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DMP3017SFGQ-7

Diodes Incorporated

DMP3017SFGQ-7 by Diodes Incorporated

DMP3017SFGQ-7 by Diodes Inc. is a P-CHANNEL FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features 80A IDM, 0.01 ohm RDS(on), and operates in ENHANCEMENT MODE. With a small outline package style and AEC-Q101 reference standard, it's suitable for automotive electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Chip Stock

USA . 16,490 parts In-Stock

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Vyrian

USA . 5,347 parts In-Stock

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5,347

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Nova Conductors

Japan . 300 parts In-Stock

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300

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Corohmni

South Africa . 116 parts In-Stock

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$0.646

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116

$0.646

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Aztec Data Supply Inc.

USA . 895 parts In-Stock

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$1.300

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895

$1.300

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AZTECH Wire

Italy . 201 parts In-Stock

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$13.127

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201

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Decca Corp

Germany . 798 parts In-Stock

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$20.050

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$19.649

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$19.453

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798

$20.050

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$19.453

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Ampacity Inc.

Singapore . 1,022 parts In-Stock

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$29.050

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$29.050

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Semicontronic

India . 858 parts In-Stock

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$41.050

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$40.024

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$39.818

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858

$41.050

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$39.818

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RC Electronics

USA . 57,417 parts In-Stock

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Lixinc

USA . 19,820 parts In-Stock

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Continental Prestige Electronics

USA . 6,495 parts In-Stock

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Argo Parts USA

USA . 1,010 parts In-Stock

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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Bastille Electronics

Australia . 40 parts In-Stock

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Overview

Discover the power of innovation with the DMP3017SFGQ-7 by Diodes Incorporated. As a leading manufacturer in the industry, Diodes Incorporated delivers superior quality and reliable performance in their Power Field Effect Transistors (FET). With its P-CHANNEL configuration and built-in diode, this transistor is perfect for switching applications. Whether you're looking to enhance your electronic devices or improve efficiency, the DMP3017SFGQ-7 offers high value, benefits, and advantages that will exceed your expectations. Upgrade your technology and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection, ensuring the transistor is well-protected in various operating conditions.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their low RDS(on) values, making them efficient for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can help protect against reverse voltage spikes, enhancing overall reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient operation.

Surface Mount: YES

Surface mount technology allows for easy and space-saving PCB assembly.

Minimum DS Breakdown Voltage: 30 V

With a breakdown voltage of 30V, this FET can handle higher voltages, making it suitable for a wide range of applications.

Package Shape: SQUARE

The square shape provides a compact design, saving board space and enabling easy integration into circuits.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are easier to control and offer better performance in switching applications.

Maximum Pulsed Drain Current (IDM): 80 A

With a high pulsed drain current rating, this FET can handle sudden spikes in current, making it suitable for high-power applications.

No. of Terminals: 5

Having 5 terminals allows for versatile connections and enables flexibility in circuit design.

Package Style (Meter): SMALL OUTLINE

The small outline package offers a compact size, ideal for applications where space is limited.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers low gate capacitance and high switching speeds, making this FET suitable for high-frequency applications.

Maximum Power Dissipation Ambient: 2.5 W

With a high power dissipation rating, this FET can handle power surges and operate reliably under various ambient conditions.

Maximum Operating Temperature: 150 °C

The high operating temperature range ensures the FET can be used in demanding environments without compromising performance.

Transistor Element Material: SILICON

Silicon transistors offer high performance and reliability, making this FET a durable choice for long-term use.

Minimum Operating Temperature: -55 °C

With a low minimum operating temperature, this FET is suitable for applications that require operation in cold environments.

Terminal Finish: MATTE TIN

The matte tin finish provides good solderability and ensures reliable electrical connections.

Maximum Drain Current (ID): 11.5 A

With a high drain current rating, this FET can handle high-current applications with ease.

Maximum Drain-Source On Resistance: 0.01 ohm

The low on-resistance minimizes power losses and ensures efficient operation in switching applications.

Terminal Position: DUAL

Having dual terminal positions allows for flexible installation options and ease of connection.

Case Connection: DRAIN

The drain case connection simplifies the circuit layout and can help improve thermal management.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this FET can withstand the reflow soldering process without compromising its performance.

Maximum Feedback Capacitance (Crss): 294 pF

The low feedback capacitance ensures stable operation and reduces the risk of parasitic oscillations in the circuit.

Reference Standard: AEC-Q101

Compliance with the AEC-Q101 standard ensures high reliability and quality, making this FET suitable for automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) DMP3017SFGQ-7 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Additional Features:

GATE PROTECTED

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

11.5 A

Maximum Drain-Source On Resistance:

.01 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

294 pF

JESD-30 Code:

S-PDSO-N5

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

SQUARE

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

2.5 W

Maximum Pulsed Drain Current (IDM):

80 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

NO LEAD

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMP3017SFGQ-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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