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DMN2112SN-7

Diodes Incorporated

DMN2112SN-7 by Diodes Incorporated

DMN2112SN-7 by Diodes Inc. is a N-channel FET with 20V DS breakdown voltage and 1.2A max drain current, ideal for switching applications. It operates in enhancement mode, with 0.5W max power dissipation and -55 to 150°C operating temperature range. The package style is small outline, making it suitable for surface mount designs.

Median Price

$0.465

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 200 parts In-Stock

1+ parts

$0.180

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200

$0.180

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Bristol Electronics

USA . 3,300 parts In-Stock

1+ parts

$0.750

100+ parts

$0.375

1k+ parts

$0.150

10k+ parts

$0.113

3,300

$0.750

$0.375

$0.150

$0.113

Chip Stock

USA . 25,638 parts In-Stock

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25,638

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Vyrian

USA . 3,207 parts In-Stock

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3,207

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Netsource Technology, Inc.

USA . 2,500 parts In-Stock

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2,500

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Prism Electronics

USA . 5 parts In-Stock

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5

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Distributors (Availability)

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Continental Prestige Electronics

USA . 5,571 parts In-Stock

1+ parts

$0.180

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$0.176

5,571

$0.180

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$0.176

Argo Parts USA

USA . 3,814 parts In-Stock

1+ parts

$0.180

100+ parts

-

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$0.175

3,814

$0.180

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$0.175

Corohmni

South Africa . 237 parts In-Stock

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$0.998

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237

$0.998

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Modulus Dynamics

Lithuania . 6,339 parts In-Stock

1+ parts

$1.051

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$1.051

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$1.051

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6,339

$1.051

$1.051

$1.051

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Advanced Electronics

New Zealand . 3,000 parts In-Stock

1+ parts

$1.779

100+ parts

$1.619

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$1.459

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3,000

$1.779

$1.619

$1.459

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AZTECH Wire

Italy . 695 parts In-Stock

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$18.679

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695

$18.679

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Ampacity Inc.

Singapore . 269 parts In-Stock

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$37.050

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269

$37.050

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Authorized Procurement Solutions

USA . 20,000 parts In-Stock

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Lixinc

USA . 7,523 parts In-Stock

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Glotronic Ltd.

UK . 3,790 parts In-Stock

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3,790

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Kepictronics

USA . 3,100 parts In-Stock

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3,100

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Bastille Electronics

Australia . 10 parts In-Stock

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10

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Overview

Unlock the power of the DMN2112SN-7 by Diodes Incorporated, a top-quality Small Signal Field Effect Transistor that offers reliable performance and versatility. Ideal for switching applications, this N-CHANNEL transistor boasts a built-in diode for added functionality. With a maximum drain current of 1.2 A and a low drain-source on resistance of 0.1 ohm, this component delivers exceptional value and efficiency. Experience enhanced performance and durability with Diodes Incorporated's cutting-edge technology, making the DMN2112SN-7 the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the transistor, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration allows for efficient switching, making this transistor suitable for applications requiring precise control and fast response times.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space, making this transistor a convenient choice for applications where space is limited.

Transistor Application: SWITCHING

Designed for switching applications, this transistor offers excellent performance and reliability in controlling electrical signals, making it a versatile option for various electronic devices.

Surface Mount: YES

With surface mount capability, this transistor can be easily mounted on circuit boards, saving time and effort in the assembly process.

Minimum DS Breakdown Voltage: 20 V

The minimum breakdown voltage of 20V ensures the transistor can handle higher voltages, making it suitable for applications that require robust voltage handling capabilities.

Package Shape: RECTANGULAR

The rectangular shape of the package allows for efficient placement on circuit boards, optimizing space utilization and enhancing the overall design of electronic devices.

Terminal Form: GULL WING

The gull-wing terminal form provides secure connections and ease of soldering, ensuring reliable performance in various operating conditions.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for precise control over the transistor's conductivity, making it an ideal choice for applications requiring low power consumption and high efficiency.

Maximum Drain Current (Abs) (ID): 1.2 A

With a maximum drain current of 1.2A, this transistor can handle high current loads, making it suitable for applications that require power switching capabilities.

No. of Terminals: 3

The three-terminal design simplifies circuit connections and enhances compatibility with existing systems, making this transistor a flexible choice for diverse applications.

Maximum Power Dissipation (Abs): 0.5 W

The maximum power dissipation of 0.5W ensures efficient heat dissipation and reliability under high load conditions, making this transistor a durable option for demanding applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) DMN2112SN-7 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Diodes Incorporated

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

1.2 A

Maximum Drain Current (ID):

1.2 A

Maximum Drain-Source On Resistance:

.1 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

45 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

.5 W

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Reference Standard:

MIL-STD-202

Sub-Category:

FET General Purpose Powers

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

DMN2112SN-7 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.95

SB

8541.21.00.80

PCN

Manufacturer Highlights

Diodes Incorporated

Diodes Incorporated is an international leader in the design and production of high-grade application specific standard products utilized in a wide variety of industries. The company has developed cutting-edge technology that enhances the performance and reliability of components for consumer, industrial, automotive and communication applications. Established in 1959, Diodes Incorporated has been providing superior services to its customers by creating innovative solutions from their world-class manufacturing centers located around the world. Their commitment to delivering quality products extends to their selection of materials which are carefully chosen to meet the demand of both commercial and military requirements.

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Management team

Chairman and CEO

Keh-Shew Lu 

CFO

Brett R. Whitmire 

Lead Director

Angie Chen Button

Manufacturer fab locations 11

Fab name Location Fab Initiation Wafer Capacity

Fab 1

Fabrication

Fab Initiation

1987

China

Shanghai

Wafer Capacity

40,000

1987

40,000

Zizhu Fab 1

Fabrication

Fab Initiation

2013

China

Shanghai

Wafer Capacity

18,500

2013

18,500

G Fab

Fabrication

Fab Initiation

2008

UK

Greenock

Wafer Capacity

8,000

2008

8,000

Keelung Fab

Fabrication

Fab Initiation

1990

Taiwan

Keelung

Wafer Capacity

58,000

1990

58,000

Wuxi Fab

Fabrication

Fab Initiation

2004

China

Wuxi

Wafer Capacity

190,000

2004

190,000

Shanghai Fab

Fabrication

Fab Initiation

1993

China

Shanghai

Wafer Capacity

110,000

1993

110,000

G Fab

Fabrication

Fab Initiation

1970

UK

Greenock

Wafer Capacity

22,000

1970

22,000

Hsinchu Fab

Fabrication

Fab Initiation

1998

Taiwan

Hsinchu

Wafer Capacity

38,000

1998

38,000

Fab 2

Fabrication

Fab Initiation

2003

China

Shanghai

Wafer Capacity

20,000

2003

20,000

SPFAB

Fabrication

Fab Initiation

1995

USA

South Portland

Wafer Capacity

17,000

1995

17,000

N/A

Fabrication

Fab Initiation

1982

UK

Oldham

Wafer Capacity

4,000

1982

4,000

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