: SINGLE

Simplifies circuit design and reduces complexity.

Transistor Application: SWITCHING

Designed specifically for high-speed switching applications.

Surface Mount: YES

Enables easy and convenient installation on circuit boards.

Minimum DS Breakdown Voltage: 30 V

Suitable for a wide range of voltage requirements in various applications.

Avalanche Energy Rating (EAS): 10.2 mJ

Capable of handling high-energy spikes without damage.

Maximum Power Dissipation (Abs): 1.08 W

Efficient heat dissipation capability for reliable continuous operation.

Maximum Operating Temperature: 150 °C

Can withstand high temperature environments without performance degradation.

Maximum Turn On Time (ton): 9.8 ns

Fast turn-on time for rapid response in switching applications.

Maximum Turn Off Time (toff): 46 ns

Quick turn-off time to minimize switching losses.

Terminal Finish: MATTE TIN

Provides a reliable connection with low resistance.

Maximum Drain-Source On Resistance: 99 ohm

Low on-resistance for efficient power transfer and minimal heat generation.

Technical Specifications

Power Field Effect Transistors (FET) DMP3099LQ-13 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Additional Features:

HIGH RELIABILITY

Avalanche Energy Rating (EAS):

10.2 mJ

Configuration:

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

3.8 A

Maximum Drain Current (ID):

3.8 A

Maximum Drain-Source On Resistance:

99 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

11 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

46 ns

Maximum Turn On Time (ton):

9.8 ns

Trade Compliance

DMP3099LQ-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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