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DMN2300UFB4-7B

Diodes Incorporated

DMN2300UFB4-7B by Diodes Incorporated

DMN2300UFB4-7B by Diodes Inc. is a N-channel FET with 20V DS breakdown voltage, 1.3A max drain current, and 0.175 ohm RDS(on). Ideal for switching applications in enhancement mode operation. Features chip carrier package style, silicon element material, and operates up to 150°C.

Median Price

$0.069

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

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Mouser Electronics

USA . 19,544 parts In-Stock

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$0.470

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$0.182

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$0.107

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$0.470

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Avnet

USA . 40,000 parts In-Stock

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Farnell

UK . 11,055 parts In-Stock

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$0.061

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$0.057

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$0.061

$0.057

Newark

USA . 10,000 parts In-Stock

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$0.077

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$0.077

Element14

Singapore . 9,134 parts In-Stock

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$0.091

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$0.062

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9,134

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Arrow

USA . 190 parts In-Stock

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$0.054

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Verical

USA . 190 parts In-Stock

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$0.054

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190

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$0.054

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Distributors (In-Stock)

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Nova Conductors

Japan . 58 parts In-Stock

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$0.143

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58

$0.143

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TME

Poland . 5,274 parts In-Stock

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$0.360

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$0.152

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$0.093

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$0.065

5,274

$0.360

$0.152

$0.093

$0.065

IBS Electronics

USA . 2,420,000 parts In-Stock

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$0.036

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Vyrian

USA . 308,701 parts In-Stock

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NAC Semi

USA . 140,000 parts In-Stock

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Classic Components Corporation

USA . 59,818 parts In-Stock

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Chip Stock

USA . 31,500 parts In-Stock

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Bristol Electronics

USA . 7,755 parts In-Stock

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7,755

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SPM Sales

USA . 970 parts In-Stock

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970

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Prism Electronics

USA . 755 parts In-Stock

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755

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Speed Components Ltd

Israel . 666 parts In-Stock

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666

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Distributors (Availability)

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Semicontronic

India . 289,687 parts In-Stock

1+ parts

$0.037

100+ parts

$0.036

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$0.036

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289,687

$0.037

$0.036

$0.036

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Ampacity Inc.

Singapore . 289,463 parts In-Stock

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$0.037

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289,463

$0.037

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Argo Parts USA

USA . 713 parts In-Stock

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$0.143

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$0.139

713

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$0.139

Corohmni

South Africa . 202 parts In-Stock

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$0.336

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202

$0.336

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Continental Prestige Electronics

USA . 9,700 parts In-Stock

1+ parts

$0.419

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$0.154

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$0.068

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$0.054

9,700

$0.419

$0.154

$0.068

$0.054

Aztec Data Supply Inc.

USA . 164 parts In-Stock

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$1.510

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$1.510

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Speed Components Ltd (Excess)

Israel . 270,971 parts In-Stock

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RC Electronics

USA . 89,235 parts In-Stock

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Kepictronics

USA . 46,066 parts In-Stock

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Robosynatics

Brazil . 22,322 parts In-Stock

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Lucentia Tech

USA . 22,322 parts In-Stock

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$0.318

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$0.311

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$0.311

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S.R.D Solutions

India . 16,000 parts In-Stock

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Lixinc

USA . 7,109 parts In-Stock

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Formix International (Excess)

India . 35 parts In-Stock

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Overview

Enhance your electronic projects with the DMN2300UFB4-7B by Diodes Incorporated. Crafted with precision and expertise, this small signal field effect transistor offers reliable performance in switching applications. With a built-in diode and N-channel configuration, this transistor provides seamless operation and efficient power management. The chip carrier package design ensures easy installation, making it ideal for a variety of projects. Trust in Diodes Incorporated to deliver quality and innovation, while the DMN2300UFB4-7B provides value and reliability for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower conduction losses and higher efficiency compared to P-channel FETs, making them a good choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against voltage spikes and reverse current flow, providing added reliability in switching operations.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance and efficiency in controlling current flow.

Surface Mount: YES

Surface-mount technology allows for easy and secure mounting of the transistor onto circuit boards, saving space and simplifying assembly.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this transistor can handle higher voltage applications with reliability and safety.

Package Shape: RECTANGULAR

The rectangular shape of the package makes it easy to handle and mount, improving the overall convenience of using the transistor in circuit designs.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer fast switching speeds and low on-resistance, making them ideal for high-frequency applications where efficiency is crucial.

Maximum Drain Current (Abs) (ID): 1.3 A

With a maximum drain current of 1.3A, this transistor can handle higher current loads, making it suitable for a wide range of applications.

No. of Terminals: 3

Having 3 terminals allows for versatile connections and configurations, enabling flexibility in circuit design and implementation.

Maximum Power Dissipation (Abs): 0.47 W

With a maximum power dissipation of 0.47W, this transistor can handle moderate power levels without overheating, ensuring long-term reliability.

Package Style (Meter): CHIP CARRIER

The chip carrier package style provides a compact and efficient form factor, suitable for space-constrained applications where size is a critical factor.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and low power consumption, making this transistor an energy-efficient choice for various electronic devices.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can withstand elevated temperatures without compromising performance, ensuring reliability in harsh environments.

Transistor Element Material: SILICON

Silicon-based transistors offer excellent performance, reliability, and consistency, making them a preferred choice for a wide range of electronic applications.

Terminal Finish: NICKEL PALLADIUM GOLD

The nickel-palladium-gold finish provides excellent conductivity and corrosion resistance, ensuring reliable and long-lasting connections in electronic circuits.

Maximum Drain-Source On Resistance: 0.175 ohm

With a low drain-source on-resistance of 0.175 ohms, this transistor minimizes conduction losses and improves efficiency in switching operations.

Terminal Position: BOTTOM

The bottom terminal position facilitates easy and secure connections in circuit designs, enhancing overall reliability and performance.

Case Connection: DRAIN

The drain case connection provides efficient heat dissipation and electrical isolation, ensuring optimal performance and reliability in various applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds allows for safe and reliable soldering processes, ensuring proper connections and long-term performance.

Peak Reflow Temperature °C: 260

With a peak reflow temperature of 260°C, this transistor can withstand high-temperature soldering processes without damage, ensuring reliable assembly and performance.

Technical Specifications

Small Signal Field Effect Transistors (FET) DMN2300UFB4-7B attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Additional Features:

HIGH RELIABILITY, LOW THRESHOLD

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

1.3 A

Maximum Drain Current (ID):

1.3 A

Maximum Drain-Source On Resistance:

.175 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PBCC-N3

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

CHIP CARRIER

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

NO LEAD

Terminal Position:

BOTTOM

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMN2300UFB4-7B Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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