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ADN2913ACPZ-RL7

Analog Devices

ADN2913ACPZ-RL7 by Analog Devices

ADN2913ACPZ-RL7 by Analog Devices is a telecom IC with 24 terminals, operating b/w -40 to 85 °C. It has a nominal voltage of 3.3V and terminal pitch of 0.5mm. This square-shaped chip carrier is ideal for telecom circuit applications due to its industrial temperature grade and compact dimensions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,995 parts In-Stock

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Digiode

USA . 185 parts In-Stock

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Native Components

USA . 71 parts In-Stock

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$8.466

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71

$8.466

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Northwest PG Solutions

USA . 772 parts In-Stock

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$9.313

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$8.381

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Parana Technologies

USA . 1,700 parts In-Stock

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$11.500

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$10.695

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$11.500

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IDEA Electronic Components Group

UK . 55 parts In-Stock

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$12.366

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$11.748

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$11.748

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AZTECH Wire

Italy . 719 parts In-Stock

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$13.175

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DigiPath Technology Company

USA . 330 parts In-Stock

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$19.291

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$18.519

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$18.519

330

$19.291

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$18.519

One Stop Electronics

USA . 1,641 parts In-Stock

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$21.000

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Component Stockers USA

USA . 640 parts In-Stock

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$99.990

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Semicontronic

India . 1,461 parts In-Stock

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$187.000

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$182.325

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$181.390

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Ampacity Inc.

Singapore . 316 parts In-Stock

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$680.000

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Kepictronics

USA . 5,500 parts In-Stock

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Vigor

Singapore . 1,430 parts In-Stock

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Microchip USA

USA . 427 parts In-Stock

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Corphita

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Overview

Unlock the potential of your telecommunications systems with the ADN2913ACPZ-RL7 by Analog Devices. Known for their high-quality products, Analog Devices delivers exceptional performance and reliability. This Telecom Interface IC is perfect for a variety of applications, offering customers unmatched value and benefits. Upgrade your systems with confidence knowing you have the best in the industry. Trust Analog Devices to take your telecommunications to the next level.

Feature Benefit Bullets

Surface Mount: YES

Being surface mountable allows for easier assembly on PCBs, saving time and effort during production.

Package Shape: SQUARE

Square package shape provides efficient use of board space and ensures a compact design for applications where size is a concern.

No. of Terminals: 24

Having 24 terminals provides ample connectivity options for various interfaces, making this product versatile for different telecom applications.

Package Style: CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile design allows for efficient heat dissipation and optimal performance in compact spaces.

Maximum Operating Temperature: 85 °C

With a high maximum operating temperature tolerance, this product can withstand demanding thermal conditions, ensuring reliability and durability in harsh environments.

Minimum Operating Temperature: -40 °C

The ability to operate at low temperatures enables this product to function effectively in various environmental conditions, making it suitable for a wide range of applications.

Terminal Finish: MATTE TIN

Matte tin terminal finish ensures good electrical conductivity and corrosion resistance, enhancing the overall performance and lifespan of the product.

Terminal Position: QUAD

Quad terminal position allows for easy connection and stable contact with other components, promoting efficient signal transfer and reducing the risk of connectivity issues.

Maximum Seated Height: 1 mm

Low maximum seated height contributes to a slim and compact profile, making this product suitable for applications where space constraints are a consideration.

Width: 4 mm

The compact width of 4mm enables seamless integration into tight layouts, offering flexibility in board design and optimizing space utilization.

Peak Reflow Temperature °C: 260

With a high peak reflow temperature, this product can withstand the soldering process during assembly without compromising its performance or structural integrity.

Length: 4 mm

Compact length of 4mm further enhances the product's space-saving benefits, making it suitable for applications with limited physical dimensions.

Temperature Grade: INDUSTRIAL

Industrial-grade temperature tolerance ensures reliable operation in rugged industrial environments, making this product suitable for robust telecom applications.

Terminal Form: NO LEAD

No lead terminal form complies with RoHS regulations and reduces environmental impact, making this product environmentally friendly and safe for use.

Telecom IC Type: TELECOM CIRCUIT

Designed specifically for telecom circuits, this product offers optimized performance and compatibility for telecommunications applications, ensuring reliable and efficient operation.

Nominal Supply Voltage: 3.3 V

Operating at a nominal supply voltage of 3.3V provides stable and consistent power delivery, ensuring the proper functioning of the product in telecom systems.

Terminal Pitch: 0.5 mm

With a small terminal pitch of 0.5mm, this product allows for high-density mounting and precise connections, making it ideal for compact PCB designs.

Moisture Sensitivity Level (MSL): 3

Moisture sensitivity level of 3 indicates that this product has moderate moisture sensitivity, requiring proper handling and storage to maintain its electrical properties and reliability.

Technical Specifications

Other Function Telecom Interface ICs ADN2913ACPZ-RL7 attributes and parameters. Explore more Other Function Telecom Interface ICs devices from Analog Devices

Specs

JESD-30 Code:

S-XQCC-N24

JESD-609 Code:

e3

Length:

4 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

24

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Maximum Seated Height:

1 mm

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Telecom IC Type:

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Width:

4 mm

Trade Compliance

ADN2913ACPZ-RL7 Telecommunications trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Analog Devices

Analog Devices Inc. (ADI) is one of the leading companies in the areas of integrated circuit (IC) design, manufacturing, testing, and marketing. ADI is known for their high-performance semiconductor solutions which enable customers to create innovative systems that solve critical challenges. The company has over 40 years of experience in the industry and has been consistently recognized as an industry leader for its innovation as well as its commitment to quality products and services. They have garnered numerous awards throughout the years including awards from Gartner Magic Quadrant for Industrial IoT Platforms; Frost & Sullivan’s Global Product Leadership Award; and various awards relating to automotive safety technology such as JESD209-3 Automotive Grade Certifications from AEC-Q100.

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Management team

CEO

Vincent Roche

Interim CFO

James Mollica

CAO

Michael Sondel

Manufacturer fab locations 5

Fab name Location Fab Initiation Wafer Capacity

Limerick Fab

Fabrication

Fab Initiation

1977

Ireland

Limerick

Wafer Capacity

30,000

1977

30,000

Hillview Fab

Fabrication

Fab Initiation

2001

USA

Milpitas

Wafer Capacity

15,000

2001

15,000

Wilmington Fab

Fabrication

Fab Initiation

1967

USA

Wilmington

Wafer Capacity

50,000

1967

50,000

Camas Fab

Fabrication

Fab Initiation

1997

USA

Camas

Wafer Capacity

18,000

1997

18,000

Beaverton-Portland

Fabrication

Fab Initiation

1987

USA

Beaverton

Wafer Capacity

14,000

1987

14,000

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