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DMN26D0UDJ-7

Diodes Incorporated

DMN26D0UDJ-7 by Diodes Incorporated

DMN26D0UDJ-7 by Diodes Inc. is a N-channel FET with 2 elements and built-in diode, ideal for switching applications. It features a min DS breakdown voltage of 20V, max drain current of 0.23A, and max power dissipation of 0.3W. This small outline transistor operates in enhancement mode at up to 150°C, making it suitable for various electronic devices requiring efficient power management.

Median Price

$0.328

Lifecycle Status

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1k+

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Mouser Electronics

USA . 91,382 parts In-Stock

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Avnet

USA . 30,000 parts In-Stock

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Arrow

USA . 1,881 parts In-Stock

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Verical

USA . 1,881 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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$0.273

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$0.273

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Ozdisan Elektronik

Türkiye . 16,410 parts In-Stock

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$17.923

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Chip Stock

USA . 112,800 parts In-Stock

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NAC Semi

USA . 95,000 parts In-Stock

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Vyrian

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Bristol Electronics

USA . 10,000 parts In-Stock

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$0.244

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$0.146

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$0.066

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Avant Electronics Limited

UK . 6,030 parts In-Stock

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Cyclops Electronics Ltd

UK . 5,324 parts In-Stock

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Velocity Electronics

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SPM Sales

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Prism Electronics

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Semtec, LLC

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Extreme Components

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Elcom Components

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Bastille Electronics

Australia . 1,000 parts In-Stock

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$0.273

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$0.259

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$0.246

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$0.243

1,000

$0.273

$0.259

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$0.243

Argo Parts USA

USA . 4,744 parts In-Stock

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$0.273

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$0.265

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Continental Prestige Electronics

USA . 1,168 parts In-Stock

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$0.268

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Semicontronic

India . 46,537 parts In-Stock

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$0.279

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$0.272

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$0.271

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Ampacity Inc.

Singapore . 46,746 parts In-Stock

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$0.610

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Aztec Data Supply Inc.

USA . 150 parts In-Stock

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$1.590

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Corohmni

South Africa . 351 parts In-Stock

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Authorized Procurement Solutions

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Lixinc

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iodParts Technologies Inc.

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GreenTree Electronics

Israel . 6,690 parts In-Stock

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Overview

Unleash the power of innovation with the DMN26D0UDJ-7 by Diodes Incorporated. This small signal field-effect transistor offers unparalleled quality and reliability, making it the ideal choice for various switching applications. With its N-channel polarity and separate configuration, this transistor ensures optimal performance and efficiency. Whether you're looking to enhance your circuit design or improve overall functionality, the DMN26D0UDJ-7 delivers exceptional value and benefits that will exceed your expectations. Trust Diodes Incorporated to provide cutting-edge technology that meets your needs and drives your success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable and lightweight package material that provides good protection for the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used in switching applications and offer high efficiency.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in such scenarios.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this transistor can handle a variety of voltage levels in circuits.

Maximum Drain Current (ID): 0.18 A

Capable of handling a maximum drain current of 0.18 A, making it suitable for low to medium power applications.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures up to 150°C, allowing for use in demanding environments.

Maximum Power Dissipation (Abs): 0.3 W

The transistor can dissipate up to 0.3W of power, ensuring stable operation under different load conditions.

Technical Specifications

Small Signal Field Effect Transistors (FET) DMN26D0UDJ-7 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Additional Features:

ESD PROTECTION

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

.23 A

Maximum Drain Current (ID):

.18 A

Maximum Drain-Source On Resistance:

3 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMN26D0UDJ-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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