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DMN26D0UFB4-7B

Diodes Incorporated

DMN26D0UFB4-7B by Diodes Incorporated

DMN26D0UFB4-7B by Diodes Inc. is a N-channel FET with 20V DS breakdown voltage and 0.24A max drain current, ideal for switching applications. It operates in enhancement mode with 3ohm RDS(on) and can handle up to 0.35W power dissipation. Package style is chip carrier, suitable for surface mount assembly at max temp of 150°C.

Median Price

$0.057

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

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RS (Exports)

UK . 8,475 parts In-Stock

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Nova Conductors

Japan . 10 parts In-Stock

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$0.080

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Chip Stock

USA . 280,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 10,000 parts In-Stock

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Vyrian

USA . 5,426 parts In-Stock

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Distributors (Availability)

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Semicontronic

India . 8,269 parts In-Stock

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$0.048

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$0.047

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$0.047

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Ampacity Inc.

Singapore . 7,980 parts In-Stock

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$0.048

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Argo Parts USA

USA . 991 parts In-Stock

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$0.080

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$0.078

991

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$0.078

Netroflash

USA . 500 parts In-Stock

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$0.080

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$0.078

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Continental Prestige Electronics

USA . 403 parts In-Stock

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$0.080

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$0.078

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Aztec Data Supply Inc.

USA . 185 parts In-Stock

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$0.460

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Advanced Electronics

New Zealand . 5,000 parts In-Stock

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$0.828

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$0.787

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Corohmni

South Africa . 343 parts In-Stock

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AZTECH Wire

Italy . 1,209 parts In-Stock

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$18.840

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RC Electronics

USA . 150,000 parts In-Stock

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iodParts Technologies Inc.

India . 8,470 parts In-Stock

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Authorized Procurement Solutions

USA . 7,000 parts In-Stock

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Lixinc

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Kepictronics

USA . 133 parts In-Stock

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Overview

Enhance your electronic projects with the DMN26D0UFB4-7B from Diodes Incorporated. This small signal field-effect transistor is a game-changer in switching applications, offering high-quality performance and reliability. With its N-channel configuration and built-in diode, this chip carrier-style FET provides maximum power dissipation of 0.35W and a minimum DS breakdown voltage of 20V. Say goodbye to overheating issues with its maximum operating temperature of 150°C. Trust in Diodes Incorporated for cutting-edge technology that delivers unparalleled value and efficiency to your designs. Elevate your creations with the DMN26D0UFB4-7B today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher mobility and speed compared to P-channel transistors, making them ideal for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for reverse current protection, enhancing the reliability of the transistor in various circuit designs.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers efficient control of current flow, making it suitable for a wide range of electronic devices.

Surface Mount: YES

Surface mounting simplifies the assembly process, saves space on the circuit board, and improves heat dissipation for better performance.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this transistor can handle higher voltages, offering a reliable barrier against potential overloads.

Maximum Drain Current (Abs) (ID): 0.24 A

The maximum drain current rating of 0.24A allows for the efficient handling of current flow, ensuring stable operation in various circuit applications.

Maximum Drain-Source On Resistance: 3 ohm

With a low drain-source on resistance of 3 ohms, this transistor minimizes power loss and heat generation during operation, contributing to overall efficiency.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C ensures the transistor can withstand elevated temperatures, making it suitable for a wide range of environmental conditions.

Technical Specifications

Small Signal Field Effect Transistors (FET) DMN26D0UFB4-7B attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Additional Features:

ESD PROTECTION, HIGH RELIABILITY, LOW THRESHOLD

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

.24 A

Maximum Drain Current (ID):

.24 A

Maximum Drain-Source On Resistance:

3 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PBCC-N3

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMN26D0UFB4-7B Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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