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DMN24H3D5L-13

Diodes Incorporated

DMN24H3D5L-13 by Diodes Incorporated

DMN24H3D5L-13 by Diodes Inc. is a N-channel FET with 240V DS breakdown voltage, ideal for switching applications. It features a single configuration with built-in diode, operating in enhancement mode at temperatures ranging from -55°C to 150°C. This small outline transistor has a max drain current of 0.48A and a drain-source resistance of 3.5 ohm, making it suitable for surface mount designs.

Median Price

$0.158

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

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Verical

USA . 380,000 parts In-Stock

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Vyrian

USA . 199,802 parts In-Stock

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NAC Semi

USA . 10,000 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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Ampacity Inc.

Singapore . 194,802 parts In-Stock

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$0.134

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Aztec Data Supply Inc.

USA . 2,035 parts In-Stock

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$1.480

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$1.480

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Corohmni

South Africa . 194 parts In-Stock

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$1.783

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AZTECH Wire

Italy . 898 parts In-Stock

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$10.210

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Continental Prestige Electronics

USA . 5,469 parts In-Stock

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Bastille Electronics

Australia . 600 parts In-Stock

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Argo Parts USA

USA . 295 parts In-Stock

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Advanced Electronics

New Zealand . 55 parts In-Stock

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Overview

Unlock a world of possibilities with the DMN24H3D5L-13 by Diodes Incorporated, a top-quality N-CHANNEL Small Signal Field Effect Transistor (FET) that offers unparalleled performance and reliability. Perfect for switching applications, this transistor features a single configuration with a built-in diode, making it versatile and efficient. With a minimum DS breakdown voltage of 240V and a maximum drain-source on resistance of 3.5 ohms, this transistor is designed to deliver exceptional results even in the most demanding environments. Trust Diodes Incorporated for cutting-edge technology and superior quality that will take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensures longevity and reliability.

Polarity or Channel Type: N-CHANNEL

Efficient channel type for low power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space.

Transistor Application: SWITCHING

Ideal for fast switching operations in various applications.

Surface Mount: YES

Easy to integrate into surface mount circuit boards.

Minimum DS Breakdown Voltage: 240 V

Provides high voltage handling capability.

Package Shape: RECTANGULAR

Space-efficient design for compact applications.

Terminal Form: GULL WING

Facilitates easy soldering and mounting.

Operating Mode: ENHANCEMENT MODE

Offers high efficiency and fast response times.

No. of Terminals: 3

Simplifies connection requirements in circuit design.

Package Style (Meter): SMALL OUTLINE

Fits well in tight spaces with minimal footprint.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Ensures high performance and reliability.

Maximum Operating Temperature: 150 °C

Can withstand high temperature environments.

Transistor Element Material: SILICON

Provides excellent electrical properties for performance.

Minimum Operating Temperature: -55 °C

Can operate in extreme cold temperatures.

Terminal Finish: MATTE TIN

Enhances solderability and conductivity.

Maximum Drain Current (ID): 0.48 A

Provides capability for handling high current loads.

Maximum Drain-Source On Resistance: 3.5 ohm

Low resistance for efficient power transfer.

Terminal Position: DUAL

Offers flexibility in circuit connection options.

Peak Reflow Temperature °C: 260

Can withstand high reflow temperatures during manufacturing process.

Technical Specifications

Small Signal Field Effect Transistors (FET) DMN24H3D5L-13 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Minimum DS Breakdown Voltage:

240 V

Maximum Drain Current (ID):

.48 A

Maximum Drain-Source On Resistance:

3.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMN24H3D5L-13 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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