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DMP3037LSS-13

Diodes Incorporated

DMP3037LSS-13 by Diodes Incorporated

DMP3037LSS-13 by Diodes Inc. is a P-channel FET with 30V DS breakdown voltage, 0.032 ohm RDS(on), and 5.8A ID. Ideal for switching applications, it features a single configuration with built-in diode in a small outline package suitable for surface mount technology.

Median Price

$0.138

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

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Mouser Electronics

USA . 488 parts In-Stock

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$1.030

100+ parts

$0.435

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$0.228

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$0.175

488

$1.030

$0.435

$0.228

$0.175

Arrow

USA . 5,000 parts In-Stock

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$0.123

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$0.123

Verical

USA . 5,000 parts In-Stock

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$0.123

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$0.123

DigiKey

USA . 87 parts In-Stock

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$0.152

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$0.152

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Chip Stock

USA . 33,000 parts In-Stock

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Vyrian

USA . 10,310 parts In-Stock

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NAC Semi

USA . 5,000 parts In-Stock

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$0.156

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Nova Conductors

Japan . 200 parts In-Stock

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Rutronik

Germany . 31 parts In-Stock

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$0.134

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$0.134

Distributors (Availability)

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Semicontronic

India . 10,479 parts In-Stock

1+ parts

$0.101

100+ parts

$0.098

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$0.098

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$0.101

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$0.098

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Ampacity Inc.

Singapore . 10,215 parts In-Stock

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$0.101

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Corohmni

South Africa . 733 parts In-Stock

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$0.165

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Aztec Data Supply Inc.

USA . 4,412 parts In-Stock

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$0.540

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Lixinc

USA . 17,352 parts In-Stock

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Perfect Parts

USA . 5,600 parts In-Stock

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Eastek

USA . 5,000 parts In-Stock

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$0.150

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Continental Prestige Electronics

USA . 3,323 parts In-Stock

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Argo Parts USA

USA . 2,665 parts In-Stock

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Robosynatics

Brazil . 1,869 parts In-Stock

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Lucentia Tech

USA . 1,869 parts In-Stock

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$0.162

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$0.158

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$0.158

1,869

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$0.158

$0.158

Bastille Electronics

Australia . 72 parts In-Stock

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GreenTree Electronics

Israel . 50 parts In-Stock

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Overview

Discover the ultimate solution for your switching applications with the DMP3037LSS-13 by Diodes Incorporated. This P-CHANNEL Field Effect Transistor offers unparalleled quality and reliability, thanks to its innovative design and cutting-edge technology. Ideal for a wide range of applications, this small signal FET provides enhanced performance and efficiency, making it the perfect choice for your next project. Experience the value and benefits that this product brings, and unlock new possibilities for your designs with the DMP3037LSS-13.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy for the package body provides a lightweight and durable housing for the transistor.

Polarity or Channel Type: P-CHANNEL

The P-channel configuration allows for efficient switching capabilities in various electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space on the PCB.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in control circuits.

Surface Mount: YES

The surface mount capability makes it easy to integrate this transistor into compact electronic designs.

Minimum DS Breakdown Voltage: 30 V

A minimum breakdown voltage of 30V ensures the transistor can handle high voltage spikes without damage.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient placement and routing of traces on the PCB.

Terminal Form: GULL WING

The gull wing terminals make soldering easy and provide secure connections on the PCB.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for precise control of the transistor's conductivity in switching applications.

No. of Terminals: 8

With 8 terminals, this transistor offers versatility in circuit connections and configurations.

Package Style (Meter): SMALL OUTLINE

The small outline package style saves space on the PCB and is ideal for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology ensures high performance and reliability in various operating conditions.

Transistor Element Material: SILICON

The use of silicon as the element material provides excellent thermal and electrical properties for long-term reliability.

Terminal Finish: MATTE TIN

The matte tin finish on the terminals offers good solderability and corrosion resistance.

Maximum Drain Current (ID): 5.8 A

With a maximum drain current of 5.8A, this transistor can handle high power loads in switching applications.

Maximum Drain-Source On Resistance: 0.032 ohm

The low on-resistance of 0.032 ohm minimizes power losses and improves efficiency in electronic circuits.

Terminal Position: DUAL

The dual terminal position allows for flexibility in circuit designs and connections.

Maximum Time At Peak Reflow Temperature (s): 30

The transistor can withstand peak reflow temperatures for up to 30 seconds, ensuring reliable solder joints.

Peak Reflow Temperature °C: 260

The peak reflow temperature of 260°C is ideal for lead-free soldering processes and ensures proper bonding on the PCB.

Reference Standard: AEC-Q101

Compliant with the AEC-Q101 automotive quality standard, ensuring high reliability and performance in automotive applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) DMP3037LSS-13 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Additional Features:

HIGH RELIABILITY

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

5.8 A

Maximum Drain-Source On Resistance:

.032 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMP3037LSS-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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